• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.225-225
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• 2010

In this study, the optimum structure of a magnetic thin film inductor was designed for application of DC-DC converters. The $Ni_{81}Fe_{19}$ (at%) alloy was selected as a high-frequency($\geq$ MHz) magnetic thin film core material and deposited on various substrates (bare Si, $SiO_2$ coated Si) using a high vacuum RF magnetron sputtering system. As-deposited NiFe thin films show similar magnetic properties compared to bulk NiFe alloys, indicating that they have a good film quality. The optimum design of solenoid-type magnetic thin film inductors was performed utilizing a Maxwell computer simulator (Ansoft HFSS V7.0 for PC) and parameters obtained from the magnetic properties of magnetic core materials selected. The high-frequency characteristics of the inductance(L) and quality factor(Q) obtained for the designed inductors through simulation agreed well with those obtained by theoretical calculations, confirming that the simulated result is realistic. The optimum structure of high-performance ($Q{\geq}60$, $L\;=\;1{\mu}H$, efficiency${\geq}90%$), high-frequency (${\geq}5MHz$), and solenoid-type magnetic thin film inductors was designed successfully.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.27 no.1
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• pp.20-26
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• 2016

This paper presents an X-band two-stage power amplifier using GaN-HEMT. Two-stage structure was adopted to take its high gain and simple inter-stage matching network. Based on a 3D EM simulation, the bond-wire inductance and the parasitic capacitance were predicted. By reducing bond-wire inductance, Q of the matching network is decreased and the bandwidth is improved. The implemented two-stage PA shows a power gain of more than 16 dB, saturated output power of more than 42.5 dBm, and a efficiency of more than 35 % in frequency range of 8.1~8.5 GHz with an operating voltage of 40 V.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.22 no.2
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• pp.347-353
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• 2018

In this paper, we studied a design method for a band-pass waveguide filter with a modified H-type resonant iris (RI) placed in a thin transverse wall of a rectangular waveguide. The horizontal straight gap at the center of a conventional H-shaped iris is modified to a U-shaped one to increase the equivalent capacitance, and the equivalent inductance is improved by changing the vertical two straight slots into C-shaped ones. From some simulation results for the frequency response of the proposed RI, it was observed that the proposed iris was advantageous for reducing its size and having better cutoff, compared to typical H-shaped one. Equivalent inductance, capacitance, and quality factor of the proposed RI were extracted to analyze its performance. A third-order band pass filter using the proposed modified H-shaped iris was designed and, it was observed that the filter operated in the frequency range of 9.18-9.84 GHz with its insertion loss of 0.3 dB and return loss of 14 dB.

• Journal of the Korean Magnetics Society
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• v.11 no.6
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• pp.239-244
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• 2001

Recently, RF inductor having researched by many workers, we fabricated and investigated properties of RF inductors. In order to improve the Q-factor (Quality), we try to apply the patterned Fe$_{78.81}$Ta$_{8.47}$N$_{12.71}$ soft magnetic thin film of 5000 which shows magnetic anisotropy of 30 Oe. Thus, patterned magnetic film was artificially increased magnetic anisotropy lead to increasing of ferro-magnetic resonance frequency up to GHz band. Coil as part of inductor was fabricated by lift off process. The dimension of RF inductor was designed 47un, rectangular shape, and measured properties. In the case of Ti/Ag air core type inductor shows Q of 9, inductance of 8.4 nH at 2 GHz. Magnetic film employed inductor shows inductance of 9 nH and FMR resonance frequency was 700 MHz.

• Journal of the Korean Magnetics Society
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• v.6 no.6
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• pp.367-374
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• 1996

The developmement of electronic machine industries requires miniature of size as well as increasement of driving frequency in electronic parts, recently. To realize micro-struture of magnetic devices, in this study, we fabricated thin film inductors by using thin film manufacturing techniques such as photolithography and wet etching process, and these devices are measured at high frequency range of 1 MHz~1 GHz. The results are as follows. The accurate measuring technique by using network analyzer system having microstrip line was established. The manufactured inductors are fabricated with several ten micrometers by means of wet etching process known as easier and more economic than dry etching process. VVhen the device size of two types (spiral, meander) is the same, inductance value L and quality factor Q of spiral type devices are larger than those of meander type, but driving frequency of spiral type is lower than that of meander type due to increasement of inductance L. It is necessary to decrease resistance value R by increasing cross section of the conductor film coil. Thus high frequency measuring method would be a very useful for another measuring fields of the range over several hundreds MHz.

• International Journal of Aeronautical and Space Sciences
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• v.17 no.4
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• pp.501-517
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• 2016

Synchronized switch damping (SSD) is a structural vibration control technique in which a piezoelectric patch attached to or embedded into the structure is connected to or disconnected from the shunt circuit in order to dissipate the vibration energy of the host structure. The switching process is performed by a digital signal processor (DSP) which detects the displacement extrema and generates a command to operate the switch in synchronous with the structure motion. Recently, autonomous SSD techniques have emerged in which the work of DSP is taken up by a low pass filter, thus making the whole system autonomous or self-powered. The control performance of the previous autonomous SSD techniques heavily relied on the electrical quality factor of the shunt circuit which limited their damping performance. Thus in order to reduce the influence of the electrical quality factor on the damping performance, a new autonomous SSD technique is proposed in this paper in which a negative capacitor is used along with the inductor in the shunt circuit. Only a negative capacitor could also be used instead of inductor but it caused saturation of negative capacitor in the absence of an inductor due to high current generated during the switching process. The presence of inductor in the shunt circuit of negative capacitor limits the amount of current supplied by the negative capacitance, thus improving the damping performance. In order to judge the control performance of proposed autonomous SSDNCI, a comparison is made between the autonomous SSDI, autonomous SSDNC and autonomous SSDNCI techniques for the control of an aluminum cantilever beam subjected to both single mode and multimode excitation. A value of negative capacitance slightly greater than the piezoelectric patch capacitance gave the optimum damping results. Experiment results confirmed the effectiveness of the proposed autonomous SSDNCI technique as compared to the previous techniques. Some limitations and drawbacks of the proposed technique are also discussed.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.10
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• pp.17-24
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• 2000

An area efficient and symmetric dual-level spiral inductor structure is proposed and evaluated in comparison with the conventional single-level spiral inductors. Contrary to the dual-level inductor mutual coupling coefficient of the upper-and lower-level inductors of the dual-level inductor increases with the increases in the number of turns. Because of this, for the same silicon area, the inductances of the dual-level incuctors are 2.5-4 times higher than that of the single-level inductor. Furthermore, the dual-level showed better quality factor that the single-level inductors for the same inductance. It is the intention of this paper to demonstrate that the dual-level can be more useful for the RF integrated circuits than the conventional single-level spiral inductors form the aspects of area efficiency and quality factor. The proposed dual-level inductors are designed and confirmed to be perfectly symmetric, and can also be used as a high-frequency choke.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.18 no.5 s.120
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• pp.530-538
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• 2007

An inductor library for efficient low cost RFIC design has been developed based on a standard digital 0.18 ${\mu}m$ CMOS process. The developed library provides four structural variations that are most popular in RFIC design; standard spiral structure, patterned ground shield(PGS) structure to enhance quality factor, stacked structure to enable high inductance values in a given silicon area, multilayer structure to lower series resistance. Electromagnetic simulation, equivalent circuit, and parameter extraction processes have been verified based on measurement results. The extensive measurement and simulation results of the inductor library can be a great asset for low cost RFIC design and development.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.5
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• pp.283-288
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• 2000

In this work, small-size, high-performance simple solenoid-type RF chip inductors utilizing an Al2O3 core material were investigated. Copper (Cu) wire with $40\mum$ diameter was used as the coils and the size of the chip inductor fabricated in this work was $2.1mm\times1.5mm\times1.0mm$. The external current source was applied after bonding Cu coil leads to gold pads electro-plated on each end of backsides of a core material. High frequency characteristics of the inductance (L), quality factor (Q), and impedance (Z) of developed inductors were measured using an RF Impedance/Material Analyzer (HP4291B with HP16193A test fixture). This HP4291B was also used to obtain the equivalent circuit and its circuit parameters of the chip inductors. This HP4291B was also used to obtain the equivalent circuit and its circuit parameters of the chip inductors. The developed inductors have the self-resonant frequency (SRF) of 1.1 to 3.1 GHz and exhibit L of 22 to 150 nH. The L of the inductors decreases with increasing the SRF. The Z of the inductors has the maximum value at the SRF and the inductors have the quality factor of 70 to 97 in the frequency range of 500 MHz to 1.5 GHz.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.2
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• pp.110-113
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• 2008

Embedded capacitor technology is one of the effective packing technologies for further miniaturization and higher performance of electric packaging system. In this paper, the embedded capacitors were simulated and fabricated in 8-layered printed circuit board employing standard PCB processes. The composites of barium titanante($BaTiO_3$) powder and epoxy resin were employed for the dielectric materials in embedded capacitors. Theoretical considerations regarding the embedded capacitors have been paid to understand the frequency dependent impedance behavior. Frequency dependent impedance of simulated and fabricated embedded capacitors was investigated. Fabricated embedded capacitors have lower self resonance frequency values than that of the simulated embedded capacitors due to the increased parasitic inductance values. Frequency dependent capacitances of fabricated embedded capacitors were well matched with those of simulated embedded capacitors from the 100MHz to 10GHz range. Quality factor of 20 was observed and simulated at 2GHz range in the 10 pF embedded capacitors. Temperature dependent capacitance of fabricated embedded capacitors was presented.