• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.511-514
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• 2000

This work aimed to develop ITO (Indium Tin Oxide) thin films ablation with a KrF Eximer laser required for the application in flat panel display, especially patterning into small geometry on a large substrate area. The threshold fluence for ablating ITO on glass substrate is about 0.1 J/cm$^2$. And its value is much smaller than using third harmonic Nd:YAG laser. Through the optical microscope measurement the surface color of the damaged ITO is changed into dark brown and irradiated spot is completely isolated form the undamaged surroundings by laser light. The XPS analysis showed that the relative surface concentration of Sn and In were essentially unchanged (In :Sn=5:1) after irradiating Eximer laser. Using aluminium mask made by second harmonic Nd:YAG laser the ITO patterning is carried out.

• Korean Journal of Optics and Photonics
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• v.10 no.6
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• pp.453-461
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• 1999

In this paper, we have studied on the effects of annular and quadrupole illuminations by changing their conditions for enhancing the pattern resolution and depth of focus (OaF) in the optical lithography system using KrF Eximer laser 0.248$\mu$m and 0.65 NA. As a result, it is revealed that each illumination condition to optimize the resolution and the OaF for the mask containing the assistance pattern is different under the annular illumination. And in case of quadrupole illumination, we could ascertain that the resolution and the OaF would be enhanced through changing the arrangement of each pole from the conventional X type (45 degrees) to some proper type according to the main pattern direction. ction.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.14 no.7
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• pp.1680-1686
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• 2010

Optical fiber Bragg grating to have the lowest transmitivity at 1549.9nm wavelength was fabricated using a Gaussian distributed KrF Eximer laser of 248nm lasing wavelength and a phase mask of 1.072um period. The proper alignment of an optic setup to fabricate fiber gratings was investigated and the reproductivity of the grating fabrication was examined using the obtained optimum fabrication condition in this experiment.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.15 no.8
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• pp.1791-1796
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• 2011

An optical fiber short period grating of 0.7 nm as a 3 dB wavelength linewidth was fabricated using a Gaussian distributed KrF Eximer laser and a phase mask. This grating has temperature dependancy of 0.01 nm/$^{\circ}C$ over the range of -10 $^{\circ}C$ ~ 70 $^{\circ}C$and no difference between temperature directions. An optical fiber long period grating of 14.22 nm as a 3 dB linewidth was also fabricated using a amplitude mask and has dependancy of 0.01 nm/$^{\circ}C$ over the same range.

• Korean Journal of Optics and Photonics
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• v.2 no.4
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• pp.186-192
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• 1991

For the micro-lithography using a excimer laser beam $(\lambda\leq0.248$\mu\textrm{m})$. a mirror system consisting of four spherical surfaces with reductlon magnification 5X is designed. Initially the aplanat, flat field and the distortion free condition of the system are analytically investigated within Seidel 3rd order aberrations. And the computer-aided optimization technique has been employed for the further improved performance of the system. The final system has N.A. of 0.15 and image field diameter 3.3 mm, and has the diffraction-limited performance for KrF eximer laser beam.

• Journal of the Korean Magnetics Society
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• v.4 no.3
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• pp.214-218
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• 1994

$Y_{3}Fe_{5}O_{12}$ based garnet films(thin or thick) offer a great promise for the application of microwave communication components. We investigated the magnetic and crystallographic preperties of $Y_{3}Fe_{5}O_{12}$ thick films prepared by KrF eximer laser ablation of a stoichiometric garnet target. It was possible to obtain almost epitaxially oriented films on $Al_{2}O_{3}$(1102) plane. Although the crystalline quality depends on substrate temperature and $O_{2}$ partial pressure used($Po_{2}$), 4.1m thick films of $4{\pi}M_{s}=1300$ Gauss and $H_{c}=37.5$ Oe were obtained at the substrate temperature of $700^{\circ}C$ with the $Po_{2}$ of 100 mTorr after annealing the as-deposited films at $700^{\circ}C$ for 2 hours. These films are expected to be used for magnetostatic spin wave filters at narrow bandwidth frequency.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2453-2458
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• 2007

The performance of polysilicon thin film transistor (p-Si TFT) has an important role in the operation of active matrix liquid crystal displays. To fabricate the p-Si TFTs that have uniform characteristics, understanding of the recrystallization mechanism of silicon is crucial. Especially, the analysis of the transient temperature variation and the liquid-solid interface motion is required to find the mechanism. The thermal conductivity is one of the most important parameters to understand the mechanism. In this work, a KrF eximer laser beam was irradiated to amorphous silicon thin films. We measured the transient reflectivity at the wavelength of 633 nm. We carried out the numerical simulation of one dimension conduction equation so that we determined the most well-fitted thermal conductivity by comparing the numerically obtained transient reflectivity with the experimentally measured one. The experimentally determined thermal conductivity of amorphous silicon thin films is 1.5 W/mK.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.144-144
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• 2010

다결정 실리콘 박막트랜지스터 (poly-Si TFTs)는 벌크실리콘을 이용한 MOSFET소자에 비해 실리콘 박막의 형성이 간단하므로 대면적의 공정이 가능하며 다양한 기판위에 적용이 가능하여 LCD, OLED 등의 디스플레이 기기에 많이 이용되고 있다. 또한 poly-Si TFT는 3차원으로 적층된 소자의 제작이 가능하여 고집적의 한계를 극복할 소자로 주목받고 있다. 최근, DRAM은 캐패시터의 축소화와 구조적 공정이 한계점에 도달했으며 이를 극복하기 위하여 SOI 기판을 사용한 하나의 트랜지스터로 DRAM의 동작을 수행하는 1T-DRAM의 연구가 활발히 진행 중이다. 이러한 1T-DRAM 소자를 대면적과 다층구조의 공정이 가능한 poly-Si TFT를 이용하여 구현하면 초고집적의 메모리 소자를 제작 가능할 것이다. 따라서, 본 연구에서는 다결정 실리콘 박막트랜지스터 (poly-Si TFTs)를 이용한 1T-DRAM의 동작 특성을 연구하였다. 소자의 제작 방법으로는 200 nm의 열산화막이 성장된 p-type 실리콘 기판위에 상부실리콘으로 사용될 비정질 실리콘 박막을 LPCVD 방법으로 증착하였다. 다음으로 248 nm의 파장을 가지는 KrF 레이저를 이용한 eximer laser annealing (ELA) 공정을 통하여 결정화된 상부실리콘층에 TFT 소자를 제작하여 전기적 특성을 평가하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.201-201
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• 2010

DRAM (dynamic random access memory)은 하나의 트랜지스터와 하나의 캐패시터의 구조 (1T/1C)를 가지는 구조로써 빠른 동작 속도와 고집적에 용이하다. 하지만 고집적화를 위해서는 최소한의 캐패시터 용량 (30 fF/cell)을 충족시켜 주어야 한다. 이에 따라 캐패시터는 stack 혹은 deep trench 구조로 제작되어야 한다. 위와 같은 구조로 소자를 구현할 시 제작공정이 복잡해지고 캐패시터의 집적화에도 한계가 있다. 이러한 문제점을 보완하기 위해 1T-DRAM이 제안되었다. 1T-DRAM은 하나의 트랜지스터로 이루어져 있으며 SOI (silicon-on-insulator) 기판에서 나타나는 floating body effect를 이용하여 추가적인 캐패시터를 필요로 하지 않는다. 하지만 SOI 기판을 이용한 1T-DRAM은 비용측면에서 대량생산화를 시키기는데 어려움이 있으며, 3차원 적층구조로의 적용이 어렵다. 하지만 다결정 실리콘을 이용한 기판은 공정의 대면적화가 가능하고 비용적 측면에서 유리한 장점을 가지고 있으며, 적층구조로의 적용 또한 용이하다. 본 연구에서는 ELA (eximer laser annealing) 방법을 이용하여 비정질 실리콘을 결정화시킨 기판에서 1T-DRAM을 제작하였다. 하지만 다결정 실리콘은 단결정 실리콘에 비해 저항이 크기 때문에, 메모리 소자로서 동작하기 위해서는 높은 바이어스 조건이 필요하다. 게이트 산화막이 얇은 경우, 게이트 산화막의 열화로 인하여 소자의 오작동이 일어나게 되고 게이트 산화막이 두꺼울 경우에는 전력소모가 커지게 된다. 그러므로 메모리 소자로서 동작 할 수 있는 최적화된 게이트 산화막 두께가 필요하다. 제작된 소자는 KrF-248 nm 레이저로 결정화된 ELA 기판위에 게이트 산화막을 10 nm, 20 nm, 30 nm 로 나누어서 증착하여, 전기적 특성 및 메모리 특성을 평가하였다.

• Applied Microscopy
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• v.42 no.4
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• pp.207-211
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• 2012

We examined the electrical properties and microstructure of NiO produced using a sol-gel method and Ni nitrate hexahydrate ($Ni[NO_3]_2{\cdot}6H_2O$) to investigate if this NiO thin film can be used as an insulator layer for resistance random access memory (ReRAM) devices. It was found that as-prepared NiO film was polycrystalline and presented as the nonstoichiometric compound $Ni_{1+x}O$ with Ni interstitials (oxygen vacancies). Resistances-witching behavior was observed in the range of 0~2 V, and the low-resistance state and high-resistance state were clearly distinguishable (${\sim}10^3$ orders). It was also demonstrated that NiO could be patterned directly by KrF eximer laser irradiation using a shadow mask. NiO thin film fabricated by the sol-gel method does not require any photoresist or vacuum processes, and therefore has potential for application as an insulating layer in low-cost ReRAM devices.