• Title/Summary/Keyword: Interconnections

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Synchronization of Common Channel in Distributed Push Servers (분산 푸시서버에서 공통채널 연동)

  • 연승호;김영헌;한군희;백순화;전병민
    • Journal of Broadcast Engineering
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    • v.5 no.1
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    • pp.130-138
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    • 2000
  • The paper describes a push system, a broadcasting system in the internet, which is developed for internet and intranet use. In this paper, we carried out research on the method to support the large number of users in the intranet environment. Particularly the paper analyzes the effects on the network traffic according to the number of the user connected to the push system and the frequency of the connections when push servers are distributed over the intranet. Push system described here uses two different kinds of channels, common channel and local channel. Common channel is the channel to be replicated among the push servers in the intranet. This paper shows that the method using the common channel synchronization is efficient in supporting the large number of intranet users. We introduce an algorithm to make the interconnections between channels efficiently amongpush servers distributed over the intranet.

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A Literature Study on Listening and Smelling Examination - Focused on Listening Examination - (문진(聞診)에 대한 서지학적 고찰 - 청진(聽診)을 중심으로 -)

  • Kim, Jin-Ho
    • Journal of Korean Medical classics
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    • v.28 no.2
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    • pp.17-32
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    • 2015
  • Objectives : The purpose of this study was to figure out interconnections between studies with studies of individual books that information on Listening Examination is included. Through this, what Listening Examination have looked like and how it has been developed were investigated in this study. Methods : Books that information on Listening Examination is included was investigated in order according to the stream of times. Results & Conclusions : Varied information on Listening Examination was mentioned in Neijing. Later, the development that was made in various fields went through the process of integration. Typically, Yixuezhunshengliuyao can serve an example. A previous book mentioned above and Yidengxuyan Wenzhen in the Qing Dynasty were very influential as those were quoted in not a few of books of next generation. In the Qing Dynasty, meanwhile, the new information and a variety of perspectives on the Listening Examination were raised. 'Voice' and 'sound', weakness and firmness, Listening Examination method and theoretical contents became rich in content. Different points of view as follows were raised: divided opinion on two topics such as 'voice' and 'respiration', understanding through Triple Energizer, moisture control and emphasis on relationship between Essence, Qi, Spirit and Life, etc.

An Amorphous Silicon Local Interconnection (ASLI) CMOS with Self-Aligned Source/Drain and Its Electrical Characteristics

  • Yoon, Yong-Sun;Baek, Kyu-Ha;Park, Jong-Moon;Nam, Kee-Soo
    • ETRI Journal
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    • v.19 no.4
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    • pp.402-413
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    • 1997
  • A CMOS device which has an extended heavily-doped amorphous silicon source/drain layer on the field oxide and an amorphous silicon local interconnection (ASLI) layer in the self-aligned source/drain region has been studied. The ASLI layer has some important roles of the local interconnections from the extended source/drain to the bulk source/drain and the path of the dopant diffusion sources to the bulk. The junction depth and the area of the source/drain can be controlled easily by the ASLI layer thickness. The device in this paper not only has very small area of source/drain junctions, but has very shallow junction depths than those of the conventional CMOS device. An operating speed, however, is enhanced significantly compared with the conventional ones, because the junction capacitance of the source/drain is reduced remarkably due to the very small area of source/drain junctions. For a 71-stage unloaded CMOS ring oscillator, 128 ps/gate has been obtained at power supply voltage of 3.3V. Utilizing this proposed structure, a buried channel PMOS device for the deep submicron regime, known to be difficult to implement, can be fabricated easily.

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Sn58Bi Solder Interconnection for Low-Temperature Flex-on-Flex Bonding

  • Lee, Haksun;Choi, Kwang-Seong;Eom, Yong-Sung;Bae, Hyun-Cheol;Lee, Jin Ho
    • ETRI Journal
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    • v.38 no.6
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    • pp.1163-1171
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    • 2016
  • Integration technologies involving flexible substrates are receiving significant attention owing the appearance of new products regarding wearable and Internet of Things technologies. There has been a continuous demand from the industry for a reliable bonding method applicable to a low-temperature process and flexible substrates. Up to now, however, an anisotropic conductive film (ACF) has been predominantly used in applications involving flexible substrates; we therefore suggest low-temperature lead-free soldering and bonding processes as a possible alternative for flex-on-flex applications. Test vehicles were designed on polyimide flexible substrates (FPCBs) to measure the contact resistances. Solder bumping was carried out using a solder-on-pad process with Solder Bump Maker based on Sn58Bi for low-temperature applications. In addition, thermocompression bonding of FPCBs was successfully demonstrated within the temperature of $150^{\circ}C$ using a newly developed fluxing underfill material with fluxing and curing capabilities at low temperature. The same FPCBs were bonded using commercially available ACFs in order to compare the joint properties with those of a joint formed using solder and an underfill. Both of the interconnections formed with Sn58Bi and ACF were examined through a contact resistance measurement, an $85^{\circ}C$ and 85% reliability test, and an SEM cross-sectional analysis.

Study on Stabilizable Interconnected system by Decentralized Control (분산 제어로 안정 가능한 대형 시스템에 대하여)

  • 이종수;최종호
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.19 no.4
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    • pp.15-20
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    • 1982
  • Stabilization by decentralized control is an important problem in large scale systems and there has been an increasing interest in this area. The objective of this paper is to obtain the sufficient condition for an interconnected system to be stabilited by local feedback. Recently there has been many papers about this, and we further broaden the class of interconnections for which we can find a decentralized control to stabilize the overall system. The interconnection matrix may take any arbitrary time invariant values and this implies connective stability in some sense. The assumed model is mire general than most of previous ones, and as a special case, when each subsystem is given by companion form of a single inputs the result is compared with that of Ikeda and Siljak. The obtained result is illustrated by examples.

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An analysis of crosstalk in hihg-speed packaging interconnects using the finite difference time domain method (시간 영역 유한 차분법을 이용한 고속 패키지 접속 선로의 누화 해석)

  • 남상식;장상건;진연강
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.22 no.9
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    • pp.1975-1984
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    • 1997
  • In this paper, we analyzed the frequency characteristics and the crosstalk of the adjacent parallel lines and the crossed lines in high-speed packaging interconnections by using the three-dimensional finite difference time domain (3D FDTD) method. To analyze the actual crosstalk phenomena in the transmission of the high-speed digital sgnal, the step pulse with fast rise time was used for the source excitation signal instead of using the Gaussian pulse that is generally used in FDTD. To veify the theoretical resutls, the experimental interconnection lines that were fabricated on the Duroid substrate($\varepsilon_{r}$=2.33, h=0.787 [mm]) were tested by TDR(time domain reflectometry). The results show good agreement between the analyzed results and the tested outcomes.

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HV-SoP Technology for Maskless Fine-Pitch Bumping Process

  • Son, Jihye;Eom, Yong-Sung;Choi, Kwang-Seong;Lee, Haksun;Bae, Hyun-Cheol;Lee, Jin-Ho
    • ETRI Journal
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    • v.37 no.3
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    • pp.523-532
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    • 2015
  • Recently, we have witnessed the gradual miniaturization of electronic devices. In miniaturized devices, flip-chip bonding has become a necessity over other bonding methods. For the electrical connections in miniaturized devices, fine-pitch solder bumping has been widely studied. In this study, high-volume solder-on-pad (HV-SoP) technology was developed using a novel maskless printing method. For the new SoP process, we used a special material called a solder bump maker (SBM). Using an SBM, which consists of resin and solder powder, uniform bumps can easily be made without a mask. To optimize the height of solder bumps, various conditions such as the mask design, oxygen concentration, and processing method are controlled. In this study, a double printing method, which is a modification of a general single printing method, is suggested. The average, maximum, and minimum obtained heights of solder bumps are $28.3{\mu}m$, $31.7{\mu}m$, and $26.3{\mu}m$, respectively. It is expected that the HV-SoP process will reduce the costs for solder bumping and will be used for electrical interconnections in fine-pitch flip-chip bonding.

Preliminary Works of Contact via Formation of LCD Backplanes Using Silver Printing

  • Yang, Yong Suk;You, In-Kyu;Han, Hyun;Koo, Jae Bon;Lim, Sang Chul;Jung, Soon-Won;Na, Bock Soon;Kim, Hye-Min;Kim, Minseok;Moon, Seok-Hwan
    • ETRI Journal
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    • v.35 no.4
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    • pp.571-577
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    • 2013
  • The fabrication of a thin-film transistor backplane and a liquid-crystal display using printing processes can eliminate the need for photolithography and offers the potential to reduce the manufacturing costs. In this study, we prepare contact via structures through a poly(methyl methacrylate) polymer insulator layer using inkjet printing. When droplets of silver ink composed of a polymer solvent are placed onto the polymer insulator and annealed at high temperatures, the silver ink penetrates the interior of the polymer and generates conducting paths between the top and bottom metal lines through the partial dissolution and swelling of the polymer. The electrical property of various contact via-hole interconnections is investigated using a semiconductor characterization system.

A Study of an 8-b${\times}$8-b Adiabatic Pipelined Multiplier with Simplified Supply Clock Generator (단열회로를 이용한 8-b${\times}$8-b 파이프라인 승산기와 개선된 전원클럭 발생기의 연구)

  • Moon, Yong
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.38 no.4
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    • pp.285-291
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    • 2001
  • An 8-b$\times$8-b adiabatic pipelined multiplier is designed. Simplified four phase clock generator is also designed to provide supply clocks for adiabatic circuits. All the clock line charge on the capacitive interconnections is recovered to save energy. Adiabatic circuits are designed based on ECRL(efficient charge recovery logic) and are integrated using 0.6${\mu}{\textrm}{m}$ CMOS technology. The efficiency of proposed supply clock generator is better than the previous one by 4~11%. Simulation results show that the power consumption of adiabatic pipelined multiplier is reduced by a factor of 2.6~3.5 compared to a conventional pipelined CMOS multiplier.

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A Study on Character Make-up Based on Impressiology (인상학에 근거한 성격분장에 관한 연구)

  • Lee, Mi-Ae;Kim, Yong-Sun
    • Journal of the Korean Society of Fashion and Beauty
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    • v.3 no.2 s.2
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    • pp.1-11
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    • 2005
  • This study is focusing on typicalized character make-up of TV Drama characters. The purpose of this study is to analyze the interconnections of its images and impressiology concretely, and then reflect on an application approach of impressiology. The aim of make-up lies in not only helping actors to visualize their own external qualities, appropriate the quality of a play, but also audience and spectators to be immersed in the concrete fact of i character person. Impressiology will be a data to give the understanding and sympathy of make-up work. I would like to utilize character make-up based on impressiology for creative and effective make-up techniques, and make it a typicalized character. Also I will examine the horizon of a new make-up technique through character development according to the demandes of the times. As a result of this study, we find that expression method of characteristic character generalized representatively is the common quality of impressiologistc image. Also we see that such a impressioiogistic image is useful for the fundamental basis of character expression method.

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