• Korean Journal of Materials Research
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• v.20 no.2
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• pp.104-110
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• 2010

The characteristics of all polymer composites containing carbon materials are determined by four factors: component properties, composition, structure and interfacial interactions. The most important filler characteristics are particle size, size distribution, specific surface area and particle shape. As a consequence, in this paper we discuss the aspects of the mechanical, electrical and thermal properties of composites with different fillers of carbon black, carbon nanotube (CNT), graphene and graphite and focus on the relationship between factors and properties, as mentioned above. Accordingly, we fabricate rubber composites that contain various carbon materials in carbon black-based and silica based-SBR matrixes with dual phase fillers and use scanning electron microscopy, Raman spectroscopy, a rhometer, an Instron tensile machine, and a thermal conductivity analyzer to evaluate composites' mechanical, fatigue, thermal, and electronic properties. In mechanical properties, hardness and 300%-modulus of graphene-composite are sharply increased in all cases due to the larger specific surface. Also, it has been found that the thermal conductivity of the CNT-composite is higher than that of any of the other composites and that the composite with graphene has the best electrical properties.

• Journal of the Semiconductor & Display Technology
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• v.18 no.2
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• pp.98-102
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• 2019

Direct plasma-enhanced atomic layer deposition (PEALD) are widely used for $SiO_2$ and SiON thin film process in current semiconductor industry. However, this exhibits poor step coverage for three-dimensional device structure due directionality of plasma species as well as plasma damage on the substrate. In this study, to overcome this issue, low temperature (< $300^{\circ}C$) $SiO_2$ and SiON thin film processes were studied using inductively coupled plasma (ICP) type remote PEALD with various reactant gases such as $O_2$, $H_2O$, $N_2$ and $NH_3$. It was confirmed that the interfacial properties such as fixed charge density and charge trapping behavior of thin films were considerably improved by hydrogen species in $H_2O$ and $NH_3$ plasma compared to the films grown with $O_2$ and $N_2$ plasma. Furthermore, the leakage current density of the thin films was suppressed for same reason.

• Transactions on Electrical and Electronic Materials
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• v.14 no.3
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• pp.121-124
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• 2013

The incorporation of 90 nm alumina particles into an epoxy matrix to form a composite microstructure is described in present study. It is shown that the use of ultrafine particles results in a substantial change in the behavior of the composite, which can be traced to the mitigation of internal charges when a comparison is made with conventional $Al_2O_3$ fillers. A variety of diagnostic techniques have been used to augment pulsed electro-acoustic space charge measurement to provide a basis for understanding the underlying physics of the phenomenon. It would appear that, when the size of the inclusions becomes small enough, they act cooperatively with the host structure and cease to exhibit interfacial properties. It is postulated that the $Al_2O_3$ particles are surrounded by high charge concentrations. Since $Al_2O_3$ particles have very high specific areas, these regions allow limited charge percolation through $Al_2O_3$ filled dielectrics. The practical consequences of this have also been explored in terms of the electric strength exhibited. It would appear that there was a window in which real advantages accumulated from the nano-formulated material. An optimum filler loading of about 0.5 wt.% was indicated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.8-9
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• 2006

Hafnium oxide ($HfO_2$) thin films were deposited on p-type (100) silicon wafers by atomic layer deposition (ALD) using TEMAHf and $O_3$. Prior to the deposition of $HfO_2$ films, a thin Hf ($10\;{\AA}$) metal layer was deposited. Deposition temperature of $HfO_2$ thin film was $350^{\circ}C$ and its thickness was $150\;{\AA}$. Samples were then annealed using furnace heating to temperature ranges from 500 to $900^{\circ}C$. The MOS capacitor of round-type was fabricated on Si substrates. Thermally evaporated $3000\;{\AA}$-thick AI was used as top electrode. In this work, We study the interface characterization of $HfO_2$/Hf/Si MOS capacitor depending on annealing temperature. Through AES(Auger Electron Spectroscopy), capacitance-voltage (C-V) and current-voltage (I-V) analysis, the role of Hf layer for the better $HfO_2$/Si interface property was investigated. We found that Hf meta1 layer in our structure effective1y suppressed the generation of interfacial $SiO_2$ layer between $HfO_2$ film and silicon substrate.

• Journal of the Korean Magnetics Society
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• v.23 no.6
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• pp.184-187
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• 2013

The influence of insertion of an ultra-thin Cu-Phthalocyanine (CuPc) between MgO barrier and ferromagnetic layer in magnetic tunnel juctions (MTJs) was investigated. In order to understand the relation between the electronic and structural properties of Fe${\backslash}$MgO${\backslash}$CuPc, the surface (or interface) analysis was carried out systematically by using spin polarized metastable He de-excited spectroscopy for the CuPc films grown on the Si(001)${\backslash}$5 nm MgO(001)${\backslash}$7 nm Fe(001)${\backslash}$1.6 nm MgO(001) multilayer structure as the thickness of CuPc increases from 0 to 5 nm. In particular, for the 1.6 nm CuPc surface, a rather strong spin asymmetry between up- and down-spin band appears while it becomes weaker or disappears for the CuPc films thinner or thicker than ~1.6 nm. Our results emphasize the importance of the interfacial electronic properties of organic layers in the spin transport of the hybrid MTJs.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.6
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• pp.603-609
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• 2022

Passivation quality is mainly governed by epitaxial growth of crystalline silicon wafer surface. Void-rich intrinsic a-Si:H interfacial layer could offer higher resistivity of the c-Si surface and hence a better device efficiency as well. To reduce the resistivity of the contact area, a modification of void-rich intrinsic layer of a-Si:H towards more ordered state with a higher density is adopted by adapting its thickness and reducing its series resistance significantly, but it slightly decreases passivation quality. Higher resistance is not dominated by asymmetric effects like different band offsets for electrons or holes. In this study, multilayer of intrinsic a-Si:H layers were used. The first one with a void-rich was a-Si:H(I₁) and the next one a-SiO_x:H(I₂) were used, where a-SiO_x:H(I₂) had relatively larger band gap of ~2.07 eV than that of a-Si:H (I₁). Using a-SiO_x:H as I₂ layer was expected to increase transparency, which could lead to an easy carrier transport. Also, higher implied voltage than the conventional structure was expected. This means that the a-SiO_x:H could be a promising material for a high-quality passivation of c-Si. In addition, the i-a-SiO_x:H microstructure can help the carrier transportation through tunneling and thermal emission.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.299-299
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• 2016

SiC는 넓은 에너지갭 (Eg=~3.4 eV)을 갖는 반도체로써, 고전압, 고온에서 동작이 가능하여 기존의 Si기반의 파워디바이스를 대체하기 위한 물질로 많은 연구가 이루어지고 있다. 파워 디바이스의 성능 향상을 위해서는 기판과 절연체 사이의 계면에 생성되는 계면 결함을 감소시켜야 한다. 따라서 본 연구에서는 SiC 기판에 high-k 물질인 HfO2를 증착하여 HfO2/SiC 계면에 유도된 결함을 분석하고 이를 감소시킬 수 있는 방법에 대한 연구를 수행하였다. HfO2 박막은 atomic-layer-deposition (ALD) 방법을 이용하여 SiC 기판 위에 $200^{\circ}C$에서 증착하였다. HfO2 박막 증착 후 NH3 분위기에서 rapid thermal annealing 방법을 이용하여 $600^{\circ}C$에서 1분 동안 열처리 진행하였다. Current-voltage (I-V) 측정을 통해 열처리 전 HfO2/SiC의 절연파괴 전압이 약 8.3 V 임을 확인하였다. NH3 열처리 후 HfO2/SiC의 절연파괴 전압이 10 V로 증가하였으며 누설 전류가 크게 감소하는 것을 확인하였다. 또한 capacitance-voltage (C-V) 측정을 통해 열처리 후 flat band voltage가 negative 방향에서 positive 방향으로 이동함을 확인하였고, 이를 통해 NH3 열처리 방법이 HfO2/SiC 계면에 존재하는 결함을 감소시킬 수 있음을 확인하였다. 전자 구조상의 conduction band edge에 존재하는 결함 준위를 분석하기 위해 x-ray absorption spectroscopy (XAS) 분석을 실시하였고, 열처리 전 HfO2/SiC 계면에 많은 결함 준위가 존재함을 확인하였으며, x-ray photoelectron spectroscopy (XPS) 분석을 통해 이 결함 준위가 oxygen deficiency state과 관련됨을 알 수 있었다. NH3 열처리 후 결과와 비교해보면, oxygen deficiency state가 감소함을 확인하였으며 이로 인해 conduction band edge에 존재하는 결함 준위가 감소함을 알 수 있었다. 따라서, NH3 열처리 방법을 이용하여 HfO2/SiC 계면에 존재하는 결함을 감소시킬 수 있으며, HfO2/SiC의 물리적, 전기적 특성을 향상시킬 수 있다는 결과를 도출하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.281.1-281.1
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• 2016

Transition metal dichalcogenides (TMDCs) are promising layered structure materials for next-generation nano electronic devices. Many investigation on the FET device using TMDCs channel material have been performed with some integrated approach. To use TMDCs for channel material of top-gate thin film transistor(TFT), the study on high-k dielectrics on TMDCs is necessary. However, uniform growth of atomic-layer-deposited high-k dielectric film on TMDCs is difficult, owing to the lack of dangling bonds and functional groups on TMDC's basal plane. We demonstrate the effect of remote oxygen plasma pretreatment of large area synthesized few-layer MoSe2 on the growth behavior of Al2O3, which were formed by atomic layer deposition (ALD) using tri-methylaluminum (TMA) metal precursors with water oxidant. We investigated uniformity of Al2O3 by Atomic force microscopy (AFM) and Scanning electron microscopy (SEM). Raman features of MoSe2 with remote plasma pretreatment time were obtained to confirm physical plasma damage. In addition, X-ray photoelectron spectroscopy (XPS) was measured to investigate the reaction between MoSe2 and oxygen atom after the remote O2 plasma pretreatment. Finally, we have uniform Al2O3 thin film on the MoSe2 by remote O2 plasma pretreatment before ALD. This study can provide interfacial engineering process to decrease the leakage current and to improve mobility of top-gate TFT much higher.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.27-27
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• 2011

For the design of real applicable molecular devices, current-voltage properties through molecular nanostructures such as metal-molecule-metal junctions (molecular junctions) have been studied extensively. In thiolate monolayers on the gold electrode, the chemical bonding of sulfur to gold and the van der Waals interactions between the alkyl chains of neighboring molecules are important factors in the formation of well-defined monolayers and in the control of the electron transport rate. Charge transport through the molecular junctions depends significantly on the energy levels of molecules relative to the Fermi levels of the contacts and the electronic structure of the molecule. It is important to understand the interfacial electron transport in accordance with the increased film thickness of alkyl chains that are known as an insulating layer, but are required for molecular device fabrication. Thiol-tethered RuII terpyridine complexes were synthesized for a voltage-driven molecular switch and used to understand the switch-on mechanism of the molecular switches of single metal complexes in the solid-state molecular junction in a vacuum. Electrochemical voltammetry and current-voltage (I-V) characteristics are measured to elucidate electron transport processes in the bistable conducting states of single molecular junctions of a molecular switch, Ru(II) terpyridine complexes. (1) On the basis of the Ru-centered electrochemical reaction data, the electron transport rate increases in the mixed self-assembled monolayer (SAM) of Ru(II) terpyridine complexes, indicating strong electronic coupling between the redox center and the substrate, along the molecules. (2) In a low-conducting state before switch-on, I-V characteristics are fitted to a direct tunneling model, and the estimated tunneling decay constant across the Ru(II) terpyridine complex is found to be smaller than that of alkanethiol. (3) The threshold voltages for the switch-on from low- to high-conducting states are identical, corresponding to the electron affinity of the molecules. (4) A high-conducting state after switch-on remains in the reverse voltage sweep, and a linear relationship of the current to the voltage is obtained. These results reveal electron transport paths via the redox centers of the Ru(II) terpyridine complexes, a molecular switch.

• Korean Journal of Materials Research
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• v.11 no.8
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• pp.671-678
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• 2001

All solid-state thin film micro supercapacitor, which consists of $RuO_2$/LiPON/$RuO_2$ multi layer structure, was fabricated on Pt/Ti/Si substrate using a $RuO_2$ electrode. Bottom $RuO_2$ electrode was grown by dc reactive sputtering system with increasing $O_2/[Ar+O_2]$ ratio at room temperature, and a LiPON electrolyte film was subsequently deposited on the bottom $RuO_2$ electrode at pure nitrogen ambient by rf reactive sputtering system. Room temperature charge-discharge measurements based on a symmetric $RuO_2$/LiPON/$RuO_2$ structure clearly demonstrates the cyclibility dependence on the microstructure of the $RuO_2$ electrode. Using both glancing angle x-ray diffraction (GXRD) and transmission electron microscopy (TEM) analysis, it was found that the microstructure of the $RuO_2$ electrode was dependent on the oxygen flow ratio. In addition, x- ray photoelectron spectroscopy(XPS) examination shows that the Ru-O binding energy is affected by increasing oxygen flow ratio. Furthermore, TEM and AES depth profile analysis after cycling demonstrates that the interface layer formed by interfacial reaction between LiPON and $RuO_2$ act as a main factor in the degradation of the cyclibility of the thin film micro-supercapacitor.