• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.381-384
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• 2005

Driver IC is one of the key components on the LCD monitor and LCD/TV. The function of the driver IC is to transfer and forward the input signals to LCD panel module. Inside driver IC, there are several operating units which process the input signals and generate the appropriate size and resolution to the LCD panel module. LCD panel module will display these input signals. However, there are some difficulties which driver IC designer, LCD monitor and LCD/TV maker will face. Thus, this article addresses the function and difficulties on driver IC.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.298-302
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• 2006

Driver electronics for emerging display technologies are presented for OLED's, microdisplays, electrophoretic displays & bi-stable LCD's. Key factors for commercialization of these technologies are derived from the experience of the LCD's, including driver IC designs, wafer and assembly processes & applications.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.21-30
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• 2002

According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.

• Journal of Institute of Control, Robotics and Systems
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• v.14 no.6
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• pp.543-547
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• 2008

In the paper, we develop the ultrasonic bonding technique for LCD driver chips having small size and high pin-density. In general, the mounting technology for LCD driver ICs is a thermo-compression method utilizing the ACF (An-isotropic Conductive Film). The major drawback of the conventional approach is the long process time. It will be shown that the conventional ACF method based on thermo-compression can be remarkably enhanced by employing the ultrasonic bonding technique in terms of bonding time. The proposed approach is to apply the ultrasonic energy together with the thermo-compression methodology for the ACF bonding process. To this end, we design a bonding head that enables pre-heating, pressure and ultrasonic excitation. Through the bonding experiments mainly with LCD driver ICs, we present the procedures to select the best combination of process parameters with analysis. We investigate the effects of bonding pressure, bonding time, pre-heating temperature before bonding, and the power level of ultrasonic energy. The addition of ultrasonic excitation to the thermo-compression method reduces the pre-heating temperature and the bonding process time while keeping the quality bonding between the LCD pad and the driver IC. The proposed concept will be verified and demonstrated with experimental results.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.11-12
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• 2009

In this paper, we propose a high voltage driver IC(HVIC) for LCD and PDP TV power supply. The proposed circuit is included novel a shoot-through protection and a pulse generation circuit for the high voltage driver IC. The proposed circuit has lower variation of dead time and pulse-width about a variation of a process and a supply voltage than a conventional circuit. Especially, the proposed circuit has more excellent pulse-width matching of set and reset signals than the conventional circuit. Also the proposed pulse generation circuit prevent from fault operations using a logic gate. Dead time and pulse-width of the proposed circuit are typical 250 ns, and its variation is maximum 170 ns(68 %) about a variation of a process and a supply voltage. The proposed circuit is designed using $1\;{\mu}m$ 650 V BCD process parameter, and a simulation is carried out using Spectre.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1236-1239
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• 2009

Each LCD TFT panel requires a power supply IC on the panel board. The IC provides the power rails for the timing controller, source and gated driver IC and others. The industry trend moves towards higher integrated devices. The challenge for the panel manufacturer is the development and implementation of such an IC in cooperation with the semiconductor supplier. If not done carefully the solution will not reduce the overall solution cost or can't provide the expected performance and reliability. This paper discusses the key considerations to successfully develop and integrate a highly integrated LCD bias IC into the system.

• Proceedings of the IEEK Conference
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• 2001.06b
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• pp.41-44
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• 2001

본 논문은 액정 Driver IC에 사용되a는 내부 기준 clock 발생 및 Voltage Converter에 boosting을 하기 위한 clock을 제공하는 Oscillator 설계 및 구현 하였다 LCD Driver IC에서 발생되는 Oscillator clock 은 고속의 clock신호는 필요로 하지 않으나 LCD display에 관련된 frame 주파수에 직접적인 영향을 주므로 중심 주파수 결정 및 duty비에 따른 주파수 제어가 매우 중요하다. 본 논문에서는 가변 duty를 적용하는 LCD system에 적용할 수 있는 가변 duty oscillator를 소개한다. Process는 0.35um, 12V공정을 사용하였다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.12
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• pp.31-38
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• 2010

This paper presents the design of a graphic memory for QVGA-scale LCD Driver IC (LDI). The graphic memory is designed based on the pseudo-SHAM for the purpose of small area, and the memory cell structure is designed using a bit line partitioning method to improve sensing characteristics and drivabilties in the line-read operation. Also, a collision protection circuit using C-gate is designed to control collisions between read/write operations and self-refresh/line-read operations effectively. The graphic memory circuit has been designed in transistor level using $0.18{\mu}m$ CMOS technology library and the operations of the graphic memory have been verified using Hspice. The results show that the bit-bitb line voltage difference, ${\Delta}V$ increases by 40%, the charge sharing time between bit and bitb voltages $T_{CHGSH}$ decreases by 30%, and the current during line-read decreases by 40%.

• ETRI Journal
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• v.25 no.5
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• pp.288-296
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• 2003

In this study, we present a 260k color TFT LCD driver chip set that consumes only 5 mW in the module, which has exceptionally low power consumption. To reduce power consumption, we used many power-lowering schemes in the logic and analog design. A driver IC for LCDs has a built-in graphic SRAM. Besides write and read operations, the graphic SRAM has a scan operation that is similar to the read operation of one row-line, which is displayed on one line in an LCD panel. Currently, the embedded graphic memory is implemented by an 8-transistor leaf cell and a 6-transistor leaf cell. We propose an efficient scan method for a 6-transistor embedded graphic memory that is greatly improved over previous methods. The proposed method is implemented in a 0.22 ${\mu}m$ process. We demonstrate the efficacy of the proposed method by measuring and comparing the current consumption of chips with and without our proposed scheme.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.301-302
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• 2005

A low-power gate driver IC, which can be used for TFT-LCD application, is proposed. The short-circuit current of the output buffer is greatly reduced. An experimental prototype gate driver implemented in a $0.35-{\mu}m$ CMOS technology demonstrates that the power reduction of 16 % is obtained.