Journal of Korea Foundry Society (한국주조공학회지)

Korea Foundry Society (한국주조공학회)
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A Study on Wetting, Interfacial Reaction and Mechanical Properties between Sn-Bi-Ag System Solders and Cu Substrate

Sn-Bi-Ag계 땜납과 Cu기판과의 젖음성, 계면 반응 및 기계적 성질에 관한 연구

  • Seo, Youn-Jong (Kwangju Chonnam Regional Small and Medium Business office) ;
  • Lee, Kyung-Ku (Dept. of Iron & Metallurgical Engineering, Hanlyo Sanup University) ;
  • Lee, Doh-Jae (Dept. of Metallurgical Engineering, Chonnam National University)
  • 서윤종 (광주 전남지방 중소기업청) ;
  • 이경구 (한려산업대학교 제철금속공학과) ;
  • 이도재 (전남대학교 금속공학과)
  • Published : 1997.06.20
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Abstract

Solderability, interfacial reaction and mechanical properties of joint between Sn-Bi-Ag base solder and Cu-substrate were studied. Solders were subjected to aging treatments to see the change of mechanical properties for up to 30 days at $100^{\circ}C$, and then also examined the changes of microstructure and morphology of interfacial compound. Sn-Bi-Ag base solder showed about double tensile strength comparing to Pb-Sn eutectic solder. Addition of 0.7wt%Al in the Sn-Bi-Ag alloy increase spread area on Cu substrate under R-flux and helps to reduce the growth of intermetallic compound during heat-treatment. According to the aging experiments of Cu/solder joint, interfacial intermetallic compound layer was exhibited a parabolic growth to aging time. The result of EDS, it is supposed that the soldered interfacial zone was composed of $Cu_6Sn_5$.

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