• 제목/요약/키워드: LED junction

검색결과 105건 처리시간 0.032초

LED 접합온도 유지를 위한 전력 제어 시스템 (Power Control System for Maintain a LED Junction Temperature)

  • 박종연;정광현;유진완;최원호
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2009년도 제40회 하계학술대회
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    • pp.934_935
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    • 2009
  • LED는 기존조명에 비해 친환경적이고, 긴 수명을 갖기 때문에 현재에 이르러 광고조명이나 백라이트 유닛 그리고 실내 외 조명으로 각광받기 시작했다. LED를 조명으로 사용 함에 있어서 LED의 PN 접합부에서 발생하는 접합온도 상승을 고려해야한다. 접합온도 상승은 LED의 광 출력과 수명의 감소, 광색의 변화를 초래하기 때문에 광 출력 및 광색을 유지시키고, 수명을 예측하기 위해서는 LED의 접합온도를 일정하게 유지시키는 LED 전용의 전력제어 시스템이 필요하다. 본 논문은 LED 접합온도 측정 시스템과 구동전원을 설계 및 제작하였으며, 측정된 온도를 구동전원에 궤환시켜 접합온도를 일정하게 유지시키는 시스템을 제안하였다.

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An Estimation Method for the Efficiency of Light-Emitting Diode (LED) Devices

  • Tao, Xuehui;Yang, Bin
    • Journal of Power Electronics
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    • 제16권2호
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    • pp.815-822
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    • 2016
  • The efficiency of light-emitting diode (LED) devices is a significant factor that reflects the capability of these devices to convert electrical power into optical power. In this study, a method for estimating the efficiency of LED devices is proposed. An efficiency model and a heat power model are established as convenient tools for LED performance evaluation. Such models can aid in the design of LED drivers and in the reliability evaluation of LED devices. The proposed estimation method for the efficiency and heat power of LED devices is verified by experimentally testing two types of commercial LED devices.

LED Chip 열저항측정을 통한 LED Module 온도분석 (LED Module Temperature Analysis for LED Chip Thermal Resistance Measurement)

  • 정희석;유형열;김정수;이영주
    • 한국조명전기설비학회:학술대회논문집
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    • 한국조명전기설비학회 2009년도 춘계학술대회 논문집
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    • pp.164-167
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    • 2009
  • It is difficult to measure junction temperature in the LED Module. According to the arrangement control unit and heat sink, temperature distribution is changed in the LED Module. A method of forecasting LED Module thermal resistance is suggested with measuring LED and PCB board temperature.

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Control of Junction Temperature in LEDs with Peltier Effect

  • 김윤중;김정현;한상호;정종윤;김현철;강한림;조광섭
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제40회 동계학술대회 초록집
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    • pp.268-268
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    • 2011
  • 열전소자를 사용하여 발광다이오드의 발열을 개선한다. 열전소자(Thermoelectric device: TED)의 펠티에효과(Peltier effect)를 이용하여 발광다이오드(Light Emitting Diodes: LED)의 접합온도 (Junction Temperature)를 제어한다. 열전소자의 구동 전력을 제어하여, 발광다이오드의 사용 전류에 대한 접합온도의 특성을 조사한다. 열전소자의 입력 전력 0.2W에 대하여, 일반 조명용 또는 표시 장치로 사용되는 1W급 고전력 LED를 정격전류(350 mA)로 구동할 때 접합온도를 최저 $69^{\circ}C$로 유지할 수 있다. 열전소자의 구동 전력이 0.2W일 때, 발광다이오드의 접합온도 $110^{\circ}C$에 대하여 최대 사용 가능 전류는 560 mA로 예측된다.

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LED 조명 모듈 표면의 방사율 측정에 관한 연구 (Measurement of the Surface Emissivity of the LED Lighting Module)

  • 박진성;허창수
    • 한국전기전자재료학회논문지
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    • 제26권6호
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    • pp.493-501
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    • 2013
  • LED lighting is sensitive because it made by semiconductor. So it has been researched about radiation of heat technologies for a long time. In addition, measurement and assessment a radiation of heat also conducted. It is necessary to get a date of accuracy temperature on the board after LED driven for measuring Junction temperature of the LED Lighting. For this research, we use 5 chip which is 4 W power on top of LED lighting board made by aluminum. Thermal camera effects to emissivity depending on material and property of the surface in LED board because it determines thermal energy which emitted from material surface. it is not only thermal camera has not a standard about emissivity. It has an error of temperature when emissivity was measured by thermal camera. we confirmed that emissivity and reflected temperature depending on color and quality of the surface throughout experiment.

Study on the Development of LED Headlamps for Used Cars

  • Jung, Eui-Dae;Lee, Young-Lim
    • Transactions on Electrical and Electronic Materials
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    • 제15권5호
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    • pp.270-274
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    • 2014
  • Currently, LED headlamps are only attached to newly manufactured vehicles, and it remains difficult to mount LED headlamps on used cars. Therefore LED headlamps need to be developed for used cars as a replacement of their halogen lamps. Due to a number of spatial limitations, it is critical to ensure a certain level of thermal performance. In order to obtain a design for efficient heat radiation, this paper aimed to optimize thermal management through a combination of heat sinks, heat pipes and fans. Based on such a design, this paper succeeded in developing LED headlamps of the desired performance to replace the halogen bulbs of used cars.

LED 조명용 카본 마그네슘 신소재 방열 특성 연구 (A Study of Characteristics of Heat Dissipation Carbon Magnesium New Materials of LED Lighting)

  • 손일수;신성식
    • 한국전기전자재료학회논문지
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    • 제26권12호
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    • pp.915-919
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    • 2013
  • This is the study on the development of fusion heat dissipation of carbon magnesium materials. The purpose of this study is for effective utilization of heat emission which is the core of LED lighting. The result of study enabled the derivation of side satisfying result of making the surface temperature of lighting to be below $70^{\circ}C$ (actual measurement: $58^{\circ}C$) using magnesium. The lighting products that use magnesium was made possible based on the result of this study. Also from the performance aspect such as light distribution, the measurement of light efficiency demonstrated the level of 90 lm/W. Therefore the commercialization of lighting was made possible and the efficiency could be further enhanced by supplementation of LED performance.

HP LED의 열거동형상 분석을 위한 thermal simulation

  • 이승민;양종경;이현희;박대희
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 추계학술대회 논문집
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    • pp.191-191
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    • 2009
  • In this paper, we have confirmed the temperature of LED chip and McPCB with thermal simulation program which is CFDedign V10 for analysis the thermal flow of HP LED package. we have known that the heat from LED chip is transferred through heat slug to copper layer of McPCB. the temperature of LED chip shows 85.11 [$^{\circ}C$], which shows the temperature gap of 7.52 [$^{\circ}C$] against McPCB. the gap of temperature affect reliability of the wire bonding and die attachment. therefore, copper layer of heat slug on the McPCB should designed with the largest dimension.

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PCB 구조와 via hole 구성에 따른 LED 패키지의 열적 광학적 특성 분석 (The Analysis of Thermal & Optical Properties in LED Package by the PCB structure and via hole formation)

  • 이세일;이승민;양종경;박형준;박대희
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 하계학술대회 논문집
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    • pp.297-298
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    • 2009
  • 대부분의 반도체 소자의 고장 원인은 85%정도가 열로 인한 것이며, 고출력 LED는 인가된 에너지의 20%정도의 광으로 출력되며 나머지 80%가 열로 전환된다. 본 논문에서는 PMS-50과 KEITHLEY 2430을 이용하여 PCB 구조와 Via hole 구성에 따른 LED 패키지의 열적 광학적 특성을 분석하였다. 0.6mm의 Via hole을 가진 FR4 PCB의 열특성이 가장 우수하였으며, Via hole 0.6mm FR4 PCB의 경우 McPCB에 상응하는 광출력 특성을 보였다.

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조광기용 MR16 안정기 호환 Flicker Free LED 구동회로 연구 (A Study on Flicker Free LED Driver for Dimming MR16 Electronic Transformer)

  • 김택우;홍성수;염봉호
    • 전력전자학회논문지
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    • 제19권4호
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    • pp.327-331
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    • 2014
  • LED(Light Emitting Diode) is a semiconductor device utilizing electroluminescent effect is a phenomenon in which a type of P-N junction diode, the light of short wavelength which a voltage is applied in the forward direction is released. LED is advantageous in reducing the energy as environmentally materials that can greatly reduce the carbon emissions, recent it has attracted attention IT(Information Technology) and GT(Green Technology) industry. In addition, there are advantages long life, high efficiency, and excellent response speed, LED have come into the spotlight as the illumination means to replace the existing fluorescent light and incandescent light bulb. When connecting to MR16 electronic transformer for existing LED driver circuit, due to malfunction of the dimmer and the electronic transformer, flicker occurs and linear dimming is not possible. Therefore, in this paper, we suggest an LED drive circuit there is no flicker with the corresponding dimming MR16 electronic transformer. Further, we explain the principles of the LED current control technique and the principle of the drive circuit of the LED, in order to validate the proposed circuit through prototyping and simulation.