• 전기전자학회논문지
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• 제17권2호
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• pp.129-134
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• 2013

For the conventional power metal-oxide semiconductor field-effect transistor (MOSFET) device structure, there exists a tradeoff relationship between specific on-resistance ($R_{ON.SP}$) and breakdown voltage ($V_{BR}$). In order to overcome the tradeoff relationship, a uniform super-junction (SJ) trench metal-oxide semiconductor field-effect transistor (TMOSFET) structure is studied and designed. The structure modeling considering doping concentrations is performed, and the distributions at breakdown voltages and the electric fields in a SJ TMOSFET are analyzed. The simulations are successfully optimized by the using of the SILVACO TCAD 2D device simulator, Atlas. In this paper, the specific on-resistance of the SJ TMOSFET is successfully obtained 0.96 $m{\Omega}{\cdot}cm^2$, which is of lesser value than the required one of 1.2 $m{\Omega}{\cdot}cm^2$ at the class of 100 V and 100 A for BLDC motor.

• 대한전기학회논문지
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• 제44권4호
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• pp.490-495
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• 1995

A bipolar junction transistor which exihibits 1000V breakdown voltage is designed and fabricated using FLR (Field Limiting Rings). Three dimensional effects on the breakdown voltage is investigated in the cylindrical coordinate and the simulation results are compared with the results in the rectangular coordinate. Breakdown voltage of the device with 3 FLR is simulated to be 1420V in the cylindrical coordinate while it is 1580V in rectangular coordinate. Bipolar junction transistor has been fabricated using the epitaxial wafer of which resistivity is 86 .OMEGA.cm and thickness is 105 .mu.m. Si$_{3}$N$_{4}$ and glass are employed for the passivation. Breakdown of the fabricated device is measured to be 1442V which shows better greement with the simulation results in cylindrical coordination.

• 한국재료학회지
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• 제32권8호
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• pp.333-338
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• 2022

In this work, we developed silver nanowires and a silicon based Schottky junction and demonstrated ultrafast broadband photosensing behavior. The current device had a response speed that was ultrafast, with a rising time of 36 ㎲ and a falling time of 382 ㎲, and it had a high level of repeatability across a broad spectrum of wavelengths (λ = 365 to 940 nm). Furthermore, it exhibited excellent responsivity of 60 mA/W and a significant detectivity of 3.5 × 10¹² Jones at a λ = 940 nm with an intensity of 0.2 mW cm^-2 under zero bias operating voltage, which reflects a boost of 50 %, by using the AC PV effect. This excellent broadband performance was caused by the photon-induced alternative photocurrent effect, which changed the way the optoelectronics work. This innovative approach will open a second door to the potential design of a broadband ultrafast device for use in cutting-edge optoelectronics.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1998년도 하계종합학술대회논문집
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• pp.867-870
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• 1998

In this paper we simulated 0.30um NMOS transitor to analysis hot carrier degradation depend on As, As+P, P LDD structure. As a result we obtained As+P LDD structure was good hot carrier immunity. Also we find that hog carrier life time improved a sincresing P dose due to P dose helps in grading the nLDD junction. However As-only junction was poor due to junction high peak position located near the surface.

• EDISON SW 활용 경진대회 논문집
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• 제5회(2016년)
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• pp.347-349
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• 2016

본 논문에서는 dopant density에 의존적인 pn junction의 breakdown 특성을 향상시키기 위하여, doping density와 doping profile에 대하여 분석했다. Doping density와 doping profile은 역방향 junction breakdown voltage를 결정하는 중요한 요소인 공핍영역의 두께와 공핍영역 내에 인가되는 electric field를 결정한다. Uniform doping profile과 Gaussian doping profile을 비교했고, 고전압 환경에서 사용할 수 있는 소자를 제작하는데 더욱 적절한 doping profile과 doping 농도에 대해 기술했다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1994년도 춘계학술대회 논문집
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• pp.152-153
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• 1994

A recessed $n^{+}$-p junction diode with the serf-aligned structure is proposed and fabricated by using the polysilicon as an $n^{+}$ diffusion source. The diode structure can be applicable to the emitter-base formation of high performance bipolar device and the $n^{+}$ polysilicon emitter has an important effect on the device characteristics. The considered parameters for the polysilicon formation are the deposition condition $As^{+}$ dose for the doping of the polysilicon, and the annealing using RTP system. The vertical depth profiles of the fabricated diode are obtained by SIMS. The eleotrical characteristics are analyzed in trims of the ideality factor of diode (n), contact resistance arid reverse leakage current. The $As_{+}$ dose for the formation of good junction is current. The $As^{+}$ dose for the formation of goodjunctions is about 1∼2${\times}$$10^{16}$$cm^{-2}$ at given RTA condition ($1100^{\circ}C$, 10 sec). The $n^{+}$-p structure is successfully applied to the self-aligned bipolar device adopting a single polysilicon technology.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2001년도 춘계종합학술대회
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• pp.349-352
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• 2001

본 논문은 기가 SRAM급 이상의 초고집적을- 위한 0.1$\mu\textrm{m}$의 설계치수를 갖는 MOSFET의 게이트 영역에서 활성 부분의 면저항을 감소시키기 위해 n영역으로 비소를 이온 주입하였다. 어닐링은 급속 열처리 공정 방법과 엑시머 레이져 어닐링 방법을 이용하였으며, 극히 얕은 접합의 형성이 가능하였다. 얕은 접합 형성 깊이는 10~20nm이며, 비소의 주입량은 2$\times$$10^{14}$ $\textrm{cm}^2$이고, 레이져는 엑시머이며 소스는 KrF로 파장은 248mm로 어닐링 하였다. 극히 얕은 P/N$^{+}$ 접합 깊이가 15nm이며, 이때 1k$\Omega$/$\square$의 낮은 면저항 특성을 갖는 결과가 나타났다.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2003년도 somma/kms meeting
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• pp.307-307
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• 2003

• 산업기술연구
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• 제13권
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• pp.25-31
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• 1993

This paper presents an analysis of microwave device component. An H-Plane waveguide component with arbitrary shape is analyzed using finite element method(FEM) cooperated with boundary element method(BEM). The finite element method(FEM) is applied to the junction region and the boundary element method(BEM) to the waveguide region. For the application of BEM in the waveguide structure, a ray representation of the waveguide Green's function is used. The proposed technique was applied to the analysis of the waveguide inductive junction to compare the numerical result with the result of the mode matching technique. The comparison showed good agreements between the two results. Transmitted powers were also computed in T-junction waveguides for the various shape of the junction area.

• 한국전기전자재료학회논문지
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• 제28권8호
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• pp.496-500
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• 2015

This paper was proposed the theoretical research and optimal design 3000V super junction NPT IGBT for using electrical automotive and power conversion. Because super junction IGBT was showed ultra low on resistance, it was structure that can improve the thermal characteristics of conventional NPT IGBT. The electrical characteristics of super junction NPT IGBT were 2.52 V of on state voltage drop, 4.33 V of threshold voltage and 2,846 V breakdown voltage. We did not obtaing 3,000 V breakdown voltage but we will obtain 3,000 V breakdown voltage through improving p pillar layer. If we are carried this research, This device will be used electrical automotive, power conversiton and high speed train.