• Korean Chemical Engineering Research
• /
• v.62 no.1
• /
• pp.105-111
• /
• 2024

The SLA (Stereolithography Apparatus) method is a type of 3D printing technique predicated on the transformation of liquid photocurable resin into a solid form through UV laser exposure, and its application is increasing in various fields. In this study, we conducted research to enhance the hydrophobicity and transparency of SLA 3D printing surfaces for microfluidic system production. The enhancement of surface hydrophobicity in SLA outputs was attainable through the application of hydrophobic coating methods, but the coating durability under different conditions varied depending on the type of hydrophobic coating. Additionally, to simultaneously achieve the required transparency and hydrophobic properties for the fabrication of microfluidic systems, we applied hydrophobic coatings to the proposed transparency enhancement method from prior research and compared the changes in contact angles. Teflon coating was proposed as a suitable hydrophobic coating method for the fabrication of microfluidic systems, given its excellent transparency and high coating durability in various environmental conditions, in comparison to titanium dioxide coating. Finally, we produced an Electrophoresis of Charged Droplet (ECD) chip, one of the digital microfluidics systems, using SLA 3D printing with the proposed Teflon coating method (Fluoropel 800). Droplet manipulation was successfully demonstrated with the fabricated chip, confirming the potential application of SLA 3D printing technology in the production of microfluidic systems.

• Journal of the Microelectronics and Packaging Society
• /
• v.15 no.3
• /
• pp.53-58
• /
• 2008

In this study, we fabricated embedded IC (Double Pole Double throw switch chip) polymer substrate and evaluate it for 2.4 GHz WiFi application. The switch chips were laminated using FR4 and ABF(Ajinomoto build up film) as dielectric layer. The embedded DPDT chip substrate were interconnected by laser via and Cu pattern plating process. DSC(Differenntial Scanning Calorimetry) analysis and SEM image was employed to calculate the amount of curing and examine surface roughness for optimization of chip embedding process. ABF showed maximum peel strength with Cu layer when the procuring was $80\sim90%$ completed and DPDT chip was laminated in a polymer substrate without void. An embedded chip substrate and wire-bonded chip on substrate were designed and fabricated. The characteristics of two modules were measured by s-parameters (S11; return loss and S21; insertion loss). Insertion loss is less than 0.55 dB in two presented embedded chip board and wire-bonded chip board. Return loss of an embedded chip board is better than 25 dB up to 6 GHz frequency range, whereas return loss of wire-bonding chip board is worse than 20 dB above 2.4 GHz frequency.

• Journal of Korea Technology Innovation Society
• /
• v.14 no.4
• /
• pp.965-982
• /
• 2011

Currently, dependency of natural and energy resources on world economy may not be more serious than any before increasing the uncertainty of Korea's national economy, especially as China uses unexpectedly fast glowing portion of world resources. Due to insufficient natural resources and unmatured renewable energy system, it is very important for Korea to secure the energy sources not only for national prosperity but also security for the future. In this regard, importance and necessity of nuclear energy as a major electric power source in Korea are in need to be emphasized. Korea currently imports all the necessary enriched uranium for fabrication of nuclear fuel from abroad. Thus, it is extremely important to establish a secured supply system for enriched uranium regardless of the global political unstability as well as economic fluctuation. In order to build the nuclear fuel procurement system, it is required to analyze the global market status, current enrichment service systems, and the future technology under development. For this purpose, this study comparatively analyzes the laser based advanced technology for uranium enrichment under development in the United States, which is assumed to be 2~3 times more economically viable than currently available technologies.

• Korean Journal of Optics and Photonics
• /
• v.5 no.3
• /
• pp.423-430
• /
• 1994

We designed and fabricated the single mode fiber pigtailed DFB-LD module for 2.5 Gbps optical communication system. In the design of the DFB-LD module, we made the module divided into two parts of inner sub-module and outer 14-pin butterfly package and cylindrical shaped sub-module contain quasi confocal 2 lens system including optical isolator and electrical connection between these parts via hybrid substrate of bias T circuit. Laser welding was used to assemble the sub-module which requires accurate fixing between optical elements. The fabricated DFB-LD module showed optical coupling efficiency of 20% and - 3 dB small signal response of more than 2.6 GHz. We confirmed mechanical reliability of the module by temperature cycle test where the tested module exhibit optical power fluctuation of less than 10%. Finally we evaluated the performance of the fabricated DFB-LD module as light source of 2.5 Gbps optical communication system, sensitivity of - 30.2 dBm was obtained through 47 km optical fiber transmission under the criterion of $1\times10^{-10}$ BER and transmission penalties were 1.5 dB caused by extinction ratio and 1.0 dB caused by chromatic dispersion of normal single mode fiber. fiber.

• Journal of the Korean Vacuum Society
• /
• v.21 no.4
• /
• pp.205-211
• /
• 2012

We investigated the optical and hydrophobic properties of the deposited silver (Ag) zinc oxide (ZnO) nanorods (NRs) on flexible indium tin oxide (ITO) coated polyethylene terephthalate (PET) substrates (i.e., ITO/PET). The ZnO NRs were grown by an electrochemical deposition using a sputtered ZnO seed layer and the Ag was deposited by using a thermal evaporator. For comparison, the same fabrication process was carried out on the bare ITO/PET without ZnO NRAs. Due to the discrete surface of ZnO NRs, the deposited Ag was formed as nano-scale particles, while the Ag became film-like for bare ITO/PET. In order to control the size and amount of Ag particles, the Ag deposition time was changed from 100 to 600 s. When the deposition time was increased, the Ag particles became larger and denser, and the absorptance was increased. This enhanced absorptance may be due to the localized surface plasmon resonance of Ag particles. Furthermore, the relatively high hydrophobicity was observed for the deposited Ag on the ZnO NRs/ITO/PET. These improved optical and surface properties are expected to be useful for flexible photovoltaic and optoelectronic devices.

• Journal of the Microelectronics and Packaging Society
• /
• v.28 no.1
• /
• pp.55-60
• /
• 2021

In order to produce wearable displays with high adhesion while maintaining flexible characteristics, the adhesive method using electro plating method was carried out. Laser lift-off (LLO) transcription was also used to remove sapphire substrates from LEDs bonded to fibers. Afterwards, the SEM and EDS data of the sample, which conducted the adhesion method using electro plating, confirmed that copper actually grows through the lattice of the fiber fabric to secure the light source and fiber. The adhesion characteristics of copper were checked using Universal testing machine (UTM). After plating adhesion, the characteristics of the LLO transcription process completed and the LED without the transcription process were compared using probe station. The electroluminescence (EL) according to the enhanced current was measured to check the characteristics of the light source after the process. As the current increases, the temperature rises and the bandgap decreases, so it was confirmed that the spectrum shifted. In addition, the change in the electrical characteristics of the samples according to the radius change is confirmed using probe station. The radius strain also had mechanical strength that copper could withstand bending stress, so the Vf variation was measured below 6%. Based on these results, it is expected that it will be applied to batteries, catalysts, and solar cells that require flexibility as well as wearable displays, contributing to the development of wearable devices.

• Journal of Korea Foundry Society
• /
• v.20 no.5
• /
• pp.330-335
• /
• 2000

Functional metal prototypes are often required in numerous industrial applications. These components are typically needed in the early stage of a project to determine form, fit and function. Recent R/P(Rapid Prototyping) part are made of soft materials such as plastics, wax, paper, these master models cannot be employed durable test in real harsh working environment. Parts by direct metal rapid tooling method, such as laser sintering, by now are hard to get net shape, pores of the green parts of powder casting method must be infiltrated to get proper strength as tool, and new type of 3D direct tooling system combining fabrication welding arc and cutting process is reported. But a system which can build directly 3D parts of high performance functional material as metal park would get long period of system development, massive investment and other serious obstacles, such as patent. In this paper, through the rapid tooling process as silicon rubber molding using R/P master model, and fabricate wax pattern in that silicon rubber mold using vacuum casting method, then we translated the wax patterns to numerous metal tool prototypes by new investment casting process combined conventional investment casting with rapid prototyping & rapid tooling process. With this wax-injection-mold-free investment casting, we developed new investment casting process of fabricating numerous functional metal prototypes from one master model, combined 3-D CAD, R/P and conventional investment casting and tried to expect net shape measuring total dimension shrinkage from R/P pare to metal part.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.11a
• /
• pp.131-131
• /
• 2009

This paper describes the fabrication and characteristics of polycrystalline (poly) 3C-SiC microresonators with $3{\times}10^{17}{\sim}1{\times}10^{19}cm^{-3}$ in-situ N-doping concentrations. In this work, the crystallinity, carrier concentration and surface morphology of the grown thin films were evaluated by X-ray diffraction (XRD), scanning electron microscopy (SEM) and atomic force microscopy (AFM). The 1.2 ${\mu}m$ thick cantilvers and the 0.4 ${\mu}m$ thick doubly-clamped beam microresonators with various lengths were implemented using in-situ doping poly 3C-SiC thin films. The characteristics of the poly 3C-SiC microresonators were evaluated using quartz and a laser vibrometer under vacuum at room temperature. The resonant frequencies of the SiC microresonators decreased with doping concentrations owing to the reduction of the Young's modulus of the poly 3C-SiC thin films. It was confirmed that the resonant frequencies of the poly 3C-SiC microresonators are controllable by adjusting the doping concentrations.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.11a
• /
• pp.130-130
• /
• 2009

This paper describes the temperature characteristics of polycrystalline 3C-SiC micro resonators. The 1.2 ${\mu}m$ and 0.4 ${\mu}m$ thick polycrystalline 3C-SiC cantilever and doubly clamped beam resonators with 60 ~ 100 ${\mu}m$ lengths were fabricated using a surface micromachining technique. Polycrystalline 3C-SiC micro resonators were actuated by piezoelectric element and their fundamental resonance was measured by a laser vibrometer in vacuum at temperature range of $25{\sim}200^{\circ}C$. The TCF(Temperature Coefficient of Frequency) of 60, 80 and 100 ${\mu}m$ long cantilever resonators were -9.79, -7.72 and -8.0 $ppm/^{\circ}C$. On the other hand, TCF of 60, 80 and 100 ${\mu}m$ long doubly clamped beam resonators were -15.74, -12.55 and -8.35 $ppm/^{\circ}C$. Therefore, polycrystalline 3C-SiC resonators are suitable with RF MEMS devices and bio/chemical sensor applications in harsh environments.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.33 no.1
• /
• pp.10-15
• /
• 2020

Recently, with the increase in the use of urban solar power, solar modules are required to produce high power in limited areas. In this report, we proposed the fabrication of a high-power photovoltaic module using shingles technology, and developed accurate string characteristic simulations based on circuit modeling. By comparing the resistance components between the interconnected cells and the cell strips, the ECA resistance was determined to be 0.003 Ω. Based on the equivalent circuit of the modeled shingled string, string simulation was performed according to the type of cell strip. As a result, it was determined that the cell efficiency of the 4-cell strip was the highest at 19.66%, but the efficiency of the string simulated with the 6-cell strip was the highest at 20.48% in the string unit.