• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2002.11a
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• pp.157-160
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• 2002

In this paper, a novel lumped equivalent circuit for a conventional parallel directional coupler is proposed. The equivalent circuit and design formula for the presented lumped element coupler is derived based on the even-and odd-mode properties of a parallel-coupled line. By using the derived design formula, we have designed the 3㏈ and 10㏈ lumped element directional couplers at the center frequency of 100Mhz. Furthermore, a chip type directional coupler has been designed to fabricate with multilayer configurations by employing the Low Temperature CofiredCeramic (LTCC) process. Designed chip-type directional coupler has a 10㏈-coupling value at the center frequency of 2㎓. Excellent agreements between simulations and measurements on the designed directional couplers show the validity of this paper

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1209-1210
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• 2006

A novel sintering process is proposed for bonding of $BaTiO_3$ and $Al_2O_3$ layers. Common commercial glass was used and infilterated among filler particles. As the kind of commercial glass, the phenomenon of the infilteration is different. Although Sud-1140 glass forms a glass/filler composite, it is not completely infilterated into the filler particles at $900^{\circ}C$. However as the increase of sintering temperature the infilteration of glass was improved. In this study, GA-1 and GA-12 glasses were infilterated the more than Sud-1140 glass. However, they are reacted by $BaTiO_3$ layer. The results of the experiment show that constrained sintering and the co-firing of the different materials were possible for glass infilteration using Sud-1140 glass at $1000^{\circ}C$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.1
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• pp.33-37
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• 2013

The properties of LTCC green sheets formed by the MLS-22 powder of NEG Inc. were investigated for acrylic binders with different PVB and Tg in the variation of temperature. The elongation of the green sheets showed large variation depending on the temperature, and was rapidly decreased near the Tg of the sheets. With the increase of the ratio of plasticizer/binder (P/B), large elongation of the sheets was observed due to the decrease of the Tg. In the stacking process of the multilayer ceramic, the optimal control of the temperature is highly required depending on the Tg of the binder and the ratio of P/Buniform coating.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.410-413
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• 2001

In this paper, we present results of this that design of the multi-layer VCO(Voltage Controlled Oscillator), which is composed of the resonation circuit and the oscillation circuit, using EM simulator and nonlinear RF circuit simulator. EM simulator is used for acquiring EM(Electromagnetic) characteristics of conductor pattern as well as designing multi-layer VCO, Acquired EM characteristics of the circuit pattern was used like real components at nonlinear RF circuit simulator. Finally VCO is simulated at nonlinear RF circuit simulator. The material for the circuit pattern was Ag and the dielectric was Dupont ＃9599, which is applied for LTCC process. The structure is constructed with 4 conducting layer. Simulated results showed that the output level was about 1[dBm], the phase noise was 102 [dBc/Hz] at 30[kHz] offset frequency, the harmonics -8dBc, and the control voltage sensitivity of 30[MHz/V] with a DC current consumption of 10[mA].

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.7
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• pp.647-655
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• 2003

Commonly used SAW duplexers have a difficulty on manufacture so that a transmission line is printed on the package or an LTCC multi-layer is needed because a quarter-wave transmission line which is a kind of an isolation network is applied to the SAW duplexers. In this study, new structures of one chip type SAW duplexers are proposed. In the proposed structure, Tx and Rx SAW ladder filters and isolation networks are located on a single 36LiTaO$_3$ piezoelectric substrate. The manufacture process is very simple than commonly used product. It is possible to improve tile performance by means of optimizing the micro-strip line lumped elements. It is easy to integrate and modulate with other surrounding components. The optimal design techniques can be applied to other kind of multi-port devices.

• Proceedings of the KIEE Conference
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• 2004.07c
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• pp.2058-2060
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• 2004

In this paper, circular polarized antennas of Tx 30GHz and Rx 20GHz are implemented in LTCC process. Tx antenna has a circular patch structure and Rx antenna has a ring patch structure. The feeding line of Tx antenna is placed in the center hole of Rx ring patch antenna which is printed under Tx circular patch antenna layer. It makes antenna size smaller. Tx antenna's return loss in under -10dB level from 30GHz to 31GHz and Rx antenna is under -10 dB from 20GHz to 21GHz. The isolation between two antennas is less than -20dB. Axial ratio is less than 3dB though out each band.

• Proceedings of the KIEE Conference
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• 2001.11a
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• pp.96-99
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• 2001

In this paper, we present the simulation results of the multi-layer VCO(Voltage Controlled Oscillator), which is composed of the resonator, the oscillator and the buffer circuit. using EM simulator and nonlinear RF circuit simulator. EM simulator is used for obtaining the EM(Electromagnetic) characteristics of the conductor pattern as well as designing the multi-layer VCO. Obtained EM characteristics were used as real components in nonlinear RF circuit simulation. Finally the overall VCO was simulated using the nonlinear RF circuit simulator. The material for the circuit pattern was Ag and the dielectric was DuPont 951AT, which will be applied for LTCC process. The structure is constructed with 4 conducting layer. Simulated results showed that the output level was about 4.5[dBm], the phase noise was -104[dBc/Hz] at 30[kHz] offset frequency, the harmonics -8dBc, and the control voltage sensitivity of 30[MHz/V] with a DC current consumption of 9.5[mA]. The size of VCO is $6{\times}9{\times}2mm$(0.11[cc]).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.81-81
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• 2009

Non-sintered Alumina films were fabricated via inkjet printing processes without a high temperature sintering process. The packing density of these inkjet-printed alumina films measured around 60%. Polymer resin was infiltrated thru these non-sintered films in order to fill out the 40% of voids constituting the rest of the inkjet-printed films. The concept of inkjet-printed Alumina-Resin hybrid materials was designed in order to be applicable to the ceramic package substrates for 3D-system module integration which may possibly substitute LTCC-based 3D module integration. So, the dielectric properties of these inkjet-printed $Al_2O_3$ hybridmaterialsareofourgreatinterest. We have measured dielectric constant and dissipation factor of the inkjet-printed $Al_2O_3$-resinhybridfilmsbyvaryingtheamountofresininfiltratedthruthe$Al_2O_3$films.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.6
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• pp.492-498
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• 2002

In this paper, we present the simulation results of multi-layer VCO(voltage controlled oscillator), which is composed of resonator, oscillator, and buffer circuit, using EM simulator and nonlinear RF circuit simulator. EM simulator is used for obtaining the EM(Electromagnetic) characteristics of conductor pattern as well as designing the multi-layer VCO. Obtained EM characteristics were used as real components in nonlinear RF circuit simulation. Finally the overall VCO was simulated by the nonlinear RF circuit simulator. The material for the circuit pattern was Ag and the dielectric was Dupont 951AT, which will be applied for LTCC process. The structure of multi-layer VCO is constructed with 4 conducting layer. Simulated results showed that the output level was about 4.5 [dBm], the phase noise was -104 [dBc/Hz] at 30 [kHz] offset frequency, the harmonics -8 dBc, and the control voltage sensitivity of 30 [MHz/V] with a DC current consumption of 9.5 [mA]. The size of VCO is $6{\times}9{\times}2 mm$(0.11 [cc]).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.653-656
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• 2002

In this paper, we present the simulation results of multi-layer VCO(voltage controlled oscillator), which is composed of resonator, oscillator, and buffer circuit, using EM simulator and nonlinear RF circuit simulator. EM simulator is used for obtaining the EM(Electromagnetic) characteristics of conductor pattern as well as designing the multi-layer VCO. Obtained EM characteristics were used as real components in nonlinear RF circuit simulation. Finally the overall VCO was simulated by the nonlinear RF circuit simulator. The material for the circuit pattern was Ag and the dielectric was DuPont 951AT, which will be applied for LTCC process. The structure of multi-layer VCO is constructed with 4 conducting layer. Simulated results showed that the output level was about 4.5 [dBm], the phase noise was -104 [dBc/Hz] at 30 [kHz] offset frequency, the harmonics -8 dBc, and the control voltage sensitivity of 30 [MHz/V] with a DC current consumption of 9.5 [mA]. The size of VCO is $6{\times}9{\times}2$ mm(0.11[cc]).