• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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• pp.381-384
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• 2005

Driver IC is one of the key components on the LCD monitor and LCD/TV. The function of the driver IC is to transfer and forward the input signals to LCD panel module. Inside driver IC, there are several operating units which process the input signals and generate the appropriate size and resolution to the LCD panel module. LCD panel module will display these input signals. However, there are some difficulties which driver IC designer, LCD monitor and LCD/TV maker will face. Thus, this article addresses the function and difficulties on driver IC.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.298-302
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• 2006

Driver electronics for emerging display technologies are presented for OLED's, microdisplays, electrophoretic displays & bi-stable LCD's. Key factors for commercialization of these technologies are derived from the experience of the LCD's, including driver IC designs, wafer and assembly processes & applications.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 International Symposium
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• pp.21-30
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• 2002

According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.

• 제어로봇시스템학회논문지
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• 제14권6호
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• pp.543-547
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• 2008

In the paper, we develop the ultrasonic bonding technique for LCD driver chips having small size and high pin-density. In general, the mounting technology for LCD driver ICs is a thermo-compression method utilizing the ACF (An-isotropic Conductive Film). The major drawback of the conventional approach is the long process time. It will be shown that the conventional ACF method based on thermo-compression can be remarkably enhanced by employing the ultrasonic bonding technique in terms of bonding time. The proposed approach is to apply the ultrasonic energy together with the thermo-compression methodology for the ACF bonding process. To this end, we design a bonding head that enables pre-heating, pressure and ultrasonic excitation. Through the bonding experiments mainly with LCD driver ICs, we present the procedures to select the best combination of process parameters with analysis. We investigate the effects of bonding pressure, bonding time, pre-heating temperature before bonding, and the power level of ultrasonic energy. The addition of ultrasonic excitation to the thermo-compression method reduces the pre-heating temperature and the bonding process time while keeping the quality bonding between the LCD pad and the driver IC. The proposed concept will be verified and demonstrated with experimental results.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.11-12
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• 2009

In this paper, we propose a high voltage driver IC(HVIC) for LCD and PDP TV power supply. The proposed circuit is included novel a shoot-through protection and a pulse generation circuit for the high voltage driver IC. The proposed circuit has lower variation of dead time and pulse-width about a variation of a process and a supply voltage than a conventional circuit. Especially, the proposed circuit has more excellent pulse-width matching of set and reset signals than the conventional circuit. Also the proposed pulse generation circuit prevent from fault operations using a logic gate. Dead time and pulse-width of the proposed circuit are typical 250 ns, and its variation is maximum 170 ns(68 %) about a variation of a process and a supply voltage. The proposed circuit is designed using $1\;{\mu}m$ 650 V BCD process parameter, and a simulation is carried out using Spectre.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.1236-1239
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• 2009

Each LCD TFT panel requires a power supply IC on the panel board. The IC provides the power rails for the timing controller, source and gated driver IC and others. The industry trend moves towards higher integrated devices. The challenge for the panel manufacturer is the development and implementation of such an IC in cooperation with the semiconductor supplier. If not done carefully the solution will not reduce the overall solution cost or can't provide the expected performance and reliability. This paper discusses the key considerations to successfully develop and integrate a highly integrated LCD bias IC into the system.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2001년도 하계종합학술대회 논문집(2)
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• pp.41-44
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• 2001

본 논문은 액정 Driver IC에 사용되a는 내부 기준 clock 발생 및 Voltage Converter에 boosting을 하기 위한 clock을 제공하는 Oscillator 설계 및 구현 하였다 LCD Driver IC에서 발생되는 Oscillator clock 은 고속의 clock신호는 필요로 하지 않으나 LCD display에 관련된 frame 주파수에 직접적인 영향을 주므로 중심 주파수 결정 및 duty비에 따른 주파수 제어가 매우 중요하다. 본 논문에서는 가변 duty를 적용하는 LCD system에 적용할 수 있는 가변 duty oscillator를 소개한다. Process는 0.35um, 12V공정을 사용하였다.

• 대한전자공학회논문지SD
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• 제47권12호
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• pp.31-38
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• 2010

본 논문에서는 QVGA급 LCD Driver IC(LDI)의 그래픽 메모리를 설계한다. 저면적을 위해 pseudo-SRAM 구조로 설계하고, 센싱 특성 개선과 line-read 동작 시 구동력 향상을 위해 bit line을 분할한 cell array 구조를 적용한다. 또한, C-gate를 이용한 저면적의 충돌방지 회로를 사용하여 그래픽 메모리의 line-read/self-refresh 동작과 기존의 write/read 동작 상호간의 충돌을 효과적으로 제어하는 방식을 제안한다. QVGA급 LDI의 그래픽 메모리는 $0.18{\mu}m$ CMOS공정을 이용하여 트랜지스터 레벨로 설계하고 회로 시뮬레이션을 통해 그래픽 메모리의 write, read, line-read, self-refresh 등의 기본 동작을 확인하고, 제안된 충돌방지 블록에 대한 동작을 확인하였다. 개선된 cell array를 통해 bit/bitb line 전압차 ${\Delta}V$는 약 15% 증가하고, bit/bitb line의 charge sharing time $T_{CHGSH}$는 약 30% 감소하여 센싱 특성이 향상되었으며, line-read 동작 시 발생하는 전류는 약 40% 크게 감소되었다.

• ETRI Journal
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• 제25권5호
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• pp.288-296
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• 2003

In this study, we present a 260k color TFT LCD driver chip set that consumes only 5 mW in the module, which has exceptionally low power consumption. To reduce power consumption, we used many power-lowering schemes in the logic and analog design. A driver IC for LCDs has a built-in graphic SRAM. Besides write and read operations, the graphic SRAM has a scan operation that is similar to the read operation of one row-line, which is displayed on one line in an LCD panel. Currently, the embedded graphic memory is implemented by an 8-transistor leaf cell and a 6-transistor leaf cell. We propose an efficient scan method for a 6-transistor embedded graphic memory that is greatly improved over previous methods. The proposed method is implemented in a 0.22 ${\mu}m$ process. We demonstrate the efficacy of the proposed method by measuring and comparing the current consumption of chips with and without our proposed scheme.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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• pp.301-302
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• 2005

A low-power gate driver IC, which can be used for TFT-LCD application, is proposed. The short-circuit current of the output buffer is greatly reduced. An experimental prototype gate driver implemented in a $0.35-{\mu}m$ CMOS technology demonstrates that the power reduction of 16 % is obtained.