• Elastomers and Composites
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• 제45권1호
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• pp.2-6
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• 2010

탄소섬유/나일론 수지 복합재료의 계면결합력의 향상을 위해 폴리아크릴로니트릴(PAN)계 탄소섬유의 표면에 실란계, 설파이드계, 이미드계 계면결합제를 이용해서 사이징 처리를 수행하였으며, 사이징 처리된 탄소섬유의 젖음성과 표면자유에너지는 접촉각을 통해 확인하였다. 사이징 처리되어 제조된 복합재료의 기계적 계면물성은 임계응력세기인자를 통하여 확인하였으며, 파단실험 후 파단면은 주사전자현미경을 통해 관찰하였다. 실험결과 실란계로 사이징 처리된 탄소섬유가 다른 사이징 처리에 비해 표면자유에너지가 큰 것을 접촉각 측정을 통해 관찰하였다. 한편 사이징 처리된 탄소섬유 강화 나일론 복합재의 경우 미처리 탄소섬유를 이용한 복합재에 비해 높은 기계적 계면강도를 보였다. 이러한 결과는 섬유의 표면자유에너지가 탄소섬유와 나일론6 기지 사이의 계면결합력의 증대를 유도하여 복합재료의 기계적 계면강도가 증가된 것으로 판단된다.

• 접착 및 계면
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• 제9권4호
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• pp.1-11
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• 2008

본 연구에서는 바이오복합재료 성형 전에 침지방법과 초음파방법을 이용하여 수산화나트륨 용액으로 kenaf 섬유를 처리하였다. Kenaf/poly(lactic acid)의 kenaf-PLA 계면접착력과 기계적, 열적 특성에 미치는 알칼리처리의 영향을 계면전단강도, 굴곡강도, 동역학적 열특성 및 열안정성을 조사하였으며, kenaf 섬유와 복합재료 파단면을 관찰하였다. 그 결과 Kenaf 섬유표면을 처리하기 위한 침지방법과 초음파방법 모두 바이오복합재료의 섬유-매트릭스 접착과 기계적 특성을 증가시키는 역할을 하는 것으로 조사되었다. 바이오복합재료의 특성은 섬유표면 처리방법뿐만 아니라 알칼리 농도 및 처리시간에도 의존하였다.

• 한국안전학회지
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• 제30권1호
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• pp.21-27
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• 2015

In this study, interfacial characteristics between SOFC and Ag paste as current collector was estimated in the high temperature environment. The Ag paste was used to connect the unit cell of SOFC strongly with interconnector and provide the electrical conductivity between them. To confirm electrical conductivity, Ag paste was treated in the furnace at $800^{\circ}C$ for 48 hours. The sheet resistance of Ag paste was measured to compare the resistance values before and after the heat treatment. Also, the four-point bending test was performed to measure the interfacial adhesion. The unit cell of SOFC and $SiO_2$ wafer were diced and then attached by Ag paste. The $SiO_2$ wafer had the center notch to initiate a crack from the tip of the notch. The modified stereomicroscope combined with the CCD camera and system for measuring the length was used to observe the fracture behavior. To compare the characteristics before heat treatment and after heat treatment, the specimen was exposed in the furnace at $800^{\circ}C$ for 48 hours and then the interfacial adhesion was evaluated. Finally, the interfacial adhesion energy quantitatively increases $1.78{\pm}0.07J/m^2$ to $4.9{\pm}0.87J/m^2$ between the cathode and Ag paste and also increase $2.9{\pm}0.47J/m^2$ to $5.12{\pm}1.01J/m^2$ between the anode and Ag paste through the high temperature. Therefore, it is expected that Ag paste as current collector was appropriate for improving the structural stability in the stacked SOFC system if the electrical conductivity was more increased.

• Elastomers and Composites
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• 제37권4호
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• pp.258-264
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• 2002

본 연구에서는 열처리에 의한 실리카의 표면특성과 실리카/폴리우레탄 복합재료의 기계적 계면물성에 대하여 고찰하였다. 열처리에 의한 실리카의 표면특성은 Fourier Transform-IR(FT-IR), Solid-state 29Si NMR spectroscopy, 그리고 접촉각을 통하여 알아보았으며 실리카/폴리우레탄 복합재료의 기계적 계면물성은 인열에너지 (GIIIC)를 측정하여 관찰하였다. 본 실험결과, 열처리 온도가 증가함에 따라 실리카의 Si-OH가 축합하여 Si-O-Si를 형성하고 표면자유에너지의 비극성 요소가 증가하는 것을 확인할 수 있었다. 이러한 결과로부터, 증가된 실리카의 표면자유에너지의 비극성요소는 폴리우레탄 내에 실리카의 분산성을 향상시켜 결과적으로 실리카/폴리우레탄 복합재료의 기계적 계면물성인 인열에너지가 증가된 것으로 사료된다.

• Transactions on Electrical and Electronic Materials
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• 제7권1호
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• pp.16-20
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• 2006

In this paper, we investigated the effects of short-term oxygen plasma treatment of semiconducting silicone layer to improve interfacial performances in joints prepared with a insulating silicone materials. Surface characterizations were assessed using contact angle measurement and x-ray photoelectron spectroscopy (XPS), and then adhesion level and electrical performance were evaluated through T-peel tests and electrical breakdown voltage tests of treated semi-conductive and insulating joints. Plasma exposure mainly increased the polar component of surface energy from $0.21\;dyne/cm^2$ to $47\;dyne/cm^2$ with increasing plasma treatment time and then leveled off. Based on XPS analysis, the surface modification can be mainly ascribed to the creation of chemically active functional groups such as C-O, C=O and COH on semi-conductive silicone surface. This oxidized rubber layer is inorganic silica-like structure of Si bound with three to four oxygen atoms ($SiO_x,\;x=3{\sim}4$). The oxygen plasma treatment produces an increase in joint strength that is maximum for 10 min treatment. However, due to brittle property of this oxidized layer, the highly oxidized layer from too much extended treatment could be act as a weak point, decreasing the adhesion strength. In addition, electrical breakdown level of joints with adequate plasma treatment was increased by about $10\;\%$ with model samples of joints prepared with a semi-conducting/ insulating silicone polymer after applied to interface.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2001년도 추계학술발표대회 논문집
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• pp.153-157
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• 2001

Interfacial properties and microfailure modes of electrodeposition (ED) treated carbon fiber reinforced polyetherimide (PEI) toughened epoxy composite were investigated using microdroplet test and the measurement of surface wettability. As PEI content increased, Interfacial shear strength (IFSS) increased due to enhanced toughness and plastic deformation of PEI. In the untreated case, IFSS increased with adding PEI content, and IFSS of pure PEI matrix showed the highest. On the other hand, for ED-treated case IFSS increased with PEI content with rather low improvement rate. The work of adhesion between fiber and matrix was not directly proportional to IFSS for both the untreated and ED-treated cases. The matrix toughness might contribute to IFSS more likely than the surface wettability. Interfacial properties of epoxy-PEI composite can be affected efficiently by both the control of matrix toughness and ED treatment.

• 한국전기전자재료학회논문지
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• 제20권10호
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• pp.873-877
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• 2007

In order to apply a complex multilayer chip LC filter, this study has estimated the interfacial reaction and coupling properties of dielectric materials $Pb(Fe_{1/2}Nb_{1/2})O_3$ and Ni-Zn-Cu ferrite materials through low-temperature co-sintering (LTCS). PFN powders were fabricated using double calcinated at $700^{\circ}C$ and then $850^{\circ}C$. While the perovskite phase rate was found to be 91 %, after heat treatment at $900^{\circ}C$ for 6h, the perovskite phase rate and density exhibited a value of 100 % and 7.46$g/cm^3$, respectively. The PFN/Ni-Zn-Cu ferrite, PFN/CUO (or $Pb_2Fe_2O_5$) and ferrite/CuO (or $Pb_2Fe_2O_5$) were mechanically coupled through interfacial reactions after the specimen was co-sintered at $900^{\circ}C$ for 6 h. No intermediate layer exists for the mutual coupling reaction. This result indicates the possibility of low-temperature co-sintering without any interfacial reaction layer for a multilayer chip LC filter.

• 한국주조공학회지
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• 제17권3호
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• pp.245-251
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• 1997

Solderability, interfacial reaction and mechanical properties of joint between Sn-Bi-Ag base solder and Cu-substrate were studied. Solders were subjected to aging treatments to see the change of mechanical properties for up to 30 days at $100^{\circ}C$, and then also examined the changes of microstructure and morphology of interfacial compound. Sn-Bi-Ag base solder showed about double tensile strength comparing to Pb-Sn eutectic solder. Addition of 0.7wt%Al in the Sn-Bi-Ag alloy increase spread area on Cu substrate under R-flux and helps to reduce the growth of intermetallic compound during heat-treatment. According to the aging experiments of Cu/solder joint, interfacial intermetallic compound layer was exhibited a parabolic growth to aging time. The result of EDS, it is supposed that the soldered interfacial zone was composed of $Cu_6Sn_5$.

• 대한금속재료학회지
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• 제49권11호
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• pp.910-915
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• 2011

The microstructures and mechanical properties of roll-bonded STS439/Al1050/STS304 clad materials were investigated after an annealing process at various temperatures. Interfacial layer was developed at the STS439/Al1050 and Al1050/STS304 interfaces at $550^{\circ}C$. STS439/Al1050/STS304 clad metals fractured suddenly in a single step and the fracture decreased with increasing annealing temperatures at $450^{\circ}C$. After annealing at $550^{\circ}C$, samples fractured in three steps with each layer fracturing independently. Interfacial layers formed at $550^{\circ}C$ with a high Vickers microhardness were found to be brittle. During tensile testing, periodic parallel cracks were observed at the interfacial reaction layer. Observed micro-void between Al1050 and the interfacial layer was found to weaken the Al1050/reaction layer interface, leading to the total separation between Al1050 and the reaction layer.

• Journal of Welding and Joining
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• 제29권1호
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• pp.99-106
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• 2011

Joint strength between a solder ball and a pad on a substrate is one of the major factors which have effects on electronic device reliability. The effort to improve solder joint strength via surface cleaning, heat treatment and solder composition change have been in progress. This paper will discuss the method of solder ball joint strength improvement using LF hydrogen radical cleaning treatment and focus on the effects of surface treatment condition on the solder ball shear strength and interfacial reactions. In the joint without radical cleaning, voids were observed at the interface. However, the specimens cleaned by hydrogen-radical didn't have voids at the interface regardless of cleaning time. The shear strength between the solder ball and the pad was increased over 120%(about 800gf) when compared to that without the radical treatment (680gf) under the same reflow condition. Especially, at the specimen treated for 5minutes, ball shear strength was considerably increased over 150%(1150gf). Through the observation of fracture surface and cross-section microstructure, the increase of joint strength resulted from the change of fracture mode, that is, from the solder ball fracture to IMC/Ni(P) interfacial fracture. The other cases like radical treated specimen for 1, 3, 7, 9min. showed IMC/solder interfacial fracture rather than fracture in the solder ball.