• 한국정보디스플레이학회:학술대회논문집
• /
• 2007.08a
• /
• pp.857-859
• /
• 2007

Durability of LCD glass, OA-10 and OA-21, to $SiCl_4$ and $SF_6$ gases was investigated. Reaction products are generated on the glass surface. The reaction products are reduced by changing the etching conditions. the durability of OA-10 and OA-21 to the dry etching gases is comparable.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2004.10a
• /
• pp.1353-1356
• /
• 2004

In recent year, OLED(organic light emitted display) is used as the next generation device of FPD. OLED have been replacing the flat panel display device such as LCD, STN-LCD and TFT because this device is more efficient, economic and simple than those FPD devices, and this need not backlight system for visualization. The performance and efficiency of OLED is related with surface defect of ITO coated glass substrate. The typical surface defect of glass substrate is nonuniformity and bad surface roughness. ITO coated glass substrate is destroied for inspection about surface roughness and non-uniformity. Generally detection of the defects in the surface for ITO coated glass substrate is dependent on operator's experience. In this research, relationship between working parameter and surface non-uniformity is studied using regression analysis.

• Journal of Information Display
• /
• v.3 no.4
• /
• pp.4-7
• /
• 2002

A recently developed phase separated composite film method has been employed to fabricate a liquid crystal (LC) based electro-optical device using a single glass substrate. The resulting device is made of adjacent parallel layers of LC and polymer maded by phase separation. The LC layer is confined between the solidified polymer layer on one side and the glass substrate on the other. The electro-optical properties of these devices demonstrate their technological potential in light weight and hand-held electronic products.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2002.08a
• /
• pp.463-466
• /
• 2002

A new type of LCD has been developed using recently developed phase separated composite film method with a single glass substrate. The resultant structures are made of adjacent parallel layers of liquid crystal and polymer. The LC layer is confined between the solidified polymer layer and glass substrate. The electra-optical properties of the display have been investigated. This technique has the potential to realize a lightweight display for hand-held portable electronic products.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.04a
• /
• pp.18-22
• /
• 2004

We have investigated the generation of pretilt angle for a nematic liquid crystal (NLC) alignment with rubbing alignment method on polyimide surfaces using thin plastic substrates. It was found that monodomain alignment of NLC is obtained with rubbing alignment method on polyimide surfaces using thin plastic substrates. The NLC pretilt angles generated are about $3^{\circ}$ by the rubbing alignment method on thin plastic substrates, However, the pretilt angle are at about $1.7^{\circ}$ lower on the glass substrate than on thin plastic substrate. Also, EO characteristics of the TN-LCD with a rubbed PI surface based on polymer are almost the same as that of the TN-LCD with a rubbed PI surface based on glass. However, the transmittances of the TN-LCD with a rubbed PI surface based on polymer is less than that with a rubbed PI surface based on glass.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2007.08a
• /
• pp.706-709
• /
• 2007

Different from the LCD that have two glass substrates on the top and the bottom, EPD have an advantage that is using the bottom glass substrate and the top e-ink sheet. So, it is impossible to apply R or C type TSP that need bottom and top glass plane. We successfully implemented the TSP (Touch Screen Panel) based on the light over the EPD (Electro Phoretic Display).

• 한국정보디스플레이학회:학술대회논문집
• /
• 2000.01a
• /
• pp.39-40
• /
• 2000

STN LCDs on Plastic Film substrates for mobile communication devices have been researched and developed at KETI in KOREA. The Plastic Film substrate is so weak to heat and pressure that its fabrication process is limited to $110^{\circ}C(Tg)$. In order to maintain uniform pressure on Plastic Film substrate we used newly designed jig and fabrication process. Electro-optical characteristics are better than or equivalent to those of typical glass LCD though it is thinner, lighter-weight, and more robust than glass LCD.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.17 no.8
• /
• pp.866-870
• /
• 2004

We have investigated the generation of pretilt angle for a nematic liquid crystal (NLC) alignment with rubbing alignment method on polyimide surfaces using plastic substrates. It was found that monodomain alignment of NLC is obtained with rubbing alignment method on polyimide surfaces using thin plastic substrates. The NLC pretilt angles on thin plastic substrates generated higher than that on glass substrate. Also, EO characteristics of the TN-LCD with a rubbed PI surface based on polymer substrate are almost the same as that of the TN-LCD with a rubbed PI surface based on glass. However, the transmittances of the TN-LCD with a rubbed PI surface based on polymer is less than that with a rubbed PI surface based on g1ass.

• Journal of the Microelectronics and Packaging Society
• /
• v.14 no.3
• /
• pp.57-64
• /
• 2007

New Chip-on-glass technology to attach an Si chip directly on the glass substrate of LCD panel was studied with local heating method of the Si chip by using thin film heater fabricated on the Si chip. Square-shaped Cu thin film heater with the width of $150\;{\mu}m$, thickness of $0.8\;{\mu}m$, and total length of 12.15 mm was sputter-deposited on the $5\;mm{\times}5\;mm$ Si chip. With applying current of 0.9A for 60 sec to the Cu thin film heater, COG bonding of a Si chip to a glass substrate was successfully accomplished with reflowing the Sn-3.5Ag solder bumps on the Si chip.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2003.11a
• /
• pp.103-105
• /
• 2003

COG (Chip on Glass) technology using solder bump reflow has been investigated to attach IC chip directly on glass substrate of LCD panel. As It chip and LCD panel have to be heated to reflow temperature of the so]der bumps for COG bonding, it is necessary to use low-temperature solders to prevent the damage of liquid crystals of LCD panel. In this study, using the Sn-52In solder bumps of $40{\mu}m$ pitch size, solder joints between Si chip and glass substrate were made at temperature below $150^{\circ}C$. The contact resistance of the solder joint was $8.58m\Omega$, which was much lower than that of the joint made using the conventional ACF bonding technique. The Sn-52In solder joints with underfill showed excellent reliability at a hot humid environment.