• Title/Summary/Keyword: Integration Devices

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Trends in Wavelength-Tunable Laser Development and Applications (파장가변 광원 개발 동향 및 응용)

  • O.K. Kwon;K.S. Kim;Y.-H. Kwon
    • Electronics and Telecommunications Trends
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    • v.39 no.1
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    • pp.48-61
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    • 2024
  • The integration of high-capacity terrestrial networks with non-terrestrial communication using satellites has become essential to support seamless low-latency services based on artificial intelligence and big data. Tunable light sources have been instrumental in resolving the complexity of channel management in wavelength division multiplexing (WDM) systems, contributing to increased network flexibility and serving as optical sources for long-distance coherent systems. Recently, these light sources have been applied to beam-steering devices in laser communication and sensing applications across ground, aerial, and satellite transport. We examine the utilization and requirements of tunable lasers in WDM networks and describe the relevant development status. In addition, performance requirements and development directions for tunable lasers used in optical interference systems and beam-steering devices are reviewed.

Development Trends in Advanced Packaging Technology of Global Foundry Big Three (글로벌 파운드리 Big3의 첨단 패키징 기술개발 동향)

  • H.S. Chun;S.S. Choi;D.H. Min
    • Electronics and Telecommunications Trends
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    • v.39 no.3
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    • pp.98-106
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    • 2024
  • Advanced packaging is emerging as a core technology owing to the increasing demand for multifunctional and highly integrated semiconductors to achieve low power and high performance following digital transformation. It may allow to overcome current limitations of semiconductor process miniaturization and enables single packaging of individual devices. The introduction of advanced packaging facilitates the integration of various chips into one device, and it is emerging as a competitive edge in the industry with high added value, possibly replacing traditional packaging that focuses on electrical connections and the protection of semiconductor devices.

Technical and Patent Information Analysis of Home Network Technologies (홈 네트워크 기술 및 특허동향 분석)

  • Kim, Jae-Woo;Yeo, Woon-Dong;Sung, Kyung-Mo
    • Proceedings of the IEEK Conference
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    • 2004.06a
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    • pp.273-276
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    • 2004
  • Home networking is the collection of elements that process, manage, transport, and store information, enabling the connection and integration of multiple computing, control, monitoring, and communication devices in the home. In this paper, we review the state of the home networking technologies and analyse the trends of the patent information.

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Enhancement of heat exchange using On-chip engineered heat sinks

  • Chong, Yonuk
    • Progress in Superconductivity and Cryogenics
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    • v.19 no.4
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    • pp.18-21
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    • 2017
  • We report a method for improving heat exchange between cryo-cooled large-power-dissipation devices and liquid cryogen. Micro-machined monolithic heat sinks were fabricated on a high integration density superconducting Josephson device, and studied for their effect on cooling the device. The monolithic heat sink showed a significant enhancement of cooling capability, which markedly improved the device operation under large dc- and microwave power dissipation. The detailed mechanism of the enhancement still needs further modeling and experiments in order to optimize the design of the heat sink.

High Integration Packaging Technology for RF Application

  • Lee, Young-Min
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 1999.12a
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    • pp.127-154
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    • 1999
  • Interconnect - Wire bonding-> Flip chip interconnect ; At research step, Au stud bump bonding seems to be more proper .Package -Plastic package-> $Z_{0}$ controlled land grid package -Flip Chip will be used for RF ICs and CSP for digital ICs -RF MCM comprised of bare active devices and integrated passive components -Electrical design skills are much more required in RF packaging .Passive Component -discrete-> integrated -Both of size and numbers of passive components must be reduced

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Assay development and HTS on microfluidic Lab-on-a-chip

  • Yang, Eun-Gyeong
    • Proceedings of the Korean Society of Applied Pharmacology
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    • 2002.07a
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    • pp.73-78
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    • 2002
  • Microfluidic lab-on-a-chip (LOC) systems have enabled a new generation ofassay technologies in chemical and biomedical sciences. Caliper's microfluidic LOC systems contain a network of microscopic channels through which fluids and chemical are moved in order to perform experiments. The main advantages of these continuous-flow devices are integration and automation of multiple steps in complex analytical procedures to improve the reproducibility of the results, and eliminated the manual labor, time and pipetting errors involved in analyses. The present talk is devoted to give a brief introduction of microfluidic basics and to present in applying continuous-flow microchips to drug screening with model enzyme assays.

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Silica-Based Planar Lightwave Circuits for WDM Applications

  • Okamoto, Katsunari;Inoue, Yasuyuki;Tanaka, Takuya;Ohmori, Yasuji
    • Electrical & Electronic Materials
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    • v.11 no.11
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    • pp.53-65
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    • 1998
  • Planar lightwave circuits (PLCs) provide various important devices for optical wavelength division multiplexing (WDM) systems, subscriber networks and etc. This paper reviews the recent progress and future prospects of PLC technologies including arrayed-waveguide grating multiplexers, optical add/drop multiplexers, programmable dispersion equalizers and hybrid optoelectronics integration technologies.

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InP JFET Devices for High Speed Switching Application (광대역 교환을 위한 InP JFET소자)

  • 지윤규;김성준;정종민
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.28A no.5
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    • pp.370-374
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    • 1991
  • A high performance fully ion-implanted InP JFET was characterized for high speed switching elements. The switch has an insertion loss of 5.5dB with 31.6dB isolation at 1GHz. This device can effectively swithc a byte-multiplexed 2Gb/s signal and an eye-diagram taken at 2Gb/s shows an error-free eye pattern. Therefore, this device can be used as a switching element for high transmission data rate for monolithic integration of optoelectronic circuit in the long-wavelength region.

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Design and implementation of HNCP-UPnP Bridge (HNCP-UPnP 브릿지 설계 및 구현)

  • 전요셉;명관주;이재민;권욱현
    • Proceedings of the IEEK Conference
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    • 2003.11c
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    • pp.47-50
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    • 2003
  • This paper describes the design and implementation of a HNCP-UPnP bridge. HNCP networked devices targeted to white goods are allowed to be controlled and monitored by UPnP Control Point. Bridge provides automated creation of UPnP proxy device and message conversion. The developed system enables integration of heterogeneous home network.

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Compact Wilkinon Power Divider Design and Simulation Using IPD Technology

  • Cong, Wang;Kim, Nam-Young
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.186-188
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    • 2008
  • The wireless communication revolution has spawned a revival of interest in the design and optimization of radio transceivers. Radio transmit modules continue to shrink in die size and cost, requiring novel approaches for integration of the numerous passive elements of the radio front-end. A 3 dB Wilkinson power divider based on GaAs substrates, for DCS 1710-1880 MHz band was designed and fabricated showing excellent performance.

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