• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.1-9
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• 2009

Conductive adhesives have recently received a lot of focus and attention from the researchers in electronics industry as a potential substitute to lead-containing solders. Numerous studies have shown that the conductive adhesives have many advantages over conventional soldering such as environmental friendliness, finer pitch feasibility and lower temperature processing. This review focuses on the recent research trends on the reliability and property evaluation of anisotropic and non-conductive films that interconnect the integrated circuit component to the printed circuit board or other types of substrate. Major topics covered are the conduction mechanism in adhesive interconnects; mechanical reliability; thermo-mechanical-hygroscopic reliability and electrical performance of the adhesive joints. This review article is aimed at providing a better understanding of adhesive interconnects, their principles, performance and feasible applications.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.2
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• pp.175-183
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• 2014

In this paper, we present the design and implementation of real-time sound localization based on $0.13{\mu}m$ CMOS process. Time delay of arrival (TDOA) estimation was used to obtain the direction of the sound signal. The sound localization chip consists of four modules: data buffering, short-term energy calculation, cross correlation, and azimuth calculation. Our chip achieved real-time processing speed with full range ($360^{\circ}$) using three microphones. Additionally, we developed a dedicated sound localization circuit (DSLC) system for measuring the accuracy of the sound localization chip. The DSLC system revealed that our chip gave reasonably accurate results in an experiment that was carried out in a noisy and reverberant environment. In addition, the performance of our chip was compared with those of other chip designs.

• Journal of Audiology & Otology
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• v.24 no.4
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• pp.174-179
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• 2020

Background and Objectives: The integration of auditory-visual speech information improves speech perception; however, if the auditory system input is disrupted due to hearing loss, auditory and visual inputs cannot be fully integrated. Additionally, temporal coincidence of auditory and visual input is a significantly important factor in integrating the input of these two senses. Time delayed acoustic pathway caused by the signal passing through digital signal processing. Therefore, this study aimed to investigate the effects of hearing loss and hearing aid digital delay circuit on sound-induced flash illusion. Subjects and Methods: A total of 13 adults with normal hearing, 13 with mild to moderate hearing loss, and 13 with moderate to severe hearing loss were enrolled in this study. Subsequently, the sound-induced flash illusion test was conducted, and the results were analyzed. Results: The results showed that hearing aid digital delay and hearing loss had no detrimental effect on sound-induced flash illusion. Conclusions: Transmission velocity and neural transduction rate of the auditory inputs decreased in patients with hearing loss. Hence, the integrating auditory and visual sensory cannot be combined completely. Although the transmission rate of the auditory sense input was approximately normal when the hearing aid was prescribed. Thus, it can be concluded that the processing delay in the hearing aid circuit is insufficient to disrupt the integration of auditory and visual information.

• ETRI Journal
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• v.45 no.3
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• pp.462-478
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• 2023

In quantum computing, the use of Pauli frames through software traces of classical computers improves computation efficiency. In previous studies, error correction and Pauli operation tracking have been performed simultaneously using integrated Pauli frames in the physical layer. In such a complex processing structure, the number of simultaneous operations processed in the physical layer exponentially increases as the distance of the surface code encoding logical qubit increases. This study proposes a Pauli frame management architecture partitioned into two layers for a lattice surgery-based surface code and describes its structure and operation rules. To evaluate the effectiveness of our method, we generated a random circuit according to the gate ratios constituting the commonly known quantum circuits and compared the generated circuit with the existing Pauli frame and our method. Simulations show a decrease of about 5% over traditional methods. In the case of experiments that only increase the code distance of the logical qubit, it can be seen that the effect of reducing the physical operation through the logical Pauli frame becomes more important.

• The KIPS Transactions:PartA
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• v.9A no.2
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• pp.259-266
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• 2002

In this paper we implemented various image processing filtering using the format converter. This design method is based on realized the large processor-per-pixel array by integrated circuit technology. These two types of integrated structure are can be classify associative parallel processor and parallel process DRAM (or SRAM) cell. Layout pitch of one-bit-wide logic is Identical memory cell pitch to array high density PEs in integrate structure. This format converter design has control path implementation efficiently, and can be utilize the high technology without complicated controller hardware. Sequence of array instruction are generated by host computer before process start, and instructions are saved on unit controller. Host computer is executed the pixel-parallel operation starting at saved instructions after processing start. As a result, we obtained three result that 1) simple smoothing suppresses higher spatial frequencies, reducing noise but also blurring edges, 2) a smoothing and segmentation process reduces noise while preserving sharp edges, and 3) median filtering may be applied to reduce image noise. Median filtering eliminates spikes while maintaining sharp edges and preserving monotonic variations in pixel values.

• Journal of the Korean Institute of Telematics and Electronics S
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• v.36S no.12
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• pp.67-75
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• 1999

In this paper, we present an ASIC(Application Specific Integrated Circuit) design of wavelet transform filter Wavelet transform is used in lots of application fields which include image compression, because it has an excellent energy compaction. The operation characteristic and performance of wavelet transform filter are analyzed by using verilog-HDL(Hardware Description Language). In this paper, the designed wavelet transform filter uses line memory to improve data processing rate. Generally, when it reads and writes data of DRAM by using Fast Page Mode, input and output processing is very fast in horizontal direction but substantially slow in vertical direction. The use of line memory solves this low speed processing problem. As a result, though the size of the chip is getting larger, processing time for an image frame becomes 4.66ms. Generally, since the limit of 1 frame processing time on the data of TV video is 33ms, so it is appropriate for TV video.

• Journal of IKEEE
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• v.2 no.1 s.2
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• pp.34-41
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• 1998

An integrated circuit for magnetic stripe storage system is implemented. All the analog and digital circuits are integrated in one chip. The analog block contains preamplifier, peak detecter, comparator and reference generater. And digital block includes reference window signal generater, up/down counter for F/2F signal measurement, bit-error detection logic, and control logic. Both the encoding and decoding functions for F/2F signal processing are provided. An AGC(automatic gain control) circuit which was included in conventional circuits is eliminated due to optimized circuit design. Misreading prevention circuits are also proposed by fixing up new reference bit when broken bits are detected. The prototype chip is implemented using $0.8{\mu}m$ N-well CMOS technology and operates from 3.3 V to 7.5 V of supply voltage. It occupies a die area of $3.04mm^2(1.6mm{\times}1.9mm)$ and dissipates 8 mW with a 5 V supply voltage.

• Korean Journal of Materials Research
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• v.22 no.7
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• pp.335-341
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• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.2
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• pp.118-123
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• 1989

In this paper, as we have integrated SCF for voice signal processing using CMOS circuit with the low power dissipation and the easy circuit design, it has been presented the simplified CMOS OP AMP design method with ${\pm}$5V pwoer source in order to use together with digital part. After an example about SCF CMOS OP AMP design, it has been performed layout appling channel width and length obtained by design method, and then its characteristics were simulated by SPICE 2G program. Therefoe, this design method will be applied the general CMOS OP AMP design in the electronic circuit.

• ETRI Journal
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• v.38 no.5
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• pp.981-987
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• 2016

We present a cost-effective dual polarization quadrature phase-shift coherent receiver module using a silica planar lightwave circuit (PLC) hybrid assembly. Two polarization beam splitters and two $90^{\circ}$ optical hybrids are monolithically integrated in one silica PLC chip with an index contrast of $2%-{\Delta}$. Two four-channel spot-size converter integrated waveguide-photodetector (PD) arrays are bonded on PD carriers for transverse-electric/transverse-magnetic polarization, and butt-coupled to a polished facet of the PLC using a simple chip-to-chip bonding method. Instead of a ceramic sub-mount, a low-cost printed circuit board is applied in the module. A stepped CuW block is used to dissipate the heat generated from trans-impedance amplifiers and to vertically align RF transmission lines. The fabricated coherent receiver shows a 3-dB bandwidth of 26 GHz and a common mode rejection ratio of 16 dB at 22 GHz for a local oscillator optical input. A bit error rate of $8.3{\times}10^{-11}$ is achieved at a 112-Gbps back-to-back transmission with off-line digital signal processing.