• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.133-133
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• 2008

Recently, as the down-scailing of field-effect transistor devices continues, Schottky-barrier field-effect transistors (SB-FETs) have attracted much attention as an alternative to conventional MOSFETs. SB-FETs have advantages over conventional devices, such as low parasitic source/drain resistance due to their metallic characteristics, low temperature processing for source/drain formation and physical scalability to the sub-10nm regime. The good scalability of SB-FETs is due to their metallic characteristics of source/drain, which leads to the low resistance and the atomically abrupt junctions at metal (silicide)-silicon interface. Nevertheless, some reports show that SB-FETs suffer from short channel effect (SCE) that would cause severe problems in the sub 20nm regime.[Ouyang et al. IEEE Trans. Electron Devices 53, 8, 1732 (2007)] Because source/drain barriers induce a depletion region, it is possible that the barriers are overlapped in short channel SB-FETs. In order to analyze the SCE of SB-FETs, we carried out systematic studies on the Schottky barrier overlapping in short channel SB-FETs using a SILVACO ATLAS numerical simulator. We have investigated the variation of surface channel band profiles depending on the doping, barrier height and the effective channel length using 2D simulation. Because the source/drain depletion regions start to be overlapped each other in the condition of the $L_{ch}$~80nm with $N_D{\sim}1\times10^{18}cm^{-3}$ and $\phi_{Bn}$ $\approx$ 0.6eV, the band profile varies as the decrease of effective channel length $L_{ch}$. With the $L_{ch}$~80nm as a starting point, the built-in potential of source/drain schottky contacts gradually decreases as the decrease of $L_{ch}$, then the conduction and valence band edges are consequently flattened at $L_{ch}$~5nm. These results may allow us to understand the performance related interdependent parameters in nanoscale SB-FETs such as channel length, the barrier height and channel doping.

• Korean Journal of Plant Resources
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• v.20 no.5
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• pp.409-423
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• 2007

The flora and the useful economic plants of Mt. Gangcheon was investigated from March to November, 2005. Vascular plants of this area consisted of total 379 taxa; 6 forms, 45 varieties, 328 species, 253 genera, 97 families. It corresponds to 9.31% of totally 4,071 taxa distributed in Korea. The useful plants of this area were 315 taxa. It corresponds to 83.1% of collected plants in this area. Among the useful plants, there were 161 taxa of edible source, 121 taxa of pastural source, 147 taxa of medicinal source, 82 taxa of ornamental source, 11 taxa of timber source, 14 taxa of industrial source. Korean endemic plants were composed of 16 taxa - 14 families, 16 genera, 12 species, 3 varieties, 1 forma. It corresponded to 4.2% of collected materials. The floristic specialized species of $III{\sim}V$ grades were 9 taxa, it correspond to 2.3% of collected materials. The naturalized plants were 15 taxa, it corresponded to 6.7% of 225 taxa distributed in Korea.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.31-36
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• 2003

We investigated dry etching of GaAs and AlGaAs in a high density planar inductively coupled plasma system with $BCl_3$ and $BCl_3/Ar$ gas chemistry. A detailed process study as a function of ICP source power, RIE chuck power and $BCl_3/Ar$ mixing ratio was performed. At this time, chamber pressure was fixed at 7.5 mTorr. The ICP source power and RIE chuck power were varied from 0 to 500 W and from 0 to 150 W, respectively. GaAs etch rate increased with the increase of ICP source power and RE chuck power. It was also found that etch rate of GaAs in $BCl_3$ gas with 25% Ar addition was superior to that of GaAs in a pure $BCl_3$ (20 sccm $BCl_3$) plasma. The result was same with AlGaAs. We expect that high ion-assisted effect in $BCl_3$/Ar plasma increased etch rates of both materials. The GaAs and AIGaAs features etched at 20 sccm $BCl_3$ and $15BCl_3/5Ar$ with 300 W ICP source power, 100 W RIE chuck power and 7.5 mTorr showed very smooth surfaces(RMS roughness < 2 nm) and excellent sidewall. XPS study on the surfaces of processed GaAs also proved extremely clean surfaces of the materials after dry etching.

• Korean Journal of Crystallography
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• v.8 no.2
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• pp.105-110
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• 1997

1μm-CdS films for a window layer of CdS/CuInSe2 solar cell have been prepared by vacuum of 1x10-3 mTorr. Source and substrate temperature ranges were used 800-1100'C and 50-200℃ respectively. Structural, electircal and optical properties of CdS films have been investigated by X-ray diffractometer (XRD), scanning electron microscopy (SSEM), electrical resistivity, the Hall measurement and optical transmission spectra. Electrical resistivity and optical transmission of the CdS films decreased with the increase in CdS source temperature without substrate heating. All the films had hexagonal structure and strong texture with (002) orientation of grain normal to the substrate glass. CdS films evaporated at 1000℃ were the highest electrical conductivity of 0.9(S/cm). Electrical resistivity and optical transmission at the substrate temperature of 100℃ were 40(Ω,cm) and 80% respectively.

• Journal of KSNVE
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• v.7 no.4
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• pp.621-629
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• 1997

For computer aided design and costruction of low noisy power plants, indoor and outdoor noise prediction program has been developed. The program utilizes the predefined data of noise sources and building materials and has the faculty to estimate the source level using the empirical formula in case of the measured data not being available. In the noise prediction, the mutual noise propagation between indoor and outdoor sites are considered. The outdoor noise source in the calculation of geometric divergence effects is modelled as the omni-directional finite line or planar source according to the source geometry and the receiving points. Outdoor noise prediction is carried out to consider the diffraction effect due to plant structures as well as the attenuation effect due to atmospheric absorption and soft ground. The results of indoor and outdoor noise prediction for a recently constructed diesel engine power plant show good agreement with the measured.

• Korean Journal of Materials Research
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• v.7 no.2
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• pp.93-101
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• 1997

Lead titanate박막을 $Pt/Ti/SiO_{2}/Si(Pt/Ti기판)와\;Pt/Ta/SiO_{2}/SiO_{2}$Si(Pt/Ta 기판) 위에서 전자 사이크로트론 공명플라즈마 화학증착법(ECR PECVD)으로 증착하였다. 증착온도, 산소유입량, MO source유입비등의 증착변수에 따른 lead titanate박막의 조성과 미세구조를 주사전자현미경(SEM), 투과전자현미경(TEM), X선 회절법(XRD)으로 조사하였다. 산소유입량이 적을 경우,Tisource와 Pb source의 산소화의 반응성 차이 때문에 Pb 농도가 부족한 화학양론비가 잘 맞는 박막이 증착되었다. Pt/ti기판은 lead titanate박막증착도중 기판의 Ti층과 Pt층의 확산으로 기판변형이 발생하는 반면, Pt/Ta기판은 기판변형이 일어나지 않았다. Pt/Ta기판에서 페롭스카이트 화학양론비를 갖는 매우 평탄한 lead titanate박막을 증착 하였는데, 산소유입량이 lead titanate박막의 결정성을 크게 지배하였다.

• Korean Journal of Materials Research
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• v.14 no.9
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• pp.619-626
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• 2004

Pulsed metalorganic chemical vapor deposition (MOCVD) of conformal copper seed layers, for the electrodeposition Cu films, has been achieved by an alternating supply of a Cu(I) source and $H_2$ reactant at the deposition temperatures from 50 to $100^{\circ}C$. The Cu thickness increased proportionally to the number of cycles, and the growth rate was in the range from 3.5 to $8.2{\AA}/cycle$, showing the ability to control the nano-scale thickness. As-deposited films show highly smooth surfaces even for films thicker than 100 nm. In addition about a $90\%$ step coverage was obtained inside trenches, with an aspect ratio greater than 30:1. $H_2$, introduced as a reactant gas, can play an active role in achieving highly conformal coating, with increased grain sizes.

• Korean Journal of Materials Research
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• v.23 no.12
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• pp.702-707
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• 2013

High-quality ${\beta}$-silicon carbide (SiC) coatings are expected to prevent the oxidation degradation of carbon fibers in carbon fiber/silicon carbide (C/SiC) composites at high temperature. Uniform and dense ${\beta}$-SiC coatings were deposited on carbon fibers by low-pressure chemical vapor deposition (LP-CVD) using silane ($SiH_4$) and acetylene ($C_2H_2$) as source gases which were carried by hydrogen gas. SiC coating layers with nanometer scale microstructures were obtained by optimization of the processing parameters considering deposition mechanisms. The thickness and morphology of ${\beta}$-SiC coatings can be controlled by adjustment of the amount of source gas flow, the mean velocity of the gas flow, and deposition time. XRD and FE-SEM analyses showed that dense and crack-free ${\beta}$-SiC coating layers are crystallized in ${\beta}$-SiC structure with a thickness of around 2 micrometers depending on the processing parameters. The fine and dense microstructures with micrometer level thickness of the SiC coating layers are anticipated to effectively protect carbon fibers against the oxidation at high-temperatures.

• Nuclear Engineering and Technology
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• v.55 no.8
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• pp.2984-2996
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• 2023

A 100 kW thermal power pool-type light water reactor and Pu(Be) as a fast neutron source were used to determine the appropriate carrier for irradiating boron-containing samples with neutron beams. The tested materials (carriers) were subjected to neutron beams in the reactor's tangential channel. The geometrical arrangement of experimental facilities relative to the neutron beam trajectory, as well as the effect of sample thickness on the count rate, were investigated. The majority of the detectable charged particles emitted by the neutron beam's interaction with tested materials and the detector's detecting layer are protons (recoiled hydrogen) and particles generated in nuclear reactions (protons and alpha particles), respectively. Stopping and Range of Ions in Matter (SRIM) software was used to do theoretical calculations for the range of expected released particles in various materials, including human tissue. The results of measurement and calculation are in good agreement. According to experiments and theoretical calculations, the number of protons emitted by tissue-like materials may commit a dose comparable to that of boron capture reactions. Furthermore, the range of protons is significantly larger than that of alpha particles, which most probably changes dose distribution in healthy cells surrounding the tumor, which is undesirable in the BNCT approach.

• Korean Journal of Materials Research
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• v.17 no.10
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• pp.509-515
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• 2007

In order to fabricate adhesiveless 2-layer flexible copper clad laminate (FCCL) used for COF (chip on film) with high peel strength, polyimide (PI; Kapton-EN, $38\;{\mu}m$) surface was modified by reactive $O_2^+$ and $N_2O^+$ ion beam irradiation. 300 mm-long linear electron-Hall drift ion source was used for ion irradiation with ion current density (J) higher than $0.5\;mA/cm^2$ and energy lower than 200 eV. By vacuum web coating process, PI surface was modified by linear ion source and then 10-20 nm thick Ni-Cr and 200 nm thick Cu film were in-situ sputtered as a tie layer and seed layer, respectively. Above this sputtered layer, another $8-9{\mu}m$ thick Cu layer was grown by electroplating and subsequently acid and base resistance and thermal stability were tested for examining the change of peel strength. Peel strength for the FCCLs treated by both $O_2^+$ and $N_2O^+$ ion irradiation showed similar magnitudes and increased as the thickness of tie layer increased. FCCL with Cu (200 nm)/Ni-Cr (20 nm)/PI structure irradiated with $N_2O^+$ at $1{\times}10^{16}/cm^2$ ion fluence was proved to have a strong peel strength of 0.73 kgf/cm for as-received and 0.34 kgf/cm after thermal test.