• 대한치과기공학회지
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• 제30권1호
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• pp.131-139
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• 2008

It's very important to find the most appropriate adhesion technique available, taking into consideration factors such as biocompatibility, non-corrosiveness, mechanical stability, etc. Laser welding is the best choice you can make because from a mechanical viewpoint, a laser welded surface has better particle structure than does a casted particle structure. Furthermore, it requires no additional material and the same metal alloy which is used when casting can be used. Therefore, the resulting mixture will consist of a single alloy, instead of utilizing different alloy combinations. Another benefit is the low economic cost. The most beneficial aspects of laser welding is that it is biologicallly friendlly, doesn't require soldering, can fuse different metal alloys together, and can weld on heat-sensitive spots(E.g. around resin or ceramic). A consistent strong pulse is possible. This technique is capable of welding on master models and creates accurate welds. It is capable of due to its stronger, non-corrosive microscope, which allows 25times magnification during the soldering process. This is possible because of its high stability from the tiny particle structure.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1998년도 추계학술대회 논문집
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• pp.37-40
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• 1998

(Ba.Sr)TiO$_3$(BST) ceramics were fabricated with different Ba/Sr ratios and the str dielectric properties of the BST bulk ceramics were investigated. As the Ba/sr ratios dielectric constant decreased. (Ba$_{0.7}$Sr$_{0.3}$)TiO$_3$ (BST(70/30)) showed a maximum dielec value of $\varepsilon$$_{r}$=8.856, this showed that the decrease of Ba/Sr ratios had made BST thin dielectrics. Targets were fabricated and made into film by PLD process and the thin film by PLD process have good stoichiometry with the targets.rgets.

• 한국전기전자재료학회논문지
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• 제30권2호
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• pp.126-132
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• 2017

The power conversion efficiency of organic polymer solar cells was enhanced by introducing a ferroelectric polymer layer at the interface between active layer and metal electrode. The power conversion efficiency was increased by 50% through the enhancement of the open circuit voltage. To investigate the role of the ferroelectric layer on the dissociation process of the excitons, non-radiative portion of the exciton decay was directly measured by using photoacoustic technique. The results show that the ferroelectric nature of the buffer layer does not play any roles on the dissociation process of the excitons, which indicates the efficiency enhancement is not due to the ferroelectricity of the buffer layer.

• 한국생산제조학회지
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• 제20권2호
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• pp.145-150
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• 2011

There is problem to reduce the car body weight for improving fuel consumption and $CO_2$ generation. As one of the solution, the multi material car body concept using aluminum alloys and high strength steels is proposed recently. Therefore, new welding processes by which these dissimilar material can be joined in high reliability and productivity are demanded. Laser spot welding was developed for joining of dissimilar metals. In the present work, Laser spot welding of zinc coated steel and aluminum alloy was investigated, and the process parameters were studied. Otherwise, the influences of process parameters on the weldability, the formation of intermetallic compound layer and the mechanical properties have been investigated. When intermetallic compound layer thickness was more than 1mm, specimen was failure in the interface.

• ETRI Journal
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• 제46권2호
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• pp.347-359
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• 2024

A simultaneous transfer and bonding (SITRAB) process using areal laser irradiation is introduced for high-yield and cost-effective production of mini- or micro-light-emitting diode (LED) display panels. SITRAB materials are special epoxy-based solvent-free pastes. Three types of pot life are studied to obtain a convenient SITRAB process: Room temperature pot life (RPL), stage pot life (SPL), and laser pot life (LPL). In this study, the RPL was found to be 1.2 times the starting viscosity at 25℃, and the SPL was defined as the time the solder can be wetted by the SITRAB paste at given stage temperatures of 80℃, 90℃, and 100℃. The LPL, on the other hand, was referred to as the number of areal laser irradiations for the tiling process for red, green, and blue LEDs at the given stage temperatures. The process windows of SPL and LPL were identified based on their critical time and conversion requirements for good solder wetting. The measured RPL and SPL at the stage temperature of 80℃ were 6 days and 8 h, respectively, and the LPL was more than six at these stage temperatures.

• 한국레이저가공학회지
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• 제6권1호
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• pp.9-16
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• 2003

Micromachining using the DPSS 3rd Harmonic Laser (355nm) has outstanding advantages as a UV source in comparison with Excimer lasers in various aspects such as maintenance cost, maskless machining, high repetition rate and so on. It also has the greater absorptivity of many materials in contrast to other IR sources. In this paper, the process for micro-drilling of blind hole in Cu/PI/Cu substrate with the DPSS UV laser and the scanning device is investigated by the experimental methods. It is known that there is a large gap between the ablation threshold of copper and that of PI. We use the Archimedes spiral path for the blind hole with different energy densities to ablate the different material. Finally, the blind via hole of diameter 100$\mu\textrm{m}$ and 50$\mu\textrm{m}$ was drilled.

• 한국정밀공학회지
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• 제32권12호
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• pp.1023-1029
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• 2015

Laser-assisted machining (LAM) is one of the most effective methods for enhancing the machinability of difficult-to-cut materials, such as titanium alloys and various ceramics, and has been studied by many researchers. LAM is a method that facilitates machining by softening a workpiece using a laser heat source. The advantages of the LAM process are decreases in tool wear, cutting force, and surface roughness. However, when the material is over-heated, melting or burning can occur. This study analyzed the heat source distribution with regard to overlapping of preheating on the laser heating path with an acute angle, a right angle and obtuse angles. Then, a power reduction method was proposed to reduce the melting and burning of the workpiece.

• Journal of Welding and Joining
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• 제19권5호
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• pp.481-485
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• 2001

Laser cladding processing allows rapid transfer of heat to the material being processed with minimum conduction into base metal. The effect of $CO_2$ laser cladding with high viscosity mixed powders was investigated. High viscosity mixed powder consists of bronze powder and flux that is used at a high temperature condition. The mixed powder has a high viscosity that it can be easily pasted over a curved or slope substrate. The device for mixed powder was designed and manufactured. It consists of the high viscosity mixed powder feeding system, the preheating system and the shielding gas system which prevents the clad layer from being oxidized. The results of experiment indicated that the feed rate of high viscosity mixed powder was important for later cladding with mixed powder feeding. The high viscosity mixed powder and substrate must be preheated to prevent porosity from breaking at the clad layer. The experimental result shows that the high viscosity mixed can be applied for laser cladding process.

• 한국레이저가공학회지
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• 제2권1호
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• pp.51-60
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• 1999

In this paper, weldability and formability of Tailored-Blank (TB) and the structural impact testing of bump beam were investigated to apply TB to automobile bumper beam. The optimal $CO_2$ laser welding condition for TB of SPFC and SPRC steel plates with different thicknesses was obtained. Before welding, the cross section of butt joint was prepared only by shearing without milling process. Real type bump beam was produced by two kind of forming processes such as roll-forming and press-forming, and the good formability of TB was obtained. Impact test results of bump by using pendulum and barrier were satisfied the impact regulation of bump. Finally. It may be confirmed that laser welded TB is well-balanced material in both weight reduction and production cost of automobile bump.

• 마이크로전자및패키징학회지
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• 제21권2호
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• pp.53-57
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• 2014

Thin glass (< 100 microns) is a promising material from which advanced interposers for high density electrical interconnects for 2.5D chip packaging can be produced. But thin glass is extremely brittle, so mechanical micromachining to create through glass vias (TGVs) is particularly challenging. In this article we show how laser processing using deep UV excimer lasers at a wavelength of 193 nm provides a viable solution capable of drilling dense patterns of TGVs with high hole counts. Based on mask illumination, this method supports parallel drilling of up over 1,000 through vias in 30 to $100{\mu}m$ thin glass sheets. (We also briefly discuss that ultrafast lasers are an excellent alternative for laser drilling of TGVs at lower pattern densities.) We present data showing that this process can deliver the requisite hole quality and can readily achieve future-proof TGV diameters as small $10{\mu}m$ together with a corresponding reduction in pitch size.