• Laser Solutions
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• v.9 no.3
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• pp.7-13
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• 2006

Auto focusing system to find optimized focal position of laser beam used for material process has been investigated by using fiber confocal method. Wavelength of laser diode (LD) and diameter of single-mode fiber are 780nm and $5.3{\mu}m$, respectively. Intensity distributions of beam reflected from the surface of mirror and silicon bare wafer have been observed in a gaussian form. Experimental results show that focal position obtained by LD is shifted from one observed from surface scribed by laser about $80{\mu}m$. It is due to the difference of wavelength and each divergence of between LD and laser used for material process. It is confirmed that auto focusing control system through position calibration has operated steadily.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.561-569
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• 2002

Laser has been called a "Quantum Machine" because of its mechanism of generation since the development on July 7,1960.by T.H.Maiman. We can now use this machine as a tool for manufacturing in industries. At present, 45kW CO2 laser, 10kW Nd:YAG laser, 6kW LD pumped YAG laser and 4kW direct diode laser facilities are available for welding a heavy steel plate of 40mm in thickness and for cutting metals at high speed of 140m/min. Laser Materials Processing is no longer a scientific curiosity but a modern tool in industries. Lasers in manufacturing sector are currently used in welding, cutting, drilling, cladding, marking, cleaning, micro-machining and forming. Recently, high power laser diode, 10kW LD pumped YAG laser, 700W fiber laser and excimer laser have been developed in the industrialized countries. As a result of large numbers of research and developments, the modem laser materials processing has been realized and used in all kinds of industries now. In the present paper, metallurgical studies on laser materials processing such as porosity formation, hot cracking and the joint performances of steels and aluminum alloys and dissimilar joint are discussed after the introduction of laser facilities and laser applications in industries such as automotive industry, electronics industry, and steel making industry. The wave towards the use of laser materials processing and its penetration into many industries has started in many countries now. Especially, development of high power/quality diode laser will be accelerate the introduction of this magnificent tool, because of the high efficiency of about 50%, long life time and compact.

• Laser Solutions
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• v.10 no.1
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• pp.11-17
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• 2007

We presented the proper laser processing conditions for the capillary line marking, which could be applied for the fabrication of injection needles. With changing the parameters such as lamp current, duty cycle and beam amplification factor of beam expander, we evaluated the processing performance considering amount of dross, processing efficiency and processed linewidth in the sample. We could carry out the proper line marking at the condition of 70% lamp current, duty cycle of 7-10% and 6-times amplification of beam diameter. To perform efficient line processing, the utilization of duty cycle of 12% at 80% lamp current was also preferred.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2005.06a
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• pp.91-96
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• 2005

• Korean Journal of Metals and Materials
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• v.50 no.3
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• pp.191-200
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• 2012

The purpose of this paper is to review the state of laser processing technology using metal powders. In recent years, a series of research and development efforts have been undertaken worldwide to develop laser processing technologies to fabricate metal-based parts. Layered manufacturing by the laser melting process is gaining ground for use in manufacturing rapid prototypes (RP), tools (RT) and functional end products. Selective laser sintering / melting (SLS/SLM) is one of the most rapidly growing rapid prototyping techniques. This is mainly due to the processes's suitability for almost any materials, including polymers, metals, ceramics and many types of composites. The interaction between the laser beam and the powder material used in the laser melting process is one of the dominant phenomena defining feasibility and quality. In the case of SLS, the powder is not fully melted during laser scanning, therefore the SLS-processed parts are not fully dense and have relatively low strength. To overcome this disadvantage, SLM and laser cladding (LC) processes have been used to enable full melting of the powder. Further studies on the laser processing technology will be continued due to the many potential applications that the technology offers.

• Journal of the Korean Society of Industry Convergence
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• v.26 no.4_1
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• pp.517-527
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• 2023

Many techniques have been proposed and investigated for microlens array manufacturing in three-dimensional (3D) structures. We present fabricating a microlens array using selective laser etching and a CO₂ laser. The femtosecond laser was employed to produce multiple micro-cracks that comprise the predesigned 3D structure. Subsequently, the wet etching process with a KOH solution was used to produce the primary microlens array structures. To polish the nonoptical surface to the optical surface, we performed reflow postprocessing using a CO₂ laser. We confirmed that the micro lens array can be manufactured in three primary shapes (cone, pyramid and hemisphere). Compared to our previous study, the processing time required for laser processing was reduced from approximately 1 hour to less than 30 seconds using the proposed processing method. Therefore, micro lens arrays can be manufactured using our processing method and can be applied to mass productionon large surface areas.

• Proceedings of the Korean Society of Laser Processing Conference
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• 1998.05a
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• pp.46-47
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• 1998

• Proceedings of the Korean Society of Laser Processing Conference
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• 1998.05a
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• pp.51-53
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• 1998

• Current Optics and Photonics
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• v.3 no.5
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• pp.451-457
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• 2019

Laser processing using holograms can greatly improve processing speed, by spatially distributing the laser energy on the target material. However, it is difficult to reconstruct an image with arrays of closely spaced spots for laser processing, because the specklelike interference pattern prevents the spots from getting close to each other. To resolve this problem, a line target was divided in two, reconstructed with orthogonally polarized beams, and then superposed. Their optical reconstruction was performed by computer-generated holograms and a pulsed laser. With this method, we performed two-dimensional (2D) laser drilling of polyimide film, with a kerf width of $20{\mu}m$ and a total processing length of 20 mm.

• Laser Solutions
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• v.16 no.4
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• pp.12-16
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• 2013

For mass production of electronic devices, the processing of the printing roll is one of the most important key technologies for printed electronics technology. A roll of printing process, the gravure printing that is used to print the electronic device is most often used. The indirect laser processing has been used in order to produce printing roll for gravure printing. It consists of the following processing that is coating of photo polymer or black lacquer on the surface of printing roll, pattering using a laser beam and etching process. In this study, we have carried out study on the coating and etching for $25{\mu}m$ line width on the printing roll. To do this goals, a $4{\mu}m$ coating thickness and 20% average coating thickness of the coating homogeneity of variance is performed. The factors to determine the thickness and homogeneity are a viscosity of coating solution, the liquid injection, the number of injection, feed rate, rotational speed, and the like. After the laser patterning, a line width of $25{\mu}m$ or less was confirmed to be processed through etching and the chromium plating process.