• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.29 no.2
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• pp.103-110
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• 2023

The study aimed to enhance the properties of polylactic acid (PLA), a biodegradable and biocompatible substitute for fossil-based plastics. Since the applicability of PLA has been limited because of its toughness and brittleness, microfibrillated cellulose (MFC) and propolis were introduced into PLA. As a result, the PLA film with MFC/propolis showed significant improvements in mechanical strength, elongation, and storage modulus, while also experiencing a decrease in the glass transition temperature. Additionally, the presence of polyphenols in propolis led to a reduction in light transmittance in the UV wavelength range. These enhancements are attributed to MFC tightly bonding with PLA polymers, and propolis acting as a plasticizer and mediator between MFC and PLA, preventing agglomeration. These reinforced PLA films have the potential to be used in flexible packaging for light-sensitive products.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.51-56
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• 2012

In order to fabricate through-Si-vias for thermal vias by using wet etching process, anisotropic etching behavior of Si substrate was investigated as functions of concentration and temperature of TMAH solution in this study. The etching rate of 5 wt%, 10 wt%, and 25 wt% TMAH solutions, of which temperature was maintained at $80^{\circ}C$, was $0.76{\mu}m/min$, $0.75{\mu}m/min$, and $0.30{\mu}m/min$, respectively. With changing the temperature of 10 wt% TMAH solution to $20^{\circ}C$ and $50^{\circ}C$, the etching rate was reduced to $0.067{\mu}m/min$ and $0.233{\mu}m/min$, respectively. Through-Si-vias of $500{\mu}m$-depth could be fabricated by etching a Si substrate for 5 hours in 10 wt% TMAH solution at $80^{\circ}C$ after forming same via-pattern on each side of the Si substrate.

• Journal of Welding and Joining
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• v.30 no.3
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• pp.32-37
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• 2012

Lead frame which has a high thermal conductivity and high mechanical strength is one of core technology for ultra-thin electronics such as LED lead frames, memory devices of semiconductors, smart phone, PDA, tablet PC, notebook PC etc. In this paper, we fabricated a Cu/STS/Cu 3-layered clad metal for lead frame packaging materials and characterized the mechanical properties and thermal conductive properties of the clad metal lead frame material. The clad metal lead frame material has a comparable thermal conductivity to typical copper alloy lead frame materials and has a reinforced mechanical tensile strength by 1.6 times to typical pure copper lead frame materials. The thermal conductivity and mechanical tensile strength of the Cu/STS/Cu clad metal are 284.35 W/m K and $52.78kg/mm^2$, respectively.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.25 no.1
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• pp.35-38
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• 2015

LEDs are considered to be an alternative for enhancement of energy efficiency, applied for numerous areas such as display, automotive headlight not only lights. Yellow phosphor is generally utilized with blue LEDs to generate WLED, $Y_3Al_{5}O_{12}:Ce^{3+}$ is typically used as the yellow phosphor. The phosphor, mixed with epoxy resin, has been used by being spread and hardened on the blue LED chip. This paste-based packaging gives rise to problems of degradation of phosphor by heat and decrease of luminous efficiency. Although phosphor plate is used instead of the epoxy-phosphor mixture to solve these problems, loss of luminous efficacy by total internal reflection inside the plate also should be solved. In this study, we coated the side of the plate with silver as one of the solution.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.28 no.3
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• pp.157-163
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• 2022

The demands for Home Meal Replacement (HMR) products are continuously increasing owing to the convenience of instant food and online food delivery. Ready-to-heat (RTH) products have received massive attention in the HMR industry because these products can be easily warmed using a microwave oven. However, the conventional microwave packaging should be opened before microwave heating to prevent bursting or food loss owing to the steam-pressure build-up inside the package. Open packaging might lead to non-uniform food heating and cross-contamination. Therefore, packaging materials that are able to release steam without opening are of interest to the HMR industry. In this study, polylactic acid(PLA)/polyethylene glycol(PEG)/nanoclay composite films were manufactured using an extrusion method as packaging materials with a smart steam-releasing function. The introduction of PEG to the PLA imparted a steam self-releasing feature to the composite films owing to the morphology change of composite films during microwave heating. Further, PEG increased the ductility of PLA, which in turn prevented bursting caused due to the steam-pressure build-up. The uniform dispersion of nanoclay obtained by a twin-screw extrusion led to stronger mechanical properties. Therefore, the smart composite films developed here can be applied as microwave packaging materials with a self-releasing function.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.10
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• pp.6925-6931
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• 2015

LED(Light Emitting Diode) is used in various filed like a display because of low power consuming, long life span, high brightness, rapid response time and environmental-friendly characteristic. General fabrication method is combination blue light LED chip with yellow fluorescent substance. Because this way is suitable for industry field in terms of convenience, economic, efficiency. In white light LED packaging process, encapsulation process that is dispensing fluorescent substance with silicon to blue light LED chip is most important. So, in this paper we develop EHD pump system using voice coil motor and electrostatic pump for dispensing fluorescent substance. For these things we conduct basic test about liquid surface profiles by voltage and process time. Through this data we decide optimal process condition and verify the optimal condition using design of experiment method. And to confirm uniformity of the condition, we conduct repeat dispensing test.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.19 no.2
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• pp.61-65
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• 2009

In this paper, we report on the growth and optical characteristics of white-LED without fluorescent material. The growth of DH(double heterostructure) with AlGaN active layer was performed on a n-GaN/(0001) $Al_{2}O_{3}$ by the mixed-source HVPE and multi-sliding boat. The CRI(color rendering index) of packaging device charged in the range 72-93 with CIE chromaticity coordinates(x=$0.26{\sim}0.34$, y=$0.31{\sim}0.40$). And CCT(correlated color temperature) values was measured $5126{\sim}10406K$ with increasing injection current. The CIE point of conventional phosphor white LED shifts blue region, but cm point of non-phosphor white LED shifts opposite direction. These results show the mixed-source HVPE can be possible to newly fabricate method of phosphor free white LED with high CRI value.

• Proceedings of the KIEE Conference
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• 2004.11c
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• pp.156-158
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• 2004

Film printing companies have many problems during a printing process. Most of all, even an insect or dirt stick to the transparent film may cause severe errors until the end of printing job, which means big economic damage to the company. To prevent some insect-dots or dirt-dots, we have to Inspect the total area of film. However, it is very difficult to inspect the film in real-time due to the high-speed of printing that usually more than 150 m/min. A hardware based approach, for example DSP-based approach can be the one of solution candidates, but the total cost and the complexity increases the very high-level. In this paper, we suggest a software based approach, using MMX technology, to inspect the film in real-time. By Many real-plant experiments, we can see the suggest approach is applicable for the inspection of food packaging film in real-time.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.2 s.35
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• pp.135-140
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• 2005

Although it was recently observed that severe fatigue damage was formed in Al or Cu interconnects due to the cyclic temperatures generated by Joule heating of the metal lines by the passage of alternating currents (AC), AC loading frequency effect on the damage evolution characteristics are not known so far. This work focused on the effect of AC loading frequency (100 Hz vs. 10 kHz) on the thermo-mechanical fatigue characteristics by using polycrystalline sputtered Cu lines with temperature cycles with amplitudes from 100 to $300^{\circ}C$. It was consistently observed that higher loading frequency accelerated damaged grain growth and led to earlier failure irrespective of Cu grain sizes. The frequency effect is believed to result from differences in the concentration of defects created by the deformation-induced motion of dislocations to the grain boundaries.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.1-8
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• 2024

Bonding wires are composed of conductive metals of Au, Ag & Cu with excellent electrical conductivities for transmitting power and signals to wafer chips. Wire metals do not provide electrical insulation, adhesion promoter and corrosion passivation. Adhesion between metal wires is extremely weak, which is responsible for wire cut failures during thermal cycling. Organic coating for electrical insulation does not satisfy bondability and manufacturability, and it is complex to apply very thin organic coating on metal wires. Automotive packages require enhanced reliability of packages under harsh conditions. LED and power packages are susceptible to wire cut failures. Contrary to conventional OCB behaviors, forming gas was not required for free air ball formation for both Ag and Pd-coated Cu wires with Al₂O₃ passivation.