• Title/Summary/Keyword: Ion saturation current

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Power MESFETs Fabricated using a Self-Aligned and Double Recessed Gate Process (자기정렬 이중 리쎄스 공정에 의한 전력 MESFET 소자의 제작)

  • 이종람;김도진;윤광준;이성재;강진영;이용탁
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.29A no.2
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    • pp.77-79
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    • 1992
  • We propose a self-aligned and double recessed technique for GaAs power MESFETs application. The gate length and the wide recess width are defined by a selective removal of the SiN layer using reactive ion etching(RIE) while the depth of the channel is defined by chemical etching of GaAs layers. The threshold voltages and the saturation drain voltage could be sucessfully controlled using this technique. The lateral-etched distance increases with the dry etching time and the source-drain breakdown voltage of MESFET increases up to about 30V at a pinch-off condition. The electrical characteristics of a MESFET with a gate length of 2 x10S0-6Tm and a source-gate spacing of 33 x10S0-6Tm show maximum transconductance of 120 mS/mm and saturation drain current density of 170-190mA/mm at a gate voltage of 0.8V.

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A study on the characteristics of axially magnetized capacitively coupled radio frequency plasma (축 방향 자장이 인가된 용량 결합형 라디오 주파수 플라즈마의 특성 연구)

  • Lee, Ho-Jun;Yi, Dong-Yung;Tae, Heung-Sik;Whang, Ki-Woong
    • Proceedings of the KIEE Conference
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    • 1999.11d
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    • pp.1066-1068
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    • 1999
  • Magnetic field is commonly used in low temperature processing plasmas in order to obtain high density. E $\times$ B magnetron or surface multipole configuration were most popular. However, the properties of capacitively coupled rf plasma confined by axially applied static magnetic fields have rarely been studied. In this paper, the effects of magnetic field on the characteristics of 13.56MHz/40KHz argon plasma will be reported. Ion saturation current, electron temperature and plasma potential were measured by Langmuir probe and omissive probe. At low pressure region ($\sim$10mTorr), ion current was increased by a factor of 3 - 4 due to reduction of diffusion loss of charged particles to the wall. It was observed that magnetic field induces large time variation of the plasma potential. The experimental result was compared with particle-in-cell simulation. It was also observed that electron temperature tend to decrease with increasing magnetic induction level for 40KHz discharge.

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Effects of CF4 Plasma Treatment on Characteristics of Enhancement Mode AlGaN/GaN High Electron Mobility Transistors

  • Horng, Ray-Hua;Yeh, Chih-Tung
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.62-62
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    • 2015
  • In this study, we study the effects of CF4 plasma treatment on the characteristics of enhancement mode (E-mode) AlGaN/GaN high electron mobility transistors (HEMTs). The CF4 plasma is generated by inductively coupled plasma reactive ion etching (ICP-RIE) system. The CF4 gas is decomposed into fluorine ions by ICP-RIE and then fluorine ions will effect the AlGaN/GaN interface to inhibit the electron transport of two dimension electron gas (2DEG) and increase channel resistance. The CF4 plasma method neither like the recessed type which have to utilize Cl2/BCl3 to etch semiconductor layer nor ion implantation needed high power to implant ions into semiconductor. Both of techniques will cause semiconductor damage. In the experiment, the CF4 treatment time are 0, 50, 100, 150, 200 and 250 seconds. It was found that the devices treated 100 seconds showed best electric performance. In order to prove fluorine ions existing and CF4 plasma treatment not etch epitaxial layer, the secondary ion mass spectrometer confirmed fluorine ions truly existing in the sample which treatment time 100 seconds. Moreover, transmission electron microscopy showed that the sample treated time 100 seconds did not have etch phenomena. Atomic layer deposition is used to grow Al2O3 with thickness 10, 20, 30 and 40 nm. In electrical measurement, the device that deposited 20-nm-thickness Al2O3 showed excellent current ability, the forward saturation current of 210 mA/mm, transconductance (gm) of 44.1 mS/mm and threshold voltage of 2.28 V, ION/IOFF reach to 108. As IV concerning the breakdown voltage measurement, all kinds of samples can reach to 1450 V.

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Strain-free AlGaN/GaN Nanowires for UV Sensor Applications (Strain-free AlGaN/GaN 자외선 센서용 나노선 소자 연구)

  • Ahn, Jaehui;Kim, Jihyun
    • Korean Chemical Engineering Research
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    • v.50 no.1
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    • pp.72-75
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    • 2012
  • In our experiments, strain-free nanowires(NWs) were dispersed on to the substrate, followed by e-beam lithography(EBL) to fabricate single nanowire ultraviolet(UV) sensor devices. Focused-ion beam(FIB), micro-Raman spectroscopy and photoluminescence were employed to characterize the structural and optical properties of AlGaN/GaN NWs. Also, I-V characteristics were obtained under both dark condition and UV lamp to demonstrate AlGaN/GaN NW-based UV sensors. The conductance of a single AlGaN/GaN UV sensor was 9.0 ${\mu}S$(under dark condition) and 9.5 ${\mu}S$ (under UV lamp), respectively. The currents were enhanced by excess carriers under UV lamp. Fast saturation and decay time were demonstrated by the cycled processes between UV lamp and dark condition. Therefore, we believe that AlGaN/GaN NWs have a great potential for UV sensor applications.

A Study on the Characteristics of the MgO Thin Film Deposited by the Hollow Cathode Discharge Ion Plating Method (HCD 이온 플레이팅법에 의해 증착된 MgO박막의 특성에 관한 연구)

  • Chung, Woo-Joon;Jeong, Heui-Seob;Whang, Ki-Woong
    • Proceedings of the KIEE Conference
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    • 1996.11a
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    • pp.200-202
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    • 1996
  • MgO film was deposited on the glass substrate by the hollow cathode discharge ion plating method and the characteristics of the MgO thin film such as deposition rate, crystalline orientation, surface morphology and secondary electron coefficient were investigated. The deposition rate of MgO thin films were $430^{\sim}1270{\AA}$/min at various temperatures and biases. The crystalline orientation of the MgO thin film changed from (200) to (220) upon increasing the HCD current from 100A to 200A. These results indicated that the crystallin orientation of the MgO thin film was determined by the super-saturation ratio. The (200) peak decreased and the (220) peak increased as the substrate bias increased, while both peaks increased as the substrate temperature increased. The grain size increased as the substrate bias increased and the secondary electron emission coefficient increased as the substrate bias increased.

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Fabrication and its characteristics of $WN_x$ self-align gate GaAs LDD MESFET ($WN_x$ Self-Align Gate GaAs LDD MESFET의 제작 및 특성)

  • 문재경;김해천;곽명현;강성원;임종원;이재진
    • Journal of the Korean Vacuum Society
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    • v.8 no.4B
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    • pp.536-540
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    • 1999
  • We have developed a refractory WNx self-aligned gate GaAs metal-semiconductor field-effect transistor(MESFET) using $SiO_2$ side-wall process. The MESFET hasa fully ion-implanted, planar, symmetric self-alignment structure, and it is quite suitable for integration. The uniform trans-conductance of 354nS/mm up to Vgs=+0.6V and the saturation current of 171mA/mm were obtained. As high as 43GHz of cut-off frequency hs been realized without any de-embedding of parasitic effects. The refractory WNx self-aligned gate GaAs MESFET technology is one of the most promising candidates for realizing linear power amplifier ICs and multifunction monolithic ICs for use in the digital mobile communication systems such as hand-held phone(HHP), personal communication system (PCS) and wireless local loop(WLL).

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0.25um T-gate MESFET fabrication by using the size reduction of pattern in image reversal process (형상반전공정의 패턴형성시 선폭감소를 이용한 0.25um T-gate MESFET의 제작)

  • 양전욱;김봉렬;박철순;박형무
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.32A no.1
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    • pp.185-192
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    • 1995
  • In this study, very fine photoresist pattern was examined using the image reversal process. And very fine photoriesist pattern (less than 0.2um) was obtsined by optimizing the exposure and reversal baking condition of photoresist. The produced pattern does not show the loss of thickness, and has a sparp negative edge profile. also, the ion implanted 0.25um T-shaped gate MESFET was fabricated using this resist pattern and the directional evaporation of gate metal. The fabricated MESFET has the maximum transconductance of 302 mS/mm, and the threshold voltage of -1.8V, and the drain saturation current of this MESFET was 191 mA/mm.

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Dependence of deep submicron CMOSFET characteristics on shallow source/drain junction depth (얕은 소오스/드레인 접합깊이가 deep submicron CMOSFET 소자 특성에 미치는 영향)

  • 노광명;고요환;박찬광;황성민;정하풍;정명준
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.33A no.4
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    • pp.112-120
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    • 1996
  • With the MOsES (mask oxide sidewall etch scheme)process which uses the conventional i-line stepper and isotropic wet etching, CMOSFET's with fine gate pattern of 0.1.mu.m CMOSFET device, the screening oxide is deposited before the low energy ion implantation for source/drain extensions and two step sidewall scheme is adopted. Through the characterization of 0.1.mu.m CMOSFET device, it is found that the screening oxide deposition sheme has larger capability of suppressing the short channel effects than two step sidewall schem. In cse of 200.angs.-thick screening oxide deposition, both NMOSFET and PMOSFET maintain good subthreshold characteristics down to 0.1.mu.m effective channel lengths, and show affordable drain saturation current reduction and low impact ionization rates.

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Transport Characteristics of Organic Anions through Poly (1-methyl-4vinylpyridium iodide-co-styrene) Membrane (Poly(1-methyl-4-vinylpyridium iodide-co-styrene)막을 통한 유기음이온의 투과특성)

  • 이광재;한정우박돈희조영일
    • KSBB Journal
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    • v.6 no.2
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    • pp.207-213
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    • 1991
  • In this study poly (1-methyl-4-vinylpyridinium iodide-co-styrene) membrane with pyridinium cation as a fixed carrier was synthesized and the transport characteristics of the membrane was examined over various factors. As the concentration of the fixed carrier in the membrane was increased, the water content was increased. Meanwhile, the counter current of the organic anion and the chloride ion, the following results were obtained. Initial flux of Cl-, organic anion and Na+ decreased with the increasing thickness of membrane, and as the concentration of the fixed carrier increases, the initial flux of Cl- and organic anion increase but the initial flux of Na+ decreased. The flux equation of the organic anion, CCl3COO- was obtained from saturation kinetics as follows;$V_{o}=\frac{(8.67{\times}10^{-5}){\cdot}[NaCl]}{9.63{\times}10^{-2}+[NaCl]} mol/cm^2h$

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A study on the characteristics of axially magnetized capacitively coupled radio frequency plasma (축 방향으로 자화된 용량 결합형 RF 플라즈마의 특성 연구)

  • 이호준;태흥식;이정해;신경섭;황기웅
    • Journal of the Korean Vacuum Society
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    • v.10 no.1
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    • pp.112-118
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    • 2001
  • Magnetic field is commonly used in low temperature processing plasmas to enhance the performance of the plasma reactors. E$\times$B magnetron or surface multipole configuration is the most popular. However, the properties of capacitively coupled rf plasma confined by axial static magnetic field have rarely been studied. With these background, the effect of magnetic field on the characteristics of capacitively coupled 13.56 MHz/40 KHz argon plasma was studied, Ion saturation current, electron temperature and plasma potential were measured by Langmuir probe and emissive probe. At low pressure region (~10 mTorr), ion current increases by a factor of 3-4 due to reduction of diffusion loss of charged particles to the wall. Electron temperature slightly increases with magnetic field for 13.56 MHz discharge. However, for 40 KHz discharge, electron temperature decreased from 1.8 eV to 0.8 eV with magnetic field. It was observed that the magnetic field induces large temporal variation of the plasma potential. Particle in cell simulation was performed to examine the behaviors of the space potential. Experimental and simulation results agreed qualitatively.

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