• Title/Summary/Keyword: Interface trap

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High-Performance Amorphous Indium-Gallium Zinc Oxide Thin-Film Transistors with Inorganic/Organic Double Layer Gate Dielectric

  • Lee, Tae-Ho;Kim, Jin-U;No, Yong-Han
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.465-465
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    • 2013
  • Inorganic 물질인 SiO2 dielectric 위에 organic dielectric PVP (4-vinyphenol)를 spin coating으로 올려, inorganic/organic dielectric 형태의 double layer구조로 High-performance amorphous indiumgallium zinc oxide thin-film transistors (IGZO TFT)를 제작하여 보았다. SiO2 dielectric을 buffer layer로 80 nm, PVP는 10Wt% 400 nm로 구성하였으며, 200 nm single SiO2 dielectric과 동일한 수준의 leakage current 특성을 MIM Capacitor 구조를 통해서 확인할 수 있었다. 이 소자의 장점은 용액공정의 도입으로 공정 시간의 단축 및 원가 절감을 이룰 수 있으며, dielectric과 channel 사이의 균일한 interface의 형성으로 interface trap 개선 및 Yield 향상의 장점을 갖는다. 우리는 실험을 통해서 SiO2 buffer layer가 수직 electric field에 의한 leakage current을 제어하고, PVP dielectric은 interface를 개선하는 것을 확인하였다. Vth의 negative shift 및 slope의 향상으로 구동전압이 줄어들고, 균일한 I-V Curve 형성을 통해서 Process Yield의 향상을 확인하였다.

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Effect of Hydrogen Treatment on Electrical Properties of Hafnium Oxide for Gate Dielectric Application

  • Park, Kyu-Jeong;Shin, Woong-Chul;Yoon, Soon-Gil
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.1 no.2
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    • pp.95-102
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    • 2001
  • Hafnium oxide thin films for gate dielectric were deposited at $300^{\circ}C$ on p-type Si (100) substrates by plasma enhanced chemical vapor deposition (PECVD) and annealed in $O_2$ and $N_2$ ambient at various temperatures. The effect of hydrogen treatment in 4% $H_2$ at $350^{\circ}C$ for 30 min on the electrical properties of $HfO_2$for gate dielectric was investigated. The flat-band voltage shifts of $HfO_2$capacitors annealed in $O_2$ambient are larger than those in $N_2$ambient because samples annealed in high oxygen partial pressure produces the effective negative charges in films. The oxygen loss in $HfO_2$films was expected in forming gas annealed samples and decreased the excessive oxygen contents in films as-deposited and annealed in $O_2$ or $N_2$ambient. The CET of films after hydrogen forming gas anneal almost did not vary compared with that before hydrogen gas anneal. Hysteresis of $HfO_2$films abruptly decreased by hydrogen forming gas anneal because hysteresis in C-V characteristics depends on the bulk effect rather than $HfO_2$/Si interface. The lower trap densities of films annealed in $O_2$ambient than those in $N_2$were due to the composition of interfacial layer becoming closer to $SiO_2$with increasing oxygen partial pressure. Hydrogen forming gas anneal at $350^{\circ}C$ for samples annealed at various temperatures in $O_2$and $N_2$ambient plays critical role in decreasing interface trap densities at the Si/$SiO_2$ interface. However, effect of forming gas anneal was almost disappeared for samples annealed at high temperature (about $800^{\circ}C$) in $O_2$ or $N_2$ambient.

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Eelctrical and Structural Properties of $CaF_2$Films ($CaF_2$ 박막의 전기적, 구조적 특성)

  • 김도영;최석원;이준신
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.11 no.12
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    • pp.1122-1127
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    • 1998
  • Group II-AF_2$films such as $CaF_2$, $SrF_2$, and $BaF_2$ have been commonly used many practical applications such as silicon on insulatro(SOI), three-dimensional integrated circuits, buffer layers, and gate dielectrics in filed effect transistor. This paper presents electrical and structural properties of fluoride films as a gate dielectric layer. Conventional gate dielectric materials of TFTs like oxide group exhibited problems on high interface trap charge density($D_it$), and interface state incorporation with O-H bond created by mobile hydrogen and oxygen atoms. To overcome such problems in conventional gate insulators, we have investigated $CaF_2$ films on Si substrates. Fluoride films were deposited using a high vacuum evaporation method on the Si and glass substrate. $CaF_2$ films were preferentially grown in (200) plane direction at room temperature. We were able to achieve a minimum lattice mismatch of 0.74% between Si and $CaF_2$ films. Average roughness of $CaF_2$ films was decreased from 54.1 ${\AA}$ to 8.40 ${\AA}$ as temperature increased form RT and $300^{\circ}C$. Well fabricated MIM device showed breakdown electric field of 1.27 MV/cm and low leakage current of $10^{-10}$ A/$cm^2$. Interface trap charge density between $CaF_2$ film and Si substrate was as low as $1.8{\times}10^{11}cm^{-2}eV^{-1}$.

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Effective Interfacial Trap Passivation with Organic Dye Molecule to Enhance Efficiency and Light Soaking Stability in Polymer Solar Cells

  • Rasool, Shafket;Zhou, Haoran;Vu, Doan Van;Haris, Muhammad;Song, Chang Eun;Kim, Hwan Kyu;Shin, Won Suk
    • Current Photovoltaic Research
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    • v.9 no.4
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    • pp.145-159
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    • 2021
  • Light soaking (LS) stability in polymer solar cells (PSCs) has always been a challenge to achieve due to unstable photoactive layer-electrode interface. Especially, the electron transport layer (ETL) and photoactive layer interface limits the LS stability of PSCs. Herein, we have modified the most commonly used and robust zinc oxide (ZnO) ETL-interface using an organic dye molecule and a co-adsorbent. Power conversion efficiencies have been slightly improved but when these PSCs were subjected to long term LS stability chamber, equipped with heat and humidity (45℃ and 85% relative humidity), an outstanding stability in the case of ZnO/dye+co-adsorbent ETL containing devices have been achieved. The enhanced LS stability occurred due to the suppressed interfacial defects and robust contact between the ZnO and photoactive layer. Current density as well as fill factors have been retained after LS with the modified ETL as compared to un-modified ETL, owing to their higher charge collection efficiencies which originated from higher electron mobilities. Moreover, the existence of less traps (as observed from light intensity-open circuit voltage measurements and dark currents at -2V) are also found to be one of the reasons for enhanced LS stability in the current study. We conclude that the mitigation ETL-surface traps using an organic dye with a co-adsorbent is an effective and robust approach to enhance the LS stability in PSCs.

Double Layer (Wet/CVD $SiO_2$)의 Interface Trap Density에 대한 연구

  • Lee, Gyeong-Su;Choe, Seong-Ho;Choe, Byeong-Deok
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.340-340
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    • 2012
  • 최근 MOS 소자들이 게이트 산화막을 Mono-layer가 아닌 Multi-Layer을 사용하는 추세이다. Bulk와 High-k물질간의 Dangling Bond를 줄이기 위해 Passivation 층을 만드는 것을 예로 들 수 있다. 이러한 Double Layer의 쓰임이 많아지면서 계면에서의 Interface State Density의 영향도 커지게 되면서 이를 측정하는 방법에 대한 연구가 활발히 진행되고 있다. 본 연구에서는 $SiO_2$ Double Layer의 Interface State Density를 Conductance Method를 사용하여 구하는 연구를 진행하였다. Wet Oxidation과 Chemical Vapor Deposition (CVD) 공정을 이용하여 $SiO_2$ Double-layer로 증착한 후 Aluminium을 전극으로 하는 MOS-Cap 구조를 만들었다. 마지막 공정은 $450^{\circ}C$에서 30분 동안 Forming-Gas Annealing (FGA) 공정을 진행하였다. LCR meter를 이용하여 high frequency C-V를 측정한 후 North Carolina State University California Virtual Campus (NCSU CVC) 프로그램을 이용하여 Flatband Voltage를 구한 후에 Conductance Method를 측정하여 Dit를 측정하였다. 본 연구 결과 Double layer (Wet/CVD $SiO_2$)에 대해서 Conductance Method를 방법을 이용하여 Dit를 측정하는 것이 유효하다는 것을 확인 할 수 있었다. 본 실험은 앞으로 많이 쓰이고 측정될 Double layer (Wet/CVD $SiO_2$)에 대한 Interface State Density의 측정과 분석에 대한 방향을 제시하는데 도움이 될 것이라 판단된다.

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Effect of Gate Dielectrics on Electrical Characteristics of a-ITGZO Thin-Film Transistors (게이트 절연막 조성에 따른 a-ITGZO 박막트랜지스터의 전기적 특성 연구)

  • Kong, Heesung;Cho, Kyoungah;Kim, Sangsig
    • Journal of IKEEE
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    • v.25 no.3
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    • pp.501-505
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    • 2021
  • In this study, we fabricated amorphous indium-tin-gallium-zinc-oxide thin-film transistors (a-ITGZO TFTs) with gate dielectrics of HfO2 and the mixed layers of HfO2 and Al2O3, and investigated the effect of gate dielectric on electrical characteristics of a-ITGZO TFTs. When only HfO2 was used as the gate dielectric, the mobility and subthreshold swing (SS) were 32.3 cm2/Vs and 206 mV/dec. For the a-ITGZO TFTs with gate dielectric made of HfO2 and Al2O (2:1, 1:1), the mobilities and SS were 26.4 cm2/Vs (2:1), 16.8 cm2/Vs(1:1), 160 mV/dec (2:1) and 173 mV/dec (1:1). On the other hand, the hysteresis window shown in transfer curves of the a-ITGZO TFTs was lessened from 0.60 to 0.09 V by the increase of Al2O3 ratio in gate dielectric, indicating that the interface trap density between the gate dielectric and channel layer decreases due to Al2O3.

Characteristics of the Reoxidized Oxynitride Gate Dielectric for Charge Trap Type NVSM (전하 트랩 형 비휘발성 기억소자를 위한 재산화 산화질화막 게이트 유전악의 특성에 관한 연구)

  • 이상은;박승진;김병철;서광열
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.11a
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    • pp.37-40
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    • 1999
  • For the first time, charge trapping nonvolatile semiconductor memories with the deoxidized oxynitride gate dielectric is proposed and demonstrated. Gate dielectric wit thickness of less than 1 nm have been grown by postnitridation of pregrown thermal silicon oxides in NO ambient and then reoxidation. The nitrogen distribution and chemical state due to NO anneal/reoxidation were investigated by M-SIMS, TOF-SIMS, AES depth profiles. When the NO anneal oxynitride film was reoxidized on the nitride film, the nitrogen at initial oxide interface not only moved toward initial oxide interface, but also diffused through the newly formed tunnel oxide by exchange for oxygen. The results of reoxidized oxynitride(ONO) film analysis exhibits that it is made up of SiO$_2$(blocking oxide)/N-rich SiON interface/Si-rich SiON(nitrogen diffused tunnel oxide)/Si substrate. In addition, the SiON and the S1$_2$NO Phase is distributed mainly near the tunnel oxide, and SiN phase is distributed mainly at tunnel oxide/Si substrate interface.

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Effects of re-stress after anneal on oxide leakage (열처리 후 가해진 스트레스가 산화막 누설전류에 미치는 영향)

  • 이재호;김병일
    • Proceedings of the IEEK Conference
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    • 1998.10a
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    • pp.593-596
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    • 1998
  • Effects of current re-stress after anneal on leakage current and trapped charges in oxides are investigated. Current stress on 6 nm thick oxide has generated mostly positive traps within the oxide resulting in leakage currents. The interface states generated are several orders of magnitude smaller, determined by C-V and charge pumping method. Annealing has eliminated only the charged traps not the neutral traps, thus the leakage current and trap density are increased when the oxides are re-stressed.

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Resistive Switching Characteristics of Amorphous GeSe ReRAM without Metalic Filaments Conduction

  • Nam, Gi-Hyeon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.368.1-368.1
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    • 2014
  • We proposed amorphous GeSe-based ReRAM device of metal-insulator-metal (M-I-M) structure. The operation characteristics of memory device occured unipolar switching characteristics. By introducing the concepts of valance-alternation-pairs (VAPs) and chalcogen vacancies, the unipolar resistive switching operation had been explained. In addition, the current transport behavior were analyzed with space charge effect of VAPs, Schottky emission in metal/GeSe interface and P-F emission by GeSe bulk trap in mind. The GeSe ReRAM device of M-I-M structure indicated the stable memory switching characteristics. Furthermore, excellent stability, endurance and retention characteristics were also verified.

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An Implement of SNMP -based EMS for IP Network Management (IP 망 관리를 위한 SNMP 기반 EMS 개발)

  • 민경주;강석민;김태석;조익현;권택근
    • Proceedings of the Korean Information Science Society Conference
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    • 2001.10c
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    • pp.481-483
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    • 2001
  • 본 논문에서는 Linux 상에서 SNMP (Simple Network Management Protocol) 에이전트(Agent)를 구현하고, 기존의 복잡한 명령어 체계를 향상하기 위해 shell을 통만 CLI (Command Line Interface)와 Jave를 통만 EMS(Element Management Station) 시스템을 설계하고 구현하였다. 연구 개발된 에이전트는 매너저의 요정에 응답을 하고, 시스템 상의 오류와 같은 상황이 발생했을 때, 매니저에게 TRAP을 발생시키는 기능을 갖는다. 본 논문에서는 개발된 SNMP 에이전트의 개발 환경, 개발 내용과 실험내용에 대해 언급하였다.

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