• 대한토목학회논문집
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• 제26권4D호
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• pp.587-592
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• 2006

Airside 지역 콘크리트 포장의 조인트에 사용되는 충진재는 항공기 이 착륙시 엔진에서 뿜어져 나오는 고열의 후폭풍과 계류장에서 항공기의 정비 및 주유시 항공유 유출에 대한 저항성을 가지고 있어야 한다. 이러한 특성 때문에 공항용 조인트 충진재는 도로포장용과는 다른 충진재의 사용이 요구되고 있다. 본 연구에서는 국내외에서 사용되고 있는 3 종류의 충진재에 대하여 물리적 특성 시험과 성능시험을 실시하였다. 시험재료는 폴리썰파이드, 폴리우레탄, 실리콘을 사용하였다. 시험결과 폴리썰파이드 충진재는 내열성과 내유성에 대한 저항성이 가장 우수하였으며, 폴리우레탄, 실리콘 충진재의 순으로 시험결과가 나타났다. Airside 지역별 특성을 고려했을 때, 폴리썰파이트 충진재는 활주로와 계류장에, 폴리우레탄 충진재는 유도로에 사용하는 것이 적절하며 실리콘 충진재는 Airside 지역 충진재로는 부적합한 것으로 나타났다.

• Current Photovoltaic Research
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• 제4권2호
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• pp.59-63
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• 2016

A key point of a soldering process for photovoltaic (PV) modules is to increase an adhesive strength leading a low resistivity between ribbon and cell. In this study, we intended to optimize a heating condition for the soldering process and characterize the soldered joint via physical and chemical analysis methods. For the purpose, the heating conditions were adjusted by IR lamp power, heating time and hot plate temperature for preheating a cell. Since then the peel test for the ribbon and cell was conducted, consequently the peel strength data shows that there is some optimum soldering condition. In here, we observed that the peel strength was modified by increasing the heating condition. Such a soldering property is affected by a various factors of which the soldered joint, flux and bus bar of the cell are changed on the heating condition. Therefore, we tried to reveal causes determining the soldering property through analyzing the soldered interface.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2000년도 특별강연 및 춘계학술발표대회 개요집
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• pp.189-192
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• 2000

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2001년도 춘계학술발표대회 개요집
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• pp.277-278
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• 2001

• 대한금속재료학회지
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• 제47권4호
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• pp.261-266
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• 2009

The mechanical and electrical properties of ball grid array (BGA) solder joints were measured, consisting of Sn-3.5Ag, with organic solderability preservative (OSP)-finished Cu pads and Electroless Nickel/Immersion Gold (ENIG) surface finishes. The mechanical properties were measured by die shear test. When ENIG PCB was upper joint and OSP PCB was lower joint, the highest shear force showed at the third reflow. When OSP PCB was upper joint and ENIG PCB was lower joint, the highest shear force showed at the forth reflow. For both joints, after the die shear results reached the highest shear force, shear force decreased as a function of increasing reflow number. Electrical property of the solder joint decreased with the function of increasing reflow number. The scanning electron microscope results show that the IMC thickness at the bonding interface gets thicker while the number of reflow increases.

• 소음진동
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• 제5권4호
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• pp.537-542
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• 1995

In this paper the method of modeling and optimization for the joint of the vehicle structure is proposed. First it is described that the method of substituting equivalent beam elements to spring elements for the joint. The stiffnesses of the spring elementsare calculated using the section properties of equivalent beam elements. To get required dynamic characteristics section properties of equivalent beam element are set to design variables and optimized. The study shows that joint stiffnesses can be effectively determined in designing vehicle structure.

• Journal of Welding and Joining
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• 제13권3호
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• pp.125-133
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• 1995

Rene80 superalloy was liquid phase diffusion bonded by using pure boron (B) as an insert material. As a basic study for the possibility of practical application of this bonding method, hardness and high temperature tensile strength of the bonded joint and metallurgical analysis were investigated. As experimental results, hardness of the bonded joint was homogenized after bonding and the tensile strength at 1144K was obtained to 90% of that of base metal. But there were some problems to be improved also, that means the joint was hardened after bonding due to increase of B content and elongation was much lower than that of base metal. Flat area and (Mo, Cr, W) boride, which should be harmful for bonding strength, were observed on the fractured surface of the tensile tested specimen.

• 한국기계가공학회지
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• 제16권1호
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• pp.102-111
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• 2017

An automobile ball joint is the element for connecting the control arm and the knuckle arm, allowing rotational motion. The ball joint consists of the stud, plug, socket, and seat. These components are assembled through the caulking process that consists of plugging and spinning. In the existing research, the pull-out strength and gap stiffness were calculated, but we did not consider the uncertainties due to the numerical analysis and production. In this study, the uncertainties of material property and tolerance are considered to predict the distributions of pull-out strength and gap stiffness. Also, pull-out strength and gap stiffness are predicted as the a distribution rather than one deterministic value. Furthermore, a robust design applying the Taguchi method is suggested.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2011년도 춘계 학술논문 발표대회 1부
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• pp.3-4
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• 2011

The purpose of this study is to suggest basic data for development optimal disassembly manufacturing system during analysis pore structure and heating properties of cementitious joint using conductive resister by induction heating. From the results, we knew cementitious joint is weak easily by heating of conductive resister, such as wire mesh, punching metal, and steel fiber, from induction heating.

• 대한수학회보
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• 제55권1호
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• pp.41-50
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• 2018

This paper mainly considers a tuple of multiplication operators on Bergman spaces over polydisks which essentially arise from a matrix, their joint reducing subspaces and associated von Neumann algebras. It is shown that there is an interesting link of the non-triviality for such von Neumann algebras with the determinant of the matrix. A complete characterization of their abelian property is given under a more general setting.