• Title/Summary/Keyword: Integrated assembly

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PEMFC Operation Connected with Methanol Reformer System

  • Lee, Jung-Hyun;Park, Sang-Sun;Shul, Yong-Gun;Park, Jong-Man;Kim, Dong-Hyun;Kim, Ha-Suck;Yoo, Seung-Eul
    • Carbon letters
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    • v.9 no.4
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    • pp.303-307
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    • 2008
  • The studies on integrated operation of fuel cell with fuel processor are very essential prior to its commercialization. In this study, Polymer Electrolyte Membrane Fuel Cell (PEMFC) was operated with a fuel processor, which is mainly composed of two parts, methanol steam reforming reaction and preferential oxidation (PROX). In fuel processor, ICI 33-5 (CuO 50%, ZnO 33%, $Al_2O_3$ 8%, BET surface area: $66\;m^2g^{-1}$) catalyst and CuO-$CeO_2$ catalyst were used for methanol steam reforming, preferential oxidation (PROX) respectively. PEMFC was operated by hydrogen fuel generated from fuel processor. The resulting gas from PROX reactor is used to operate PEMFC equipped with our prepared anode and cathode catalyst. PtRu/C catalyst gives more tolerance to CO.

Evaluation of Reactor Internals Integrity due to 5.5m Concentric Free Fall of KSNP+ Reactor Vessel Closure Head (KSNP+ 원자로덮개 5.5m 수직 낙하 시 원자로내부구조물 건전성 평가)

  • Namgyng, Ihn;Jeong, Seung-Ha;Lee, Dae-Hee;Choi, Taek-Sang
    • Proceedings of the KSME Conference
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    • 2003.11a
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    • pp.1358-1363
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    • 2003
  • Due to the application of Integrated Head Assembly (IHA) in KSNP+ reactor design, an investigation of reactor internals integrity is carried out to assure that the adoption of IHA does not affect the safety of reactor operation. One of the postulated accident events is the R.V. closure head fall from 5.5m high directly above the reactor vessel that may occur during the refueling operation. The analysis model consists of lumped mass elements of the entire reactor vessel and internals. Because of extreme load, separate elastic-plastic analyses are done for the members that undergo plastic deformation. The analysis verified that the stresses of the reactor internals and the fuel assemblies are within the bound of allowable stress limits and the integrity of the fuel assemblies is maintained.

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Analysis of Au-DNA Nanowires by Adding HCl to Change Charges of Au Nanoparticles

  • Jeong, Yun-Ho;Kim, Dae-Cheol;Park, Hyeon-Gyu;No, Yong-Han
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.421.1-421.1
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    • 2014
  • Top-down processes based on photolithography technology have been developed by using light sources with short wavelength, however, the processes are expected to meet their limits in higher integration of semiconductor integrated circuits. To overcome the limits, researches on bottom-up processes have been proceeded. One of those, fabrication of nanodevices by using nanoparticles has been on research. But it is difficult to align nanoparticles at appropriate positions. To resolve this, studies has been proceeded to form nanowires by bonding DNA molecules which have self-assembly property and positive-charged functionalized gold nanoparticles. There are negative-charged phosphates in backbones of DNA molecules. By using the attractive force between the negative charge of the phosphates and the positive charge of gold nanoparticles, the Au-DNA nanowires are made. However, bonding Au nanoparticles only on DNA molecules, not other nanoparticles, is to be solved. So we studied to resolve this problem. In the formation of Au nanoparticles, we changed the charge of Au nanoparticles by adding HCl to control pH of the functionalized nanoparticles, measured zeta potential. Then we bonded the nanoparticles and DNA molecules and made observation by using FE-SEM and AFM.

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Electrochemical Behavior for a Reduction of Uranium Oxide in a $LiCl-Li_{2}O$ Molten Salt with an Integrated Cathode assembly

  • Park, Sung-Bin;Park, Byung-Heung;Seo, Chung-Seok;Jung, Ki-Jung;Park, Seong-Won
    • Proceedings of the Korean Radioactive Waste Society Conference
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    • 2005.11b
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    • pp.39-50
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    • 2005
  • Electrolytic reduction of uranium oxide to uranium metal was studied in a $LiCl-Li_{2}O$ molten salt system. The reduction mechanism of the uranium oxide to a uranium metal has been studied by means of a cyclic voltammetry. Effects of the layer thickness of the uranium oxide and the thickness of the MgO on the overpotential of the cathode and the anode were investigated by means of a chronopotentiometry. From the cyclic voltamograms, the decomposition potentials of the metal oxides are the determining factors for the mechanism of the reduction of the uranium oxide in a $LiCl-3\;wt{\%} Li_{2}O$ molten salt and the two mechanisms of the electrolytic reduction were considered with regards to the applied cathode potential. In the chronopotentiograms, the exchange current and the transfer coefficient based on the Tafel behavior were obtained with regard to the layer thickness of the uranium oxide which is loaded into the porous MgO membrane and the thickness of the porous MgO membrane. The maximum allowable currents for the changes of the layer thickness of the uranium oxide and the thickness of the MgO membrane were also obtained from the limiting potential which is the decomposition potential of LiCl.

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Development of the 4th Generation CD Optical Pick-up with Small Thickness (4세대 박형 CD 광학 픽업 개발)

  • 최영석;김성근
    • Journal of the Korean Society for Precision Engineering
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    • v.15 no.3
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    • pp.38-49
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    • 1998
  • The 3rd generation optical pick-up used popularly in resent years is composed of many optical and electronic components such as laser diode, photo diode, beam splitter, objective lens, grating lens, concave lens, collimator lens etc. Therefore, the design of its optical system and its main base which the said optical and electronic components are set on, is complicated and needs high precision. Its assembly and adjustment in the production line is also difficult. This complication and the demand of high precision get its production cost to be high and its reliability to be low. In this paper, the 4th generation optical pick-up is designed and developed, with the hologram device which laser diode. photo diode, beam splitter. and grating lens are integrated in. This optical pick-up reduces the number of points of adjustment by 3, compared with the 3rd generation optical pick-up of which the number of points of adjustment is 6. This optical pickup also decreases by 4 the number of points of W bonding to have bad influence on environmental reliability, decreases by about 10 the number of parts, and establishes about 20% cost-down of material cost, compared with the 3rd generation optical pick-up.

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Development of a DMU System Operated on a PDM System (PDM 시스템에서 운용되는 DMU 시스템 개발)

  • 이강수;이상헌
    • Korean Journal of Computational Design and Engineering
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    • v.8 no.3
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    • pp.157-166
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    • 2003
  • In this paper, we explain the DMU (digital mockup) system based on the PDM system. Most manufacturing companies are trying to develop a competitive product by increasing the quality, shortening time to market (TIM) and reducing the cost of a product. Some technologies such as SE (System Engineering), CE (Concurrent Engineering), QFD (Quality Function Development), CI (Cost Innovation) and some systems such as CAD (Computer-Aided Design), CAE (Computer-Aided Engineering), CAM (Computer-Aided Manufacturing), PDM (Product Data Management) and visualization system are adopted for these purposes. Specially, DMU system utilizes a visualization system that shows the 3D shape of a product on the computer and it gives a quick intuition to a person whether he/she is an engineer or not. It also can induce the effects of CE and QFD. SO, 0 company is developing a DMU system integrating CAD, visualization and PDM system. The main feature of the developed DMU system is that it is entirely integrated with PDM system, which means that the 3D shape of any part or assembly can be retrieved through PDM system. The DMU system will change the development process, which will increase the competitiveness of a developed product.

The Efficient Management of Digital Virtual Factory Objects Using Classification and Coding System (분류 및 코딩시스템을 이용한 디지털 가상공장 객체의 효율적 관리)

  • Kim, Yu-Seok;Kang, Hyoung-Seok;Noh, Sang-Do
    • Korean Journal of Computational Design and Engineering
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    • v.12 no.5
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    • pp.382-394
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    • 2007
  • Nowadays, manufacturing industries undergo constantly growing pressures for global competitions, and they must shorten time and cost in product development and production to response varied customers' requirements. Digital virtual manufacturing is a technology that can facilitate effective product development and agile production by using digital models representing the physical and logical schema and the behavior of real manufacturing systems including products, processes, manufacturing resources and plants. For successful applications of this technology, a digital virtual factory as a well-designed and integrated environment is essential. In this paper, we developed a new classification and coding system for effective managements of digital virtual factory objects, and implement a supporting application to verify and apply it. Furthermore, a digital virtual factory layout management system based on the classification and coding system has developed using XML, Visual Basic.NET and FactoryCAD. By some case studies for automotive general assembly shops of a Korean automotive company, efficient management of factory objects and reduction of time and cost in digital virtual factory constructions are possible.

A Study on the Design of Back Pressure for Automotive Scroll Compressor

  • Koo, In-Hwe;Lee, Geon-Ho
    • International Journal of Air-Conditioning and Refrigeration
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    • v.17 no.1
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    • pp.1-6
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    • 2009
  • The optimum design of back pressure chamber is one of the most important factors in designing scroll compressors because it has a great influence on the efficiency and other design parameters. The design process can be divided into 2 parts. One is obtaining the optimum pressure of the chamber and keeping it in constant value. The other is finding out the minimum inflow rate of medium with which back pressure chamber is filled. In this study we are focused on the first step. At first we added a simple structure that can change back pressure without reassembling compressor. It makes possible to obtaining optimum back pressure. Then we designed an equipment that the back pressure control valve assembly could be independently tested with. Spring was redesigned to decrease stiffness variation. Also sealing mechanism of back pressure control valve was improved to more effective way. As a result, it was verified that in a real mode test back pressure variation could be retained in 2.3% with discharge pressure and operating frequency varied. In addition the integrated structure of back pressure control valve is expected to contribute to effective manufacturing process.

Design of Back Pressure Control Valve for Automotive Scroll Compressor (차량용 전동식 스크롤 압축기의 배압제어밸브 설계)

  • Nam, Bo-Young;Koo, In-Hwe;Han, Young-Chang;Lee, Geon-Ho
    • Proceedings of the SAREK Conference
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    • 2007.11a
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    • pp.410-415
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    • 2007
  • The optimization of back pressure chamber is one of the most important factors in designing scroll compressors, because it has a great influence on the efficiencies and other design parameters. The design process can be divided into 2 parts. One is obtaining the optimum pressure of the chamber and keeping it in constant value. And the other is finding out the minimum inflow rate of medium with which back pressure chamber is filled. In this study we are focused on the first step. At first we added a simple structure that could change back pressure without reassembling compressor. It makes the optimum back pressure be obtained. And then we devised an equipment that the back pressure control valve assembly could be independently tested with. A spring was redesigned to decrease stiffness variation. And sealing mechanism of back pressure control valve was improved to more effective way. As a result it was verified in a real mode test that back pressure variation could be stabilized within 2.3% when discharge pressure and operating frequency varied. And the integrated structure of back pressure control valve is expected to contribute to an effective manufacturing process.

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Detection of Flip-chip Bonding Error Through Edge Size Extraction of X-ray Image (X선 영상의 에지 추출을 통한 플립칩 솔더범프의 접합 형상 오차 검출)

  • Song, Chun-Sam;Cho, Sung-Man;Kim, Joon-Hyun;Kim, Joo-Hyun;Kim, Min-young;Kim, Jong-Hyeong
    • Journal of Institute of Control, Robotics and Systems
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    • v.15 no.9
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    • pp.916-921
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    • 2009
  • The technology to inspect and measure an inner structure of micro parts has become an important tool in the semi-conductor industrial field with the development of automation and precision manufacturing. Especially, the inspection skill on the inside of highly integrated electronic device becomes a key role in detecting defects of a completely assembled product. X-ray inspection technology has been focused as a main method to inspect the inside structure. However, there has been insufficient research done on the customized inspection technology for the flip-chip assembly due to the interior connecting part of flip chip which connects the die and PCB electrically through balls positioned on the die. In this study, therefore, it is implemented to detect shape error of flip chip bonding without damaging chips using an x-ray inspection system. At this time, it is able to monitor the solder bump shape by introducing an edge-extracting algorithm (exponential approximation function) according to the attenuating characteristic and detect shape error compared with CAD data. Additionally, the bonding error of solder bumps is automatically detectable by acquiring numerical size information at the extracted solder bump edges.