• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.1
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• pp.46-50
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• 2012

This paper amis at improving the heat radiation performance of thermoelectric module (TEM) for a commercialization of high-powered LED light with using a multichip LED module. In addition, a 10W multichip LED light was prepared for the heat performance on radiating of which LED light was made for a use of testing by the driving of the thermoelectric module. So, it was found that about 30% in the effect of temperature reduction was confirmed if compared with the radiation heat by heat sink only.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.29 no.12
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• pp.15-21
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• 2015

We proposed 50W-LED modules of using Heat-pipe and Stack-fin and produced LED modules was evaluated heat dissipation characteristics with comparison of the conventional die-casting type. It verified the application of products by applying it to 150W-LED road luminaires through simulation. The LED module was measures aimed design temperature of the Stack-fin and showed 26% upward heat dissipation effect than a conventional die-casting type. The luminous efficacy of 150W-LED road luminaires using this LED module reached over 112lm/W, and the simulation results showed average of horizontal luminance, overall luminance uniformity($U_O$) and lane luminance uniformity($U_I$) that is suitable for five-lane road with the KS standards.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.10
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• pp.759-765
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• 2012

In this paper, a temperature control for LED (light emitting diode) lamp using a cooling fan is studied. An efficient temperature control scheme for the LED lamp using the fan wind at the lowest sound noise is studied. For the study, after measurement of the minimum sound noise of the fan and related temperature of the LED lamp through tests, experiments on temperature control of the LED lamp using the fan with various size of heat sinks was performed. To reduce the fan sound noise, a method of reducing the operation time with optimal size of the heat sink was studied. Also, a control of LED lamps using RF communication was studied.

• Transactions on Electrical and Electronic Materials
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• v.18 no.2
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• pp.59-61
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• 2017

This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If the distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.37 no.1
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• pp.27-33
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• 2013

To ensure proper functioning of electrical and mechanical systems, cooling devices are of great importance. A heat sink is the most common cooling device used in many industries such as the semiconductor, electronic instrument, LED lighting, and automotive industries. To design an optimal heat sink, the required surface area for heat radiation should be calculated based on an accurate expectation of the heat flow rate in the target environment. In this study, the convective heat flow characteristics were numerically investigated for a vertically installed typical heat sink and a horizontally installed one in free convection using ANSYS CFX. Comparative experiments were carried out to reveal the quantitative effect of the installation direction on the cooling performance. Moreover, the result was analyzed using the dimensionless correlation with the Nusselt number and Rayleigh number and compared with well-known theories. Finally, it was observed that the cooling performance of the vertically installed heat sink is approximately 10~15% better than that of the one in natural convection.

• Journal of Advanced Marine Engineering and Technology
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• v.34 no.8
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• pp.1100-1106
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• 2010

LED(Light Emitting Diode) has the defects of low efficiency and reducement of life cycle as its temperature increases. This research is about an efficient temperature control of the LED. For LED temperature control, it is shown that a heat sink, fan, a one-chip microprocessor and the PID control algorithm are a good cooling system through experiments. Finally. by using the fan as a cooling device and controlling it appropriately, it is proved that the intensity of illumination and the desired temperature can be achieved with consumption of only 2% of the driving power of the LED system through control experiments.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.1163-1164
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• 2011

• Transactions of the Korean Society of Mechanical Engineers B
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• v.36 no.4
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• pp.385-390
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• 2012

A radial heat sink, adopted to LED(light emitting diode) downlight, was optimized. Discrete transfer radiation model (DTRM) was used to calculate radiation heat transfer, and numerical model was verified with experimental results. The effects of number of fin, long fin length and middle fin length on overall thermal resistance and radiation heat transfer were analyzed. As the emissivity increased, thermal resistance decreased due to the increment of radiation heat transfer. The radial heat sink was optimized and optimum number of long fins is 19~28, optimum length of long fin is about half of radius of heat fink and optimum fin ratio is 0.4~0.7.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.3
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• pp.131-134
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• 2016

This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If thhe distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.

• Transactions on Electrical and Electronic Materials
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• v.15 no.5
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• pp.270-274
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• 2014

Currently, LED headlamps are only attached to newly manufactured vehicles, and it remains difficult to mount LED headlamps on used cars. Therefore LED headlamps need to be developed for used cars as a replacement of their halogen lamps. Due to a number of spatial limitations, it is critical to ensure a certain level of thermal performance. In order to obtain a design for efficient heat radiation, this paper aimed to optimize thermal management through a combination of heat sinks, heat pipes and fans. Based on such a design, this paper succeeded in developing LED headlamps of the desired performance to replace the halogen bulbs of used cars.