• 한국윤활학회:학술대회논문집
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• 한국윤활학회 1999년도 제29회 춘계학술대회
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• pp.53-60
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• 1999

As the flying height decreased, it is essential that hard disk drives perform reliable under various environmental conditions. In this paper the tribological characteristics of a head/disk interface are investigated under various temperature, relative humidity, altitude and outgas conditions. Specially, Contact-Start-Stop(CSS) tests were performed to assess the stiction, acoustic emission, slider take-off behavior, and track average amplitude(TAA). It is shown that the surface damage and head failure are accelerated by high temperature and humidity as well as low ambient pressure.

• Journal of the Korean Society for Industrial and Applied Mathematics
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• 제23권2호
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• pp.65-92
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• 2019

We survey a recently developed immersed finite element method (IFEM) for the interface problems. The IFEM uses structured grids such as uniform grids, even if the interface is a smooth curve. Instead of fitting the curved interface, the bases are modified so that they satisfy the jump conditions along the interface. The early versions of IFEM [1, 2] were suboptimal in convergence order [3]. Later, the consistency terms were added to the bilinear forms [4, 5], thus the scheme became optimal and the error estimates were proven. For elasticity problems with interfaces, we modify the Crouzeix-Raviart based element to satisfy the traction conditions along the interface [6], but the consistency terms are not needed. To satisfy the Korn's inequality, we add the stabilizing terms to the bilinear form. The optimal error estimate was shown for a triangular grid. Lastly, we describe the multigrid algorithms for the discretized system arising from IFEM. The prolongation operators are designed so that the prolongated function satisfy the flux continuity condition along the interface. The W-cycle convergence was proved, and the number of V-cycle is independent of the mesh size.

• 대한토목학회논문집
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• 제26권6D호
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• pp.951-960
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• 2006

본 연구에서는 실제 주행차량의 수평하중이 다양한 층 경계면 마찰계수 상태의 포장구조체에 미치는 영향을 고찰하기 위해 수평하중을 고려한 포장구조해석 모델링을 구축하였다. 기존 해석프로그램의 경계층 평가분석을 고찰하기 위하여 기존 다층탄성해석프로그램인 KENLAYER와 구축된 모델링을 이용한 상용 유한요소해석프로그램 ABAQUS 로부터 연직하중과 수평하중이 작용하는 경우 및 하중조합의 경우 포장체 거동을 비교분석하였다. 또한 각각의 하중상태하에서 경계층 상태에 따른 포장구조체의 공용성을 평가한 후, 연직하중과 수평하중이 동시에 가해지는 포장구조체의 경계면 상태에 따른 영향계수의 데이터베이스를 구축하였다. 기존의 주행차량의 연직하중만을 고려한 경우와 실제 주행차량의 수평하중과 연직 하중을 고려한 경우 포장구조체에 미치는 영향을 분석한 결과, 수평하중의 작용으로 인해 공용수명이 약 1/300로 감소하므로, 포장구조해석시 주행차량의 수평하중을 고려한 층 경계면 영향계수 개발이 필요함을 알 수 있었다. 또한 국내 고속도로의 대표단면을 이용하여 수치해석을 실시한 결과, 아스팔트층의 두께가 얇을수록, 또한 아스팔트층의 탄성계수가 작을수록 경계면 상태에 큰 영향을 받음을 알 수 있었다. 포장구조해석시 주행차량의 수평하중을 고려하기 위하여 포장구조체 공용수명에 영향을 미치는 아스팔트층의 두께, 탄성계수, 그리고 경계면 조건으로부터 아스팔트층 하부의 인장변형률을 결정하는 인장변형률 예측식을 제안하였고, 공용중인 포장구조체의 두께와 탄성계수를 이용하여 인장변형률 예측식을 해석적으로 검증하였다. 또한 제안된 예측식을 이용하여 아스팔트층과 보조기층 사이의 접합여부에 따른 인장변형률 영향계수를 개발하였다.

• 대한기계학회논문집B
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• 제24권12호
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• pp.1635-1643
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• 2000

The present work investigates a heat transfer phenomenon at the interface between a porous medium and an impermeable wall. In an effort to appropriately describe the heat transfer phenomenon at the interface, the heat transfer at the interface between the microchannel heat sink, which is an ideally organized porous medium, and the finite-thickness substrate is examined. From the examination, it is clarified that the he heat flux distribution at the interface is not uniform for the impermeable wall with finite thickness. On the other hand, the first approach, based on the energy balance for the representative elementary volume in the porous medium, is physically reason able. When the first approach is applied to the thermal boundary condition, and additional boundary condition based on the local thermal equilibrium assumption at the interface is used. This additional boundary condition is applicable except for the very th in impermeable wall. Hence, for practical situations, the first approach in combination with the local thermal equilibrium assumption at the interface is suggested as an appropriate thermal boundary condition. In order to confirm our suggestion, convective flows both in a microchannel heat sink and in a sintered porous channel subject to a constant heat flux condition are analyzed. The analytically obtained thermal resistance of the microchannel heat sink and the numerically obtained overall Nusselt number for the sintered porous channel are shown to be in close agreement with available experimental results when our suggestion for the thermal boundary conditions is applied.

• 한국도로학회논문집
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• 제7권3호
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• pp.11-21
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• 2005

본 연구에서는 기존의 아스팔트 콘크리트 포장구조해석에 사용되는 다층탄성해석에서 경계면의 영향을 평가하기 위해 상용 유한요소해석 프로그램인 ABAQUS와 다층탄성 프로그램인 KENLAYER를 이용하여 연직하중이 작용하는 경우의 경계면 특성에 따른 포장성능에 관한 비교 분석을 실시하였다. 그리고 실제 주행하중에 의해 발생되는 수평하중이 포장체에 미치는 영향을 고찰하기 위해 수평하중을 고려한 포장구조해석도 실시하였다. 이를 위해 ABAQUS를 이용하여 경계면 상태에 따른 포장구조체 내부에서 발생하는 변형률 및 처짐을 분석하고, 경계면의 접합상태에 따른 효과를 분석하였다. 이러한 과정을 통해 경계면 상태에 따른 포장체의 공용성에 관한 기존의 정성적 평가로부터 수치해석을 통해 정량적 평가를 실시하고, 경계면 효과에 대한 기본연구를 실시하였다. 연구 결과 기존 해석에서 사용되는 연직하중만 작용하는 경우와 실제 주행하중을 모사하는 연직하중과 수평하중이 동시에 작용하는 경우 수평하중의 작용으로 인해 공용횟수가 약 1/300로 감소하여 포장구조해석시 수평하중을 고려한 해석이 절실히 필요함을 알 수 있었다.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 1999년도 춘계종합학술대회
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• pp.411-414
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• 1999

70 ${\AA}$-thick oxides nitridied at various conditions were reoxidized at pemperatures of 900$^{\circ}C$ in dry-O$_2$ ambients for 5～40 mininutes. The gate oxide interface porperties as well as the oxide substrate interface properties of MOS(Metal Oxide Semiconductor) capacitors with various nitridation conditions, reoxidation conditions and pure oxidation condition were investigated. We stuided I$\sub$g/-V$\sub$g/ characteristics, $\Delta$V$\sub$g/ shift under constant current stress from electrical characteristics point of view and breakdown voltage from leakage current point of view of MOS capacitors with SiO$_2$, NO, RNO dielectrics. Overall, our experimental results show that reoxidized nitrided oxides show inproved charge trapping porperites, I$\sub$g/-V$\sub$g/ characteristics and gate $\Delta$V$\sub$g/ shift. It has also been shown that reoxidized nitridied oxide's leakage currented voltage is better than pure oxide's or nitrided oxide's from leakage current(1${\mu}$A) point of view.

• Progress in Superconductivity
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• 제3권2호
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• pp.168-171
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• 2002

We have demonstrated ramp-edge Josephson junctions using high temperature superconductors without depositing artificial barriers. We fabricated a surface barrier formed naturally during an ion beam etching process and the annealing under the oxygen atmosphere. The experimental results imply that the barrier natures such as the resistivity are varied by the annealing conditions and the ion milling conditions including the beam voltages. Thus, the ann eating and etching conditions should be optimized to obtain excellent junction properties. In optimizing the fabricating factors, the interface-controlled junctions showed resistively shunted junctions like current-voltage characteristics and an excellent uniformity. These junctions exhibited a spread ($1\sigma$) of $I_{c}$ is 10% fur chips containing 7 junctions at 50K.K.

• 소성∙가공
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• 제7권1호
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• pp.66-71
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• 1998

The present study is concerned with the hydrostatic extrusion process of copper-clad aluminium bar to investigate the bonding conditions as well as the basic flow characteristics. Considering the bonding mechanism of bi-metal contact surface as cold pressure welding the normal pressure and the contact surface expansion are selected as process parameters governing the bonding conditions, in this study the critical normal pressure required for the local extrusion-the protrusion of virgin surfaces by the surface expansion at the interface-is obtained using a slip line method and is then used as a criteron for the bonding. A rigid plastic finite element method is used to analyze the steady state extrusion process. The interface profile of bi-metal rod is predicted by tracking the paths of two particles adja-process. The interface profile of bi-metal rod is predicted by tracking the paths of two particles adja-cent to interface surface. The contact surface area ration and the normal pressure along the interface are calculated and compared to the critical normal pressure to check bonding. It is found that the model predictions are generally in good agreement with the experimental observations. The compar-isons of the extrusion pressure and interface profile by the finite element with those by experi-ments are also given.

• 한국전기전자재료학회논문지
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• 제18권4호
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• pp.350-356
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• 2005

We report the space charge and the surface potential of the interface between metal and copper(Ⅱ)-phthalocyanine(CuPc) thin films by measuring the microwave reflection coefficients S/sub 11/ of thin films using a near-field scanning microwave microscope(NSMM). CuPc thin films were prepared on Au and Al thin films using a thermal evaporation method. Two kinds of CuPc thin films were prepared by different substrate heating conditions; one was deposited on preheated substrate at 150。C and the other was annealed after deposition. The microwave reflection coefficients S/sub 11/ of CuPc thin films were changed by the dependence on grain alignment due to heat treatment conditions and depended on thickness of CuPc thin films. Electrical conductivity of interface between metal and organic CuPc was changed by the space charge of the interface. By comparing reflection coefficient S/sub 11/ we observed the electrical conductivity changes of CuPc thin films by the changes of surface potential and space charge at the interface.

• 열처리공학회지
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• 제16권1호
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• pp.2-9
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• 2003

The aluminum alloy which is light and has excellent thermal conductivity and iron base alloy that is remarkable heat-resistece and wear resistence properties were bonded together. The bond was created between a stationary and a rotating member by using the frictional heat generated between them while subjected to high normal forces on the interface of Al alloy and iron base alloy. The microstructure of the bonded interface of friction welding and the strength in the bonded interface formed under various bonding conditions were examined through TEM, SEM with EDX and triple bending test. In interface of bonding materials formed after various heat treatment, bonding strength was substantially different, resulting from formation of intermetallic compound or softening during annealing.