• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.319-320
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• 2012

• Proceedings of the Optical Society of Korea Conference
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• 2009.10a
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• pp.310-311
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.119-120
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• 2011

• Journal of the Korean Society for Precision Engineering
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• v.33 no.10
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• pp.845-850
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• 2016

A direct laser lithography system is widely used to fabricate various types of DOEs (Diffractive Optical Elements) including lenses made as CGH (Computer Generated Hologram). However, a parametric study that uniformly and precisely fabricates the diffractive patterns on a large area (up to $200mm{\times}200mm$) has not yet been reported. In this paper, four parameters (Focal Position Error, Intensity Variation of the Lithographic Beam, Patterning Speed, and Etching Time) were considered for stabilization of the direct laser lithography system, and the experimental results were presented.

• International Journal of Precision Engineering and Manufacturing
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• v.7 no.3
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• pp.56-59
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• 2006

UV laser micromachining is generally used to create microstructures for micro-products through a sequence of lithography-based photo-patterning steps. However, the micromachining process is not suitable for rapid realization of complex 3D micro-products because it depends on worker experience. In addition, the cost and time required to make many masks are excessive. In this paper, a more effective and rapid micro-manufacturing process, which was developed based on laser micromachining, is proposed for fabricating micro-products directly using UV laser ablation and phase-change filling. The filling process is useful for holding the micro-products during the ablation step. The proposed rapid micro-manufacturing process was demonstrated experimentally by fabricating 3D micro-products from functional UV-sensitive polymers using 3D CAD data.

• Laser Solutions
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• v.10 no.4
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• pp.18-22
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• 2007

In this paper, we suggested the femtosecond laser processing using the mask which makes Gaussian spatial beam distribution to a normalized distribution by Fresenel diffraction. Holography pattern of the size of $320{\times}320{\mu}m^2$ on the Cr thin film on glass substrate with a pixel size of $5{\times}5{\mu}m^2$ was fabricated according to the pattern generated by the iterative Fourier transform algorithm(IFTA) algorithm. We analysed the damage threshold with an assumption the power distribution as Gaussian profile as 45 $mJ/cm^2$. The regenerated image of letters through the diffractive pattern was well recognized at the screen.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.4
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• pp.77-83
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• 2022

Amorphous alloys exhibit excellent mechanical properties; therefore, application technology development is being attempted in various fields. However, industrial use of application technology is limited owing to the limitations in fabrication. In this study, micropattern fabrication of an amorphous alloy was conducted using laser beam machining. Although microhole fabrication is possible without the deformation of the amorphous phase through nanosecond pulsed laser beam machining, there are limitations in the generation of recast layers and spatters. In cover plate laser beam machining (c-LBM), a cover plate is used to reduce the thermal deformation and processing area. Therefore, it is possible to fabricate holes at the level of several micrometers. In this study, it was confirmed that recast layers are hardly generated in c-LBM. Furthermore, square-shaped micropatterns were successfully fabricated using c-LBM.

• Laser Solutions
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• v.16 no.4
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• pp.12-16
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• 2013

For mass production of electronic devices, the processing of the printing roll is one of the most important key technologies for printed electronics technology. A roll of printing process, the gravure printing that is used to print the electronic device is most often used. The indirect laser processing has been used in order to produce printing roll for gravure printing. It consists of the following processing that is coating of photo polymer or black lacquer on the surface of printing roll, pattering using a laser beam and etching process. In this study, we have carried out study on the coating and etching for $25{\mu}m$ line width on the printing roll. To do this goals, a $4{\mu}m$ coating thickness and 20% average coating thickness of the coating homogeneity of variance is performed. The factors to determine the thickness and homogeneity are a viscosity of coating solution, the liquid injection, the number of injection, feed rate, rotational speed, and the like. After the laser patterning, a line width of $25{\mu}m$ or less was confirmed to be processed through etching and the chromium plating process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.1080-1083
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• 2002

In this paper, we have studied with regard to the use of lasers for modifying the surface properties of silicon in order to improve it's wettability and adhesion characteristics. Using an Nd:YAG pulse laser, the wettability and adhesion characteristics of silicon surface have been developed by an Nd:YAG pulse laser. It was found that the laser treatment of silicon surfaces modified the surface energy. In the result of wetting experiments, by the sessile drop technique using the distilled water, wetting characteristic of silicon after the laser irradiation shows a decreased value of the contact angle. In case of the laser treated silicon surface, laser direct writing of copper lines has been achieved by pyrolytic decomposition of copper formate films$(Cu(HCOO)_2{\cdot}4H_2Q)$, using a focused $Ar^+$ laser beam$(\lambda=514.5nm)$ on the silicon substrates. The deposited patterns were measured by energy dispersive X-ray(EDX), Scanning Electron Microscopy(SEM) and surface profiler($\alpha$-step) to examine the cross section of deposited copper lines and linewidth.

• Laser Solutions
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• v.11 no.1
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• pp.1-6
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• 2008

We proposed new light guide panel (LGP) fabrication method exploiting laser-processed inner scatterers and surface pattern. The proposed method has achieved LGP performance improvement in both brightness and uniformity. The inner scatterers and surface pattern of grid type were fabricated with a 2nd harmonic Nd:YAG pulse laser engraving system and a $CO_2$ laser scanning system, respectively. In the implementation of LGP, inner scatterers was arranged in accordance with linear or curved pattern with changing density and surface pattern was engraved on the surface of an inner-scatterers embedded LGP. The increase of scatterers' density and the use of surface patterns in both linear and curved pattern provided high luminance and uniformity enhancement. While thecurved pattern incorporated with increased scatterers' density and surface patterns yielded brightness improvement with preserving good uniformity, the linear pattern showed highly localized brightness near the light entrance of the LGP. We can also observe that the uniformity was mainly determined by pattern of inner scatterers, and the brightness was improved by the higher density and the utilization of surface patterns. From the results, the use of laser-processed inner and surface patterns can be a potential alternative for efficient and simple LGP fabrication method.