Development and properties of jointed Bi-2223 superconductor tape

  • Kim, Jung-Ho (School of Metallurgical and Materials Science Engeering) ;
  • Ji, Bong-Ki (School of Metallurgical and Materials Science Engeering) ;
  • Park, Hyung-Sang (School of Metallurgical and Materials Science Engeering) ;
  • Kim, Ho-Jin (School of Metallurgical and Materials Science Engeering) ;
  • Oh, Seung-Jin (School of Metallurgical and Materials Science Engeering) ;
  • Kim, Joong-Seok (School of Metallurgical and Materials Science Engeering) ;
  • Joo, Jin-Ho (School of Metallurgical and Materials Science Engeering) ;
  • Nah, Won-Soo (School of Electrical and Computer Engeering)
  • Published : 2000.08.16

Abstract

We evaluated the electric properties of Bi-2223 jointed tapes processed by both resistive- and supercondcuting-joint methods. For the resistive-joint, filler materials of wood metal, Pb/Sn, In, and silver paste were used, whereas, for the superconductive-joint, the lap joint method were used. In the resistive-joint tape, it was observed that the electrical properties such as current transport property, n-value, and contact resistance of the tape were significantly related to the resistivity of filler materials. On the other hand, in the superconducting-joint tape, the current transport property was dependent on the uniaxial pressure. Specifically, the current transport property varied 50 to 80% with uniaxial pressure, probably due to the irregular microstructure in the transition region.

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