• Proceedings of the KSME Conference
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• 2008.11a
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• pp.996-999
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• 2008

Aspheric polymer lens fabrication using isothermal compression molding is presented in this paper. Due to increasing definition of an image sensor, higher precision is required by a lens which can be used as a part of an imageforming optical module. Injection molding is a factory standard method for a polymer optical lens. But achievable precision using injection molding has a formidable limitation due to the machining of complex mold structure and melting and cooling down a polymer melt under high pressure condition during forming process. To overcome the precision requirement and limitation using injection molding method, isothermal compression molding is applied to fabrication of a polymer optical lens. The fabrication condition is determined by numerical simulations of temperature distribution and given material properties. Under the found condition, the lens having a high precision can successfully be reproduced and does not show birefringence which results often in optical degradation.

• Journal of the Korean institute of surface engineering
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• v.24 no.4
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• pp.196-205
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• 1991

Multi-level thin films are very important in ULSI applications because of their high electromigration resistance. This study presents the effects of titanium, titanium nitride and titanium tungsten underlayers of the stability of multi-aluminum thin films during isothermal annealing. High purity Al(99.999%) films have been electron-beam evaporated on Ti, TiN, TiW films formed on SiO2/Si (P-type(100))-wafer substrates by RF-sputtering in Ar gas ambient. The hillock growth was increased with annealing temperatures. Growth of hillocks was observed during isothermal annealing of the thin films by scanning electron microscopy. The hillock growth was believed to appear due to the recrystallization process driven by stress relaxation during isothermal annealing. Thermomigration damage was also presented in thin films by grain boundary grooving processes. It is shown that underlayers of Al/TiN/SiO2, Al/TiW/SiO2 thin films are preferrable to Al/SiO2 thin film metallization.

• Journal of the Korean Applied Science and Technology
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• v.24 no.3
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• pp.278-286
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• 2007

As a part of enhancing the performance of wood-plastic composites (WPC), polypropylene (PP)/ nanoclay (NC)/ wood flour (WF) nanocomposites were prepared using melt blending and injection molding process to evaluate their thermal stability. Thermogravimetric analysis (TGA) was employed to investigate thermal degradation kinetics of the nanocomposites both dynamic and isothermal conditions. Dynamic scans of the TGA showed an increased thermal stability of the nanocomposites at moderate wood flour concentrations (up to 20 phr, percentage based on hundred percent resin) while it decreased with the addition of 30 phr wood flour. The activation energy $(E_a)$ of thermal degradation of nanocomposites increased when nanoclay was added and the concentration of wood flour increased. Different equations were used to evaluate isothermal degradation kinetics using the rate of thermal degradation of the composites, expressed as weight loss (%) from their isothermal TGA curves. Degradation occurred at faster rate in the initial stages of about 60 min., and then proceeded in a gradual manner. However, nanocomposites with wood flour of 30 phr heated at $300^{\circ}C$ showed a drastic difference in their degradation behavior, and reached almost a complete decomposition after 40 min. of the isothermal heating. The degree of decomposition was greater at higher temperatures, and the residual weight of isothermal degradation of nanocomposites greatly varied from about 10 to 90%, depending on isothermal temperatures. The isothermal degradation of nanocomposites also increased their thermal stability with the addition of 1 phr nanoclay and of wood flour up to 20 phr. But, the degradation of PP100/NC1/MAPP3/WF30 nanocomposites with 30 phr wood flour occurs at a faster rate compared to those of the others, indicating a decrease in their thermal stability.

• Journal of the Korean Institute of Telematics and Electronics
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• v.27 no.12
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• pp.1841-1851
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• 1990

Self-aligned gate GaAs MESFETs using ion beam deposited tungsten applicable to GaAs LSI fabrication process have been fabricated. Silicon implanted samples were annealed using isothermla two step RTA process and conventional one step RTA process. The electrical and physicla characteristics of annealed samples were investigated using Hall and I-V measurements. As results of measurements, activation characteristics of the isothermal two step RTA process are better than those of one step annealed ones. Using the developed processes, GaAs SAFETs (Self-Aligned Gate FET) have been fabricated and electdrical characteirstics are measured. As results, subthreshold currents of SAGFETs are 6x10**-10 A/\ulcorner, that is compatible to conventional MESFET, maximum transconductances of 0.75\ulcorner gate MESFET using one step RTA process and 2\ulcorner gate MESFET using isothermal two step RTA process are 18 mS/mm, 41 mS/mm respectively.

• Journal of Adhesion and Interface
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• v.14 no.1
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• pp.21-27
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• 2013

Cellulose-based rayon fibers or fabrics can be thermally decomposed very fast within a narrow temperature window during stabilization process. Therefore the stabilization stage is critically important for producing rayon-based carbon fibers. Consequently, in the present study the effects of isothermal stabilization and ultrasonic cleaning on the weight loss, chemical composition, microstructure, and fabric texture of cellulose-based rayon fabrics were explored. The temperature of the isothermal stabilization process performed in the range of $200{\sim}240^{\circ}C$ influenced the processing time, carbon and oxygen contents, cellulose structural change, and fabric texture. The ultrasonic cleaning, which was conducted prior to the stabilization process, played a role in shortening the stabilization time, increasing the carbon contents, decreasing the oxygen contents, and changing the XRD pattern. Also, it was considered that the ultrasonic cleaning contributed to retarding the weight loss, to reducing the thermal shrinkage, and further to reducing the fast physical change of rayon fabrics.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.11
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• pp.2954-2966
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• 1994

The characteristics and good corrosion resistance at room and elevated temperatures led to increasing application of Ti-alloys such as aircraft, jet engine, turbine wheels. In forging of Ti-alloy at high temperature, die chilling and die speed should be carefully controlled because the flow stress of Ti-alloy is sensitive to temperature, strain and strain-rate. In this study, the forging of turbine disk was numerically simulated by the finite element method for hot-die forging process and isothermal forging process, respectively. The effects of the temperature changes, the die speed and the friction factor were examined. Also, local variation of process parameters, such as temperature, strain and strain-rate were traced during the simulation. It was shown that the isothermal forging with low friction condition produced defect-free disk under low forging load. Consequently, the simulational information will help industrial workers develope the forging of Ti-alloys including 'preform design' and 'processing condition design'. It is also expected that the simulation method can be used in CAE of near net-shape forging.

• Korean Journal of Materials Research
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• v.12 no.5
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• pp.375-381
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• 2002

N-type ${\beta}-FeSi_2$ with a nominal composition of $Fe_{0.98}Co_{0.02}Si_2$ powders has been produced by mechanical alloying process and consolidated by vacuum hot pressing. As-milled powders were of metastable state and fully transformed to ${\beta}-FeSi_2$ phase by subsequent isothermal annealing. However, as-consolidated $Fe_{0.98}Co_{0.02}Si_2$ consisted of untransformed mixture of ${\alpha}-Fe_2Si_ 5$ and $\varepsilon$-FeSi phases. Isothermal annealing has been carried out to induce the transformation to a thermoelectric semiconducting ${\beta}-FeSi_2$ phase. The transformation behavior of ${\beta}-FeSi_2$ was investigated by utilizing DTA, a modified TGA under magnetic field, SEM, and XRD analyses. Isothermal annealing at $830^{\circ}C$ in vacuum led to the thermoelectric semiconducting ${\beta}-FeSi_2$ phase transformation, but some residual metallic $\alpha$ and $\varepsilon$ phases were unavoidable even after prolonged annealing. Thermoelectric properties were remarkably improved by isothermal annealing due to the transformation from metallic $\alpha$ and $\varepsilon$ phases to semiconducting phases.

• Journal of the Korean institute of surface engineering
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• v.43 no.6
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• pp.309-314
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• 2010

The numerical study for the effect of various factors that affect the temperature distribution of the process glass installed above the large rectangular heater plate was carried out. For the calculation, heat flux, distance between heat source and process glass plate, effect of vacuum condition and convection in a chamber were considered as important factors. The results showed that the temperature gradient on the glass was increased at the natural convection because of the buoyancy force increases due to the heated air. Also, the more heat flux and distance between the heater plate and glass increases, the more increasing the temperature gradient was. In the case of isothermal heating wall, the temperature variation was smaller than the uniform heat flux condition.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.5 no.2
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• pp.56-64
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• 2006

Rapid progress in many branches of technology has led to a demand on new materials such as high strength light weight alloys, powdered alloys and composite materials. The hydrostatic extrusion is essentially a method of extruding a clad rod through a die. In order to investigate the effect of the process conditions such as friction heat, deformation and clad thickness on the clad extrusion process, viscoplastic finite element simulations were conducted. A specific model for theoretical analysis used in this study is The single scalar variable version of Hart's model. An experiment also has been carried out using 1.5MN hydrostatic extruder with variable speed ram, LVDT and load cell for comparison. It is found that the hydrostatic extrusion pressure considering the effect of heat dissipation in this theoretical work was closer to the experimental pressure than the isothermal hydrostatic extrusion pressure.

• Journal of Welding and Joining
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• v.35 no.1
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• pp.89-94
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• 2017

The microstructure and dilatation for 0.15C steels were investigated to define the phase transformation during the quenching and partitioning (Q&P) process. For the one step Q&P dilatation, the isothermal martensite/bainite transformation occurred because the holding temperature was between $M_s$ and $M_f$. The isothermally transformed martensite/bainite and the athermally transformed martensite were produced by a loss of retained austenite. As the holding time increased, new martensite-start ($M_s$) temperature produced from the final quenching process decreased due to the carbon partitioning from the martensite to the retained austenite. This was the direct evidence of increment for the retained austenite stability. For the two step Q&P dilatation, the isothermal bainitic transformation occurred because the partitioning temperature was larger than the $M_s$ and new $M_s$. The partitioning at $400^{\circ}C$ indicated the short incubation period for the bainite transformation than the $350^{\circ}C$ partitioning because the partitioning at $400^{\circ}C$ should acquire the larger thermal driving force for carbon partitioning than the $350^{\circ}C$ partitioning. A quick drop of $M_s$ and short period of bainite incubation for the $400^{\circ}C$ partitioning steel were also the direct evidence of significant effects of carbon partitioning on the stability of retained austenite.