• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.203-203
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• 2009

Low temperature annealing for oxide TFTs including IGZO on PI substrate is the essential process to fabricate flexible display devices, since low heat-resistance on PI and PEN substrates limits the temperature range. Laser annealing is one of the promising candidates for low temperature process, and it has been used for various application in semiconductor and LCD fabrication. We irradiated laser to solution-based IGZO thin films on PI substrate were irradiated to laser beam, and investigated laser damage of PI layer. Based on transmittance analysis, wavelength(532nm) and scan speed(1000mm/s) is the optimized condition for laser irradiation about ink-Jet printed oxide TFTs on PI substrates.

• Journal of Industrial Technology
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• v.22 no.A
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• pp.37-42
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• 2002

The shearing process for the sheet metal is normally used in the precision elements such as a frame of TFT-LCD or lead frame of IC chips. In these precision elements, the burr formation prevents the system assembly and needs the additional burr removing process. In this study, we have developed the novel ultrasonic deburring system to remove the small burr came from shearing of the sheet metal effectively. The deburring tool is driven by the stepping motor and alumina and SiC particles are used as abrasives. Ultrasonic power and the flowing resistance of the abrasives make ti possible to abrasive the burr.

• Journal of the Semiconductor & Display Technology
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• v.14 no.1
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• pp.45-49
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• 2015

Process gases with vapor or liquid phase as well as gas phase may experience alteration in itself or be contaminated in the fluid pipe to the process chamber. And thus it result in as particles or defects on the substrates in semiconductor, LCD, LED manufacturing. Purifiers and filters are used for control of contamination. However, none of detection device is available in the delivery line. In this paper, we propose simple device with lighting and sensing in order to predict contamination of the fluid or the tube wall. For some general purpose gases, it showed constant voltage output regardless of the flow rates. But, the smoke and the moisture in the air lowered the figure due to its concentration. Numerical values for several solid and liquid media were obtained. And, the operating temperature tendency was investigated.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1605-1608
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• 2006

The contrast ratio, brightness, and uniformity of S-IPS panel, whose alignment process was employed by ion-beam-alignment (IBA) technology, were improved significantly compared with the convention rubbing's panel, because the light leakage has been reduced in dark state effectively. The IBA technology could generate a panel whose pretilt angle was stable and low after post-treatment process.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.922-925
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• 2005

Inkjet printing technology is a highly proprietary process. We have evaluated the possibility of using inkjet technique to prepare color filters. Product specification for TV application was used as a template to examine process capability. Technical aspects of ink composition, jetting ability, and surface interaction were discussed.

• Transactions on Electrical and Electronic Materials
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• v.4 no.2
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• pp.10-14
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• 2003

Flexible displays such as plastic-based liquid crystal displays (LCDs) and organic light-emitting diode displays (OLEDDs) have been researched and developed at KETI since 1997. The plastic film substrate is very weak to heat and pressure compared to glass substrate, that its fabrication process is limited to 110$^{\circ}C$ and low pressure. The ITO films were deposited on the bare plastic film substrate by rf-magnetron sputtering. Moreover, in order to maintain uniform cell gap and pressure on the plastic film substrate, we utilized newly-invented jig and fabrication process. Electro-optical characteristics were better than or equivalent to those of typical glass LCDs though it is thinner, lighter-weight, and more robust than glass LCDs.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.203-215
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• 2002

Using eutectic In-Ag and Bi-Sn solder materials, we developed the COG technique having a minimum pitch of 50 ${\mu}{\textrm}{m}$. The maximum temperature in this process is $160^{\circ}C$. We fabricated spherical and uniform solder bumps by controlling the microstructure of Bi-Sn solder bumps. The contact resistances of Bi-Sn solder joints were 19 m$\Omega$ at $80{\mu}{\textrm}{m}$ pitch and 60 m$\Omega$ at $80{\mu}{\textrm}{m}$ pitch, respectively. These values are much lower than the contact resistance of the conventional ACF bonding. The contact resistances of the solder joint are almost the same before and after the underfill process. The contact resistance of the underfilled Bi-Sn solder joint did not change even after reliability test.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.11
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• pp.47-54
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• 2009

Spin coaters are the essential instruments in micro-fabrication processes, which apply uniform thin films to flat substrates. In this research, a spin coater diagnosis system is developed to detect the abnormal operation of TFT-LCD process in real time. To facilitate the real-time data acquisition and analysis, the circular-buffered continuous data transfer and the short-time Fourier transform are applied to the fault diagnosis system. To determine whether the system condition is normal or not, a steady-state detection algorithm and a frequency spectrum comparison algorithm using confidence interval are newly devised. Since abnormal condition of a spin coater is rarely encountered, algorithm is tested on a CD-ROM drive and the developed program is verified by a function generator. Actual threshold values for the fault detection are tuned in a spin coater in process.

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.500-503
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• 2002

In this paper, we demonstrate the deformation of TFT-LCD panel using numerical analysis based on the finite element method. To make better uniform cell gap and less stress at a photo-definable spacer (spacer), we have investigated process and design factors such as amount of liquid crystal (LC), spacer density, area, height, and material property. Furthermore we optimized design factors and achieved the robust design through the simulation.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.78-78
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• 2009

Glass sealing method is used glass bond as called frit in LCD, PDP process. but new sealing method is need to consider the endurance and economy. This paper present the new glass sealing method using high density gas torch in the furnace and process variable are defined by experiment. Taguchi Robust Experimental Design methods were applied for optimizing these four main processing parameters.