• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.11a
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• pp.444-449
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• 1996

The semiconductor, which is precision product, requires many inspection processes. The surface conditions of the semiconductor chip affect on the functions of the semiconductors. The defects of the chip surface are cracks or voids. As general inspection method requires many inspection procedure, the inspection system which searches immediately and precisely the defects of the semiconductor chip surface is required. We suggest the detection algorithm for inspecting the surface defects of the semiconductor surface. The proposed algorithm first regards the semiconductor surface as random texture and point spread function, and secondly presents the character of texture by linear estimation theorem. This paper assumes that the gray level of each pixel of an image is estimated from a weighted sum of gray levels of its neighbor pixels by linear estimation theorem. The weight coefficients are determined so that the mean square error is minimized. The obtained estimation window(two-dimensional estimation window) characterizes the surface texture of semiconductor and is used to discriminate the defects of semiconductor surface.

• Journal of the Semiconductor & Display Technology
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• v.19 no.3
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• pp.12-18
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• 2020

In semiconductor manufacturing, defect detection is critical to maintain high yield. Currently, computer vision systems used in semiconductor photo lithography still have adopt to digital image processing algorithm, which often occur inspection faults due to sensitivity to external environment. Thus, we intend to handle this problem by means of using Mask R-CNN instead of digital image processing algorithm. Additionally, Mask R-CNN can be trained with image dataset pre-processed by means of the specific designed digital image filter to extract the enhanced feature map of Convolutional Neural Network (CNN). Our approach converged advantage of digital image processing and instance segmentation with deep learning yields more efficient semiconductor photo lithography inspection system than conventional system.

• Journal of Institute of Control, Robotics and Systems
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• v.15 no.2
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• pp.225-230
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• 2009

We propose a template matching method for component inspection of SMD assembly system. To discriminate wrong assembled components, the input image of component is matched with its standard image by template matching algorithm. For a fast inspection system, the calculation time of matching algorithm should be reduced. Since the standard images of all components located in a PCB are stored in computer, it is desirable to reduce the memory size of standard image. We apply the discrete wavelet transformation to reduce the image size as well as the calculation time. Only 7% memory of the BMP image is used to discriminate goodness or badness of components assembly. Comparative results are presented to verify the usefulness of the proposed method.

• Journal of Institute of Convergence Technology
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• v.3 no.2
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• pp.31-37
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• 2013

This paper proposes a vision-based inspection algorithm for a punch which is used when forming the head of the small screws. To maintain good quality of punch, the precise inspection of its dimension and the depth of the punch head is important. A CCD camera and an illumination dome light are used to measure its dimensions. And a structured line laser is also used to measure the depth of the punch head. Resolution and visible area depend on setup between laser and camera which is determined using CAD-based simulation. The proposed method is successfully evaluated using experiment on #2 punch.

• Journal of the Semiconductor & Display Technology
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• v.9 no.2
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• pp.79-85
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• 2010

In this paper, we propose a web inspection system (WIS) for real-time detection of paper defects which can cause critical fractures during papermaking process. Our system incorporates high speed line-scan camera, lighting system, and detection algorithm to provide robust and precise detection of paper defects in real-time. Since edge defects are very crucial to the paper fractures, our system focuses on the edge region of the paper instead of inspecting the whole paper area. In our algorithm, image projection and sub-pixel operation are utilized to detect the edge defects precisely and connected component labeling and shape analysis techniques are adopted to extract various kinds of the region defects. Experimental results revealed that our web inspection system is very efficient for detecting paper defects during papermaking processes.

• Proceedings of the Korean Institute Of Construction Engineering and Management
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• 2008.11a
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• pp.55-60
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• 2008

Inspection of steel columns which is one of the most critical elements in construction requires trained surveyor(s). Also it takes time to handle survey device(s) delicately for accurate measurements. To improve the inspection process of steel columns, the previous studies developed the AR prototype system, ARCam, and showed that ARCam is a promising inspection device that can reduce inspection time. However, ARCam still requires a surveyor to make measurements based on his visual perception and judgment This study proposes an algorithm for automatic inspection based on ARCam. The algorithm is based on image processing and computer vision and focuses on the inspection of steel column plumbness. This method will make measurements without a surveyor's judgment. The ultimate purpose of the automatic inspection is to minimize the surveying labor, thus reducing inspection time and cost.

• Journal of the Korean Society for Precision Engineering
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• v.12 no.10
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• pp.78-88
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• 1995

For producing iron or steel products with good quality, the concentration of the material components should be analyzed quickly with high relability using XRF(Fluorescent X-Ray Spectrometer). Since the analysis results are much dependent upon the surface con- dition, the samples have to be prepared to have good test condition. This study presents an image processing system for inspecting the surface condition of the iron test sample. In order to use thd computer vision system, we need to develop a lighting device and image processing algorithm. For the adequate lighting device of inspection system, the indirect lighting device is contrived to cut the external light and provide uniform, stable and cold light. The image processing algorithm is aimed to reduce inspection time and to get similar analyzing results to those of the experienced operators. At first, the image processing algorithm checks whether the surface of the iron sample is ground well or not. Then, the defects; hole or dig are conted and surface condition is evaluated. In addition, the algorithm gives the reliability of the analyzing results in order to help operator's decision.

• Journal of Auto-vehicle Safety Association
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• v.13 no.1
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• pp.51-56
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• 2021

As hydrogen is classified as an eco-friendly fuel, vehicles using hydrogen fuel are being developed worldwide. Vehicle fuel hydrogen is stored in cylinders at 70 MPa, so there is a high risk of explosion. Therefore, it is important to inspect hydrogen cylinders in used-vehicles. This study was conducted to improve the inspection method of the cylinders currently mounted on used-hydrogen buses. The inspection method is an image analysis method using a camera. Calcaulation algorithm was developed to quantitatively chech the amount of hydrogen leakage by the image method. As a result of adding a contact angle element to the calculation algorithm suggested by the GTR regulation and comparing it with the experimental data of the GTR regulation, the algorithm reliability was 94%, which secured similarity.

• Smart Media Journal
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• v.11 no.9
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• pp.47-55
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• 2022

Quality control in the smart factory manufacturing process is an important factor. Currently, quality inspection of home appliance manufacturing parts produced by the mold process is mostly performed with the naked eye of the operator, resulting in a high error rate of inspection. In order to improve the quality competition, an automatic defect detection system was designed and implemented. The proposed system acquires an image by photographing an object with a high-performance scan camera at a specific location, and reads defective products due to scratches, dents, and foreign substances according to the vision inspection algorithm. In this study, the depth-based branch decision algorithm (DBD) was developed to increase the recognition rate of defects due to scratches, and the accuracy was improved.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.19-20
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• 2008