• Title/Summary/Keyword: Interface Release Rate

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The Epoxy-metal Interphase and Its Incidence on Practical Adhesion

  • Roche, Alain Andre;Aufray, Maelenn
    • Journal of Adhesion and Interface
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    • v.4 no.2
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    • pp.1-9
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    • 2003
  • Epoxy-amine liquid prepolymers are extensively applied onto metallic substrates and cured to obtain painted materials or bonded joint structures. Overall performances of such systems depend on the created interphase between the organic layer and the substrate. When epoxy-amine liquid mixtures are applied onto more or less hydrated metallic oxide layer, concomitant amine chemical sorption and hydroxide dissolution appear lending to the chelate formation. As soon as the chelate concentration is higher than the solubility product, these species crystallize as sharp needles. Moreover, intrinsic and thermal residual stresses are developed within painted or bonded systems. When residual stresses are higher than the organic layer/substrate adhesion, buckling, blistering, debonding may occur leading to a catastrophic drop of system performances. Practical adhesion can be evaluated with either ultimate parameters (Fmax or Dmax) or the critical strain energy release rate, using the three point flexure test (ISO 14679-1997). We observe that, for the same system, the ultimate load decreases while residual stresses increase when the liquid/solid time increases. Ultimate loads and residual stresses depend on the metallic surface treatment. For these systems, the critical strain energy release rate which takes into account the residual stress profile and the Young's modulus gradient remains quite constant whatever the metallic surface treatment was. These variations will be discussed and correlate to the formation mechanisms of the interphase.

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Theoretical Analysis of Interface Crack on Thin Plate (얇은 접합층의 계면균열에 대한 이론적 해석)

  • Nho, Hwan-Jin
    • Journal of the Society of Naval Architects of Korea
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    • v.44 no.6
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    • pp.627-634
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    • 2007
  • A bonded plate or a coated part can be debonded by external impact or thermal expansion. To analyse adhesive strength, the blister test is generally adopted. In this paper, a blister test is modelled theoretically and then the stability and bifurcation of the blister are studied under several different cases. The blister is simplified to consist of a pure bending plate attached elastically to the rigid substrate. Expression of the energy release rate is obtained as a form of an explicit function for a circular-type blister or tunnel-type blister grown by controlling the internal pressure or internal volume. Stability and bifurcation are also studied in the frame of the quasi-static evolution. The study shows that the circular- type blister propagates with the first mode of bifurcation and that the tunnel-type blister propagates with a regular wave. It is proved that the waves have the same form on two side lines of the tunnel and that the wave length can be obtained. When the internal pressure is controlled, the blister is unstable, but when the internal volume is controlled, it is stable.

A Study on the Delamination Growth in Composite Laminates Subjected to Low-Velocity Impact (저속 충격을 받는 복합 재료 적층판의 층간 분리 성장에 관한 연구)

  • 장창두;송하철;김호경;허기선;정종진
    • Journal of Ocean Engineering and Technology
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    • v.16 no.6
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    • pp.55-59
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    • 2002
  • Delamination means that cracking occurs on the interface layer between composite laminates. In this paper, to predict the delamination growth in composite laminates subjected to low-velocity impact, the unit load method was introduced, and an eighteen-node 3-D finite element analysis, based on assumed strain mixed formulation, was conducted. Strain energy release rate, necessary to determine the delamination growth, was calculated by using the virtual crack closure technique. The unit load method saves the computation time more than the re-meshing method. The virtual crack closure technique enables the strain energy release rate to be easily calculated, because information of the singular stress field near the crack tip is not required. Hence, the delamination growth in composite laminates that are subjected to low-velocity impact can be efficiently predicted using the above-mentioned methods.

Mode III Dynamic Interfacial Crack in Bonded Anisotropic Strip Under Anti-Plane Deformation (이방성재료 접합 띠판에 대한 면외 동적계면균열)

  • Park, Jae-Wan;Choi, Sung-Ryul
    • Proceedings of the KSME Conference
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    • 2000.11a
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    • pp.111-116
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    • 2000
  • A semi-infinite interfacial crack propagated with constant velocity in two bonded anisotropic strip under out-of-plane clamped displacements is analyzed. The asymptotic stress and displacement fields near the crack tip are obtained, where the results get more general expressions applicable not only to isotropic/orthotropic materials but also to the extent of the anisotropic material having one plane of elastic symmetry for the interfacial crack. The dynamic stress intensity factor is obtained as a closed form, which is decreased as the velocity of crack propagation increases. The critical velocity where the stress intensity factor comes to zero is obtained, which agrees with the lower value between the critical values of parallel crack merged in the material 1 and 2 adjacent to the interface. The dynamic energy release rate is also obtained as a form related to the stress intensity factor.

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Estimate on related to Chip Set and the other Various Parameter in Electronic Plastic Package (반도체 패키지의 칩셋과 다른 설계변수와의 연관성 평가)

  • Kwon, Yong-Su
    • Journal of the Korean Society of Industry Convergence
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    • v.2 no.2
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    • pp.131-137
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    • 1999
  • Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the energy release rate criterion. The package crack formation depend on various parameters such as chip set, chip size, package thickness, package width, material properties and the moisture content etc. The effects of chip set and the other parameters were estimated during the analysis of package cracks which were located in the edge of the upper interface of the chip and the lower interlace of the die pad. From the results, it could be obtained that the more significant parameters to effect the chip set are chip width.

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Interfacial Fracture Toughness Measurement of Composite/metal Bonding (복합재료/금속 접착 계면의 파괴인성치 측정)

  • Kim, Won-Seock;Lee, Jung-Ju
    • Composites Research
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    • v.21 no.4
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    • pp.7-14
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    • 2008
  • Prediction of the load-bearing capacity of an adhesive-bonded Joint is of practical importance for engineers. This paper introduces interface fracture mechanics approach to predict the load-bearing capacity of composite metal bonded joints. The adhesion strength of composite/steel bonding is evaluated in terms of the energy release rate of an interfacial crack and the fracture toughness of the interface. Virtual track closure technique (VCCT) is used to calculate energy release rates, and hi-material end-notched flexure (ENF) specimens are devised to measure the interfacial fracture toughness. Bi-material ENF specimens gave consistent mode II fracture toughness $(G_{IIc})$ values of the composite/steel interface regardless of the thickness of specimens. The critical energy release rates of double-lap joints showed a good agreement with the measured fracture toughness. Therefore. the energy-based interfacial fracture characterization can be a practical engineering tool for predicting the load-bearing capacity of bonded joints.

Development of Real-Time Forecasting and Management System for the Youngsan Estuary Dam (영산강 하구둑 실시간 홍수예보 및 관리시스템 개발)

  • Kang, Min-Goo;Park, Seung-Woo;Her, Young-Gu;Park, Chang-Eun;Kang, Moon-Sung
    • Proceedings of the Korean Society of Agricultural Engineers Conference
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    • 2002.10a
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    • pp.285-288
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    • 2002
  • For real-time flood forecasting and effective control flood at the Youngsan estuary dam, the Flood Forecasting and Control User Interface System II (FFCUS II) has been developed. This paper describes the features and application of FFCUS II. FFCUS II is composed of the database management subsystem, the model subsystem, and the graphic user interface. The database management subsyem collects rainfall data and stream flow data, updates, processes, and searches the data. The model subsystem predicts the inflow hydrograph, the tide, forecasts flood hydrograph, and simulates the release rate from the sluice gates. The graphic user interface subsystem aids the user's decision-making process by displaying the operation results of the database management subsystem and model subsystem.

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Numerical Analysis on the Die Pad/Epoxy Molding Compound(EMC) Interface Delamination in Plastic Packages under Thermal and Vapor Pressure Loadings

  • Jin Yu
    • Journal of the Microelectronics and Packaging Society
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    • v.5 no.2
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    • pp.37-48
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    • 1998
  • The popcorn cracking phenomena in plastic IC packages during reflow soldering are investigated by considering the heat transfer and moisture diffusion through the epoxy molding compound(EMC) along with the mechanics of interface delamination. Heat transfer and moisture diffusion through EMC under die pad are analyzed by finite difference method (FDM)during the pre-conditioning and subsequent reflow soldiering pro-cess and the amounts of moisture mass and vapor pressure at delaminated die pad/ EMC interface are calculated as a function of the reflow soldering time. The energy release rate stress intensity factor and phase angle were obtained under various loading conditions which are thermal crack face vapor pressure and mixed loadings. It was shown that thermal loading was the main driving force for the crack propagation for small crack lengths but vapor pressure loading played more significant role as crack grew.

Preparation and Controlled Release Characterization of Crosslinked Chitosan Microcapsules (가교된 키토산으로 형성된 마이크로캡슐의 제조 및 방출 특성)

  • Han, A Reum;Shin, Young Jae;Lee, Chun Il;Pyo, Hyeong Bae;Shin, Jae Sup
    • Journal of Adhesion and Interface
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    • v.9 no.2
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    • pp.8-15
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    • 2008
  • Microcapsules have been widely used in cosmetics and pharmacology as controlled delivery devices of various active materials. Chitosan is the second most plentiful natural biopolymer with biocompatibility and nontoxicity. The chitosan microcapsules were prepared by the water-in-oil (W/O) emulsion method using glutaraldehyde as a crosslinking agent. Span80 was used as an emulsifier, and mineral oil was used as a medium material. Perfectly spherical microcapsules were obtained in the size range of $2{\sim}10{\mu}m$. The effects of emulsifier concentration and stirring speed on the average particle size and distribution were investigated. Encapsulation and release behavior of the microcapsules with different amount of the crosslinking agent (glutaraldehyde), different chitosan contents and different emulsifier concentration conditions were also investigated. The release rate of riboflavin was controlled by the crosslinking density of the chitosan and amount of emulsifier in the preparation of the microcapsule.

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Preparation and Release Characterization of Biodegradable Poly($\varepsilon$-caprolactone) Microcapsules Containing Tocopherol (토코페롤을 함유하는 생분해성 폴리($\varepsilon$-카프로락톤) 마이크로캡슐의 제조 및 방출 특성)

  • 박수진;김기석;민병각;홍성권
    • Polymer(Korea)
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    • v.28 no.2
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    • pp.103-110
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    • 2004
  • The biodegradable poly($\varepsilon$-caprolactone) (PCL) microcapsules containing tocopherol were prepared by oil-in-water emulsion solvent evaporation method. The features of the microcapsules were investigated in the manufacturing conditions and degradation behaviors. The form and structural feature of the microcapsules were measured by scanning electron microscope and X-ray diffraction, respectively. The surface free energy of the microcapsules was executed using contact angle measurement. As a result, the microcapsules were more stable and spherical with poly(vinyl alcohol) given in a surfactant. The surface free energy and crystallinity of microcapsules were decreased with increasing the core concentration, and degradation of PCL was occurred after 21 days. The release behaviors were examined by Uv/vis. spectrophotometer. It was found that the release rate of the microcapsules was increased with increasing the stirring rate, due to the increased interface between microcapsules and release media.