• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.533-536
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• 2006

VIATRON TECHNOLOGIES has developed Field-Enhanced Rapid Thermal Processor (FERTP) system that enables LTPS LCD and AMOLED manufacturers to produce poly-Si films at low cost, high throughput, and high yield. The FE-RTP allows the diverse process options including crystallization, thermal oxidation of gate oxides and fast pre-compactions. The process and equipment compatibility with a-Si TFT lines is able to provide a viable solution to produce poly-Si TFTs using a-Si TFT lines.

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.42-45
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• 2002

Small sized LTPS TFT-LCDs are developed and evaluated. Sine the fabrication process is optimized for the productivity of huge glass substrate, the pattern size is above 5${\mu}m$. The panels with integrated digital data drivers are not satisfactory to compete with a-Si technology. Therefore, LTPS panels are implemented by PMOS technology and it is proved that they can be competitive with a-Si TFT-LCDs in terms of performance and cost.

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.270-274
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• 2002

We have developed a new COG technique using flip chip solder joining technology for excellent resolution and high quality LCD panels. Using the eutectic Bi-Sn and the eutectic In-Ag solder bumps of 50-80 ${\mu}m$ pitch sizes, a ultrafine interconnection between IC and glass substrate was successfully made at or below $160^{\circ}C$. The contact resistance and reliability of Bi-Sn solder joint showed the superiority over the conventional ACF bonding.

• Bulletin of the Korean Chemical Society
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• v.22 no.2
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• pp.179-182
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• 2001

Photocyclizable poly(cinnam-4'-yl methyl methacrylate) derivatives bearing methoxy benzene (PMCMMA), anthracene (PACMMA), and coumarin (PCCMMA) have been synthesized via Heck type reaction. Three different types of polymers are photoreactable usin g linearly polarized UV light and applicable as liquid crystal alignment layer. Anthracence and coumarin containing polymers (PACMMA, PCCMMA) have better thermal stability than PMCMMA. This observation may be attributed to the glass transition temperature elevation due to the bulky size and another photocrosslinking site provided by anthracene or coumarin group.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.657-662
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• 2005

In this study, the deposition of micrometer-scale metallic interconnects on LCD glass for the repair of open-circuit type defects is investigated. Although there had been a few studies Since 1980 s for the deposition of metallic interconnects by laser-induced chemical vapor deposition, those studies mostly used continuous wave lasers. In this work, a third harmonic Nd:YLF laser (351nm) of high repetition rates, up to 10 KHz, was used as the illumination source and $W(CO)_6$ was selected as the precursor. General characteristics of the metal deposit (tungsten) such as height, width, morphology as well as electrical properties were examined for various process conditions. Height of the deposited tungsten lines ranged from 35 to 500 nm depending on laser power and scan speed while the width was controlled between $3\~50{\mu}$ using a slit placed in the beam path. The resistivity of the deposited tungsten lines was measured to be below 1 $O\cdot{\mu}m$, which is an acceptable value according to the manufacturing standard. The tungsten lines produced at high scan speed had good surface morphology with little particles around the patterns. Experimental results demonstrated that it is likely that the deposit forms through a hybrid process, namely through the combination of photolytic and pyrolytic mechanisms.

• Journal of Powder Materials
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• v.18 no.4
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• pp.378-384
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• 2011

In this research, the indium dissolution properties of the waste LCD panel powders were investigated as a function of milling time fabricated by high-energy ball milling (HEBM) process. The particle morphology of waste LCD panel powders changed from sharp and irregular shape of initial cullet to spherical shape with an increase in milling time. The particle size quickly decreased to 15 ${\mu}m$ until the first minute, then decreased gradually about 6 ${\mu}m$ with presence of agglomerated particles after 5 minutes, which increased gradually reaching a uniform size of 13 ${\mu}m$ consist of agglomerated particles after 30 minutes. The glass recovery, after dissolution, was over 99% at initial cullet, which decreased to 90.1 and 78.6% with increasing milling time of 1 and 30 minute respectively, due to a loss in remaining powder of the surface ball and jar, as well as the filter paper. The dissolution amount of indium out of the initial cullet was 208 ppm before milling, turning into 223 ppm for the mechanically milled powder after 1 minute, and nearly 146~125 ppm with further increase in milling time because of the reaction surface decrease of powders due to agglomeration. With this process, maximum dissolving indium amount (223 ppm) could be achieved at a particle size of 15 ${\mu}m$ with 1 minute of milling.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.8 s.173
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• pp.165-173
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• 2005

This paper presents the results for deposition of micrometer-scale metal lines on glass for the development of TFT-LCD circuit repair-system. Although there had been a few studies in the late 1980's for the deposition of metallic interconnects by laser-induced chemical vapor deposition, those studies mostly used continuous wave lasers. In this work, a third harmonic Nd:YLF laser (351nm) of high repetition rates, up to 10 KHz, was used as the illumination source and W(CO)s was selected as the precursor. General characteristics of the metal deposit (tungsten) such as height, width, morphology as well as electrical properties were examined for various process conditions. Height of the deposited tungsten lines ranged from 35 to 500 m depending on laser power and scan speed while the width was controlled between 50um using a slit placed in the beam path. The resistivity of the deposited tungsten lines was measured to be below $1{\Omega}{\cdotu}um$, which is an acceptable value according to the manufacturing standard. The tungsten lines produced at high scan speed had good surface morphology with little particles around the patterns. Experimental results demonstrated that it is likely that the deposit forms through a hybrid process, namely through the combination of photolytic and pyrolytic mechanisms.

• Polymer(Korea)
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• v.35 no.1
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• pp.87-93
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• 2011

We developed a fluorene-containing multifunctional binder polymer for LCD color filter resist, and employing the binder polymer, carbon black based black photoresist (CBR) was prepared in order to apply it to the black matrix (BM). To obtain the multifunction of the binder polymer, we synthesized bisphenol fluorene epoxy acrylate-containing unsaturated polyester and identified the binder polymer structure with $^1H$ NMR, GPC and FTIR. The corresponding BFEA-polyester binder polymer was compared with the commercially available acryl binder toward the application to the CBR. From the BM lithography test, we found that the synthesized BFEA-polyester binder had better photocrosslinking capability and alkali solubility. In addition, the newly developed binder gave a good process margin, good resolution and adhesion property on a glass substrate.

• Information Display
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• v.5 no.1
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• pp.25-30
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• 2004

Poly-Si TFT(Thin Film Transistor) technology are reviewed and discussed. Poly-Si TFTs fabricated on glass using low-temperature process were studied extensively for the application to LCD (Liquid Crystal Display) as well as to OLED(Organic Light Emitting Diode) Display. Currently, one of the application targets of the poly-Si TFT is emphasized on the highly functional SOG(System on Glass). Improvement of device characteristics such as an enhancement of carrier mobility has been studied intensively by enlarging the grain size. Reduction of the voltage and shrinkage of the device size are the trend of AM FPD(Active Matrix Flat Panel Display) as well as of Si LSI, which will arise a peculiar issue of uniformity for the device performance. Some approaches such as nucleation control of the grain seed or lateral grain growth have been tried, so far.

• Journal of Biomedical Engineering Research
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• v.21 no.6
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• pp.607-614
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• 2000

본 논문은 가상환경 노출에 따른 가상멀미와 같은 인체의 영향을 평가하기 위한 연구이다. 이를 위해 20명의 피험자를 대상으로 하여 30분 동안의 가상현실 환경 노출 전과 노출 후에 나타나는 인체의 영향을 분석하였다. 실험평가를 위한 파라미터로는 SSQ test, COP, flicker test, 체온변화, 심박수 변화, 그리고 눈 깜빡임 값들이 이용되었다. 3D 입체영상의 제시는 LSG에 의해서 이루어졌으며, 특히 flicker test시에서는 모니터, LSG, HMD를 모두 사용하여 피로도를 측정, 비교하였다. 본 연구결과, 가상현실 환경의 노출 전 보다 노출 후에서 SSQ score, COP, 체온, 눈 깜빡임, 그리고 심박수가 증가함을 알 수 있다.