• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.1190-1193
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• 2004

The purpose of this study is to evaluate the possibility of identifying joint damping property through commercially available isokinetic ergometer (BIODEX). The proposed method is to estimate the damping torque of the knee joint from the difference between the external joint torque for maintaining isokinetic movement and the gravity torque of the lower leg. The damping torque was estimated at various joint angular velocities, from which the damping property would be derived. Measurement setup was composed of the BIODEX system with an external force sensor and Labview system. Matlab was used in the analysis of the damping property. The experimental result showed that the small variation in angular velocity due to acceleration and deceleration of the crank arm resulted in greater change of inertial torque than the damping torque, so that the estimation of damping property from the isokinetic movement is difficult.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.05a
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• pp.202-209
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• 2007

Vehicle body frame stiffness affects the dynamic and static characteristics. Vehicle frame structural performance is greatly affected by crossmember and joint design. While the structural characteristics of these joints vary widely, there is no known tool currently in use that quickly predicts joint stiffness early in design cycle. This paper presents the joint design factors affecting on low frequency vibration. The joint factors are joint panel thickness, section property, flange width and weld point space. To study the effect on vehicle low frequency vibration, case studies for these factors are performed. And Sensitivity analysis for section property is performed. The result can present design guide for high-stiffness vehicle.

• 한국초전도학회:학술대회논문집
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• v.10
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• pp.298-303
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• 2000

We evaluated the electric properties of Bi-2223 jointed tapes processed by both resistive- and supercondcuting-joint methods. For the resistive-joint, filler materials of wood metal, Pb/Sn, In, and silver paste were used, whereas, for the superconductive-joint, the lap joint method were used. In the resistive-joint tape, it was observed that the electrical properties such as current transport property, n-value, and contact resistance of the tape were significantly related to the resistivity of filler materials. On the other hand, in the superconducting-joint tape, the current transport property was dependent on the uniaxial pressure. Specifically, the current transport property varied 50 to 80% with uniaxial pressure, probably due to the irregular microstructure in the transition region.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.217-217
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• 2009

In this study, the effect of bending strain on the transport property and critical current of lap and butt-jointed BSCCO tapes have been investigated. The samples were joined using a mechanically controlled jointing procedure. In order to ensure a uniform pressure application at the joint part, a single point contact has been devised and also to achieve a uniform thickness at the joint interface.

• Science of Emotion and Sensibility
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• v.7 no.4
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• pp.19-24
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• 2004

The purpose of this study is to evaluate the possibility of identifying joint damping property through commercially available isokinetic ergometer (BIODEX). The proposed method is to estimate the damping torque of the knee joint from the difference between the external joint torque for maintaining isokinetic movement and the gravity torque of the lower leg. The damping torque was estimated at various joint angular velocities, from which the damping property would be derived. Measurement setup was composed of the BIODEX system with an external force sensor and Labview system. Matlab was used in the analysis of the damping property. The experimental result showed that the small variation in angular velocity due to acceleration and deceleration of the crank arm resulted in greater change of inertial torque than the damping torque. Therefore, the estimation of damping property from the isokinetic movement is difficult.

• Earthquakes and Structures
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• v.17 no.4
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• pp.411-424
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• 2019

In this study, a numerical model of a shield tunnel with an assembled segmental lining was built. The seismic response of the segmental lining of the section of the shield tunnel in Line 1 of the Chengdu Metro is analyzed as it passes through the interface of sand-cobble and mudstone layers. To do so, the node-stress seismic-motion input method was used to input the seismic motion measured during the 2008 Wenchuan earthquake, and the joint openings and dislocations associated with the earthquake action were obtained. With reference to the Ethylene-Propylene-Diene Monomer (EPDM) sealing gaskets used in the shield tunnels in the Chengdu Metro, numerical simulation was applied to analyze the contact pressure along the seepage paths and the waterproof property under different joint openings and dislocations. A laboratory test on the elastic sealing gasket was also conducted to study its waterproof property. The test results accord well with the numerical results and the occurrence of water seepage in the section of the shield tunnel in Line 1 of the Chengdu Metro during the 2008 Wenchuan earthquake was verified. These research results demonstrate the deformation of segmental joint under earthquake, also demonstrate the relationship between segmental joint deformation and waterproof property.

• The Journal of the Korea Contents Association
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• v.13 no.1
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• pp.175-185
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• 2013

The judgement which is subject of research has denied legal rescission of division of the inherited property by agreement based on (1) the fact that the division of inherited property terminated at the time of concluding mutual agreement in its nature while only the relationship of claim and obligation between the inheritor who has paid for such obligation and the inheritor who has acquired such obligation in the mutual agreement remains (2) and the fact that the legal stability is considerably hindered as the re-partition of inherited property having retroactive effect becomes unavoidable in case of approving the legal rescission of the division of the inherited property by agreement. But it is reasonable to also approve legal rescission on the division of the inherited property by agreement in case the division by agreement actually has the nature such as conditional donation between joint heirs (1) from the fact that the division of the inherited property by agreement gets the nature of disposal equivalent to exchange, transfer and abandonment of share between joint heirs in actuality, (2) and the fact that there are no other theories in approving the validity of mutually agreed rescission despite the fact that the re-partition of inherited property having retroactive effect is unavoidable even in case of the mutually agreed rescission of the division by agreement among all joint heirs. However, as the division of the inherited property by agreement is a contract that gets concluded only if all joint heirs participate, even the legal rescission for the reason of not fulfilling the obligations paid by one party of the heirs during the division by agreement must be considered as possible only by expression of intentions from all other joint heirs excluding this one party.

• Journal of Welding and Joining
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• v.21 no.2
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• pp.64-69
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• 2003

The bonding phenomena and mechanical property of duplex stainless steel during brazing have been investigated. The UNS32550 was used for base metal, and the MBF50 was used for insert metal. Brazing was carried out under the various conditions (brazing temperature : 1473K, 1498K, holding time : 0∼1.8ks). There were various microconstituents in the bonded interlayer because of reaction between liquid insert metal and base metal. In the early stage of brazing, BN is formed in the bonded interlayer and base metal near the bonded layer. Cr made is formed in the bonded interlayer. The amount of BN and Cr nitrides decrease with the increase of bonding temperature and holding time. Superior shear strength of 550MPa is obtained by restraining the formation of nitrides. (Received January 17, 2003)

• Journal of Welding and Joining
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• v.25 no.2
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• pp.55-61
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• 2007

Flash butt weldability of 590MPa dual phase steel is carried out under micro metallographical examination and macro mechanical property tests. The objective of present study is to investigate the cause that brings on bond line fracture, and is to improve mechanical properties of the flash butt welded joint. The joint of flash butt welding has a superior tensile property, but has bad formability due to oxide formed at bond interface. The HAZ softening in the weld joint does not show. It was found that mechanical properties were increased with optimizing welding parameters and making application of oil dripping and post-weld heat treatment.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.41-47
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• 2010

The effect of PCB and BGA pad designs was investigated on the mechanical property of Pb-free solder joints. The mechanical property of solder joint was tested by three different test methods of drop impact tests, bending impact test, and high speed shear test. Two kinds of pad design such as NSMD (Non-Solder Mask Defined) and SMD (Solder Mask Defined) were applied with the OSP finished Pb-free solder (Sn-3.0Ag-0.5Cu, Sn-1.2Ag-0.5Cu). in the drop impact test and bending impact test, the characterized lifetime showed the same tendency, and SMD design showed better mechanical property of solder joint than NSMD regardless of test method, which was due to the different crack path. The fracture crack on SMD pad was propagated along the intermetallic compound (IMC) layer of solder joint, while the fracture crack on NSMD pad propagated through upper edge of land which shields pattern. In the high speed shear test, pad lift occurred on the solder joint of NSMD. SMD/SMD combination of pad design consequently illustrated the best mechanical property of BGA/PCB solder joint, followed by SMD/NSMD, NSMD/SMD, and NSMD/NSMD.