• 한국진공학회:학술대회논문집
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• 한국진공학회 2005년도 제29회 학술발표회 초록집
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• pp.191-191
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• 2005

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2000년도 추계학술발표회 초록집
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• pp.83-84
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• 2000

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 1998년도 추계학술발표회 초록집
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• pp.81-81
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• 1998

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 1998년도 추계학술발표회 초록집
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• pp.82-83
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• 1998

• 한국표면공학회지
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• 제55권6호
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• pp.460-468
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• 2022

Due to its high electrical conductivity, low contact resistance, good weldability and high corrosion resi-stance, gold is widely used in electronic components such as connectors and printed circuit boards (PCB). Gold ion salts currently used in gold plating are largely cyan-based salts and non-cyanic salts. The cya-nide bath can be used for both high and low hardness, but the non-cyanide bath can be used for low hardness plating. Potassium gold cyanide (KAu(CN)₂) as a cyanide type and sodium gold sulfite (Na₃[Au(SO)₃]₂) salt as a non-cyanide type are most widely used. Although the cyan bath has excellent performance in plating, potassium gold cyanide (KAu(CN)₂) used in the cyan bath is classified as a poison and a toxic substance and has strong toxicity, which tends to damage the positive photoresist film and make it difficult to form a straight side-wall. There is a need to supplement this. Therefore, it is intended to supplement this with an eco-friendly process using sodium sulfite sodium salt that does not contain cyan. Therefore, the main goal is to form a gold plating layer with a controllable hardness using a non-cyanide gold plating solution. In this study, the composition of a non-cyanide gold plating solution that maintains hardness even after annealing is generated through gold-palladium alloying by adding thallium, a crystal regulator among electrolysis factors affecting the structure and hardness, and changes in plating layer structure and crystallinity before and after annealing the correlation with the hardness.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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• pp.625-627
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• 2002

MgO thin films were deposited on glass and (100) Si substrates by an Arc Ion Plating (AIP) equipment using a magnesium metal target at various oxygen gas flow. In this work, we investigated the relationship between the structural properties and the discharge characteristics of MgO coating layers. X-ray diffraction and AFM have been used to study behaviors of the structure and surface morphology. The optical transmittance and the ion induced secondary electron emission coefficient of the MgO films have been also measured. The resistivity of the deposited MgO films was gradually increased from 0.17 G ohm/${\square}$ to 0.35 G ohm/${\square}$ with the oxygen gas flow. The growth rate of the MgO coating layer was decreased with increasing the oxygen gas flow, while the optical transmittance was improved.

• Journal of Electrochemical Science and Technology
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• 제11권1호
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• pp.92-98
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• 2020

SnO₂-based high-capacity anode materials are attractive candidate for the next-generation high-performance lithium-ion batteries since the theoretical capacity of SnO₂ can be ideally extended from 781 to 1494 mAh g^-1. Here 3D etched Cu foam is applied as a current collector for electron path and simultaneously a substrate for the SnO₂ coating, for developing an integrated electrode structure. We fabricate the 3D etched Cu foam through an auto-catalytic electroless plating method, and then coat the SnO₂ onto the self-supporting substrate through a simple sol-gel method. The catalytic dissolution of Cu metal makes secondary pores of both several micrometers and several tens of micrometers at the surface of Cu foam strut, besides main channel-like interconnected pores. Especially, the additional surface pores on etched Cu foam are intended for penetrating the individual strut of Cu foam, and thereby increasing the surface area for SnO₂ coating by using even the internal of Cu foam. The increased areal capacity with high structural integrity upon cycling is demonstrated in the SnO₂-coated 3D etched Cu foam. This study not only prepares the etched Cu foam using the spontaneous chemical reactions but also demonstrates the potential for electroless plating method about surface modification on various metal substrates.

• 한국세라믹학회지
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• 제54권6호
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• pp.511-517
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• 2017

With different working pressures and substrate biases, Cr-Al-N coatings were deposited by hybrid physical vapor deposition (PVD) method, consisting of unbalanced magnetron (UBM) sputtering and arc ion plating (AIP) processes. Cr and Al targets were used for the arc ion plating and the sputtering process, respectively. Phase analysis, and composition, binding energy, and microstructural analyses were performed using X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), and field emission scanning electron microscopy (FESEM), respectively. Surface droplet size of Cr-Al-N coatings was found to decrease with increasing substrate bias. A decrease of the deposition rate of Cr-Al-N films was expected due to the increase of substrate bias. The coatings were grown with textured CrN phase and (111), (200), and (220) planes. X-ray diffraction data show that all Cr-Al-N coatings shifted to lower diffraction angles due to the addition of Al. The XPS results were used to determine the $Cr_2N$, CrN, and (Cr,Al)N binding energies. The compositions of the Cr-Al-N films were measured by XPS to be Cr 23.2~36.9 at%, Al 30.1~40.3 at%, and N 31.3~38.6 at%.

• 자원리싸이클링
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• 제13권2호
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• pp.9-15
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• 2004

석유화학공정으로부터 폐기되는 폐산화철촉매를 이용하여 도금합성폐수중 크롬회수에 관한 연구를 회분식과 연속식으로 실시하였다. 도금합성제수 중 $CrO _{4}^{-2}$ 형태의 음이온으로 존재하는 6가 크롬은 폐산화철촉매의 등전점(pH 3.0)이하에서 폐촉매와 물리적 흡착을 한다. 한편, 6가 크롬은 pH 3.0 이상에서도 폐촉매의 수산화철과 산화환원반응에 의해 일부 환원되어 $Cr(OH)_3$로 침전한다. 컬럼을 이용한 크롬 연속회수실험에서 크롬합성폐수의 pH가 0.5∼2.0일 때 폐촉매의 크롬흡착량은 2.0∼2.3g/L이며, pH가 3.0에서는 1.5g/L이었다. 폐수 중 크롬농도가 50∼500mg/L로 높아질수록 폐촉매에 흡착한 크롬누적량은 1.29∼8.56g/L로 증가하지만, 유속이 30∼80 ml/mm으로 증가하여도 크롬 흡착누적량은 2.21∼2.49 mg/L로 거의 유사하였다.

• 폴리머
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• 제26권1호
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• pp.105-112
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• 2002

연구는 electro-active polymer(EAP)의 특성을 가지는 ion-exchange polymer metal composite(IPMC)을 이용하여 지능형 대장내시경 개발에 목적을 두고 있다. IPMC는 낮은 구동전압과 빠른 반응속도로 인하여 매우 매력적인 물질이다. 본 연구에서는 IPMC구동기의 전극을 무전의 도금 방법을 이용하여 용액함침-환원방법(impregnation-reduction method)으로 제조하였으며 코팅된 백금전극의 횟수에 따라 변위와 변화를 측정하였다. 구동특성을 알아보기 위하여 길이, 주파수에 대한 변위, 힘을 측정하였으며, 주파수 대역은 저주파 대역과 공명주파수 대역을 사용하는 것이 적합하다는 결론을 얻었다. 또한 다양한 구동적 특성과 수분의 함량에 따른 영향에 대해 고전적 적층 이론 (classical laminate theory, CLT)을 이용하여 이방성 IPMC의 응력분포와 수분이동에 따른 모멘트, 변형률, 곡률(cuvature)을 모델링 하였다.