• Title/Summary/Keyword: InGaN/GaN light-emitting diode

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Highly transparent Pt ohmic contact to InGaN/GaN blue light-emitting diodes

  • Chul Huh;Kim, Hyun-Soo;Kim, Sang-Woo;Lee, Ji-Myon;Kim, Dong-Joon;Kim, Hyun-Min;Park, Seon-Ju
    • Journal of Korean Vacuum Science & Technology
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    • v.4 no.2
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    • pp.47-49
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    • 2000
  • We report on the fabrication and characterization of InGaN/GaN multiple quantum well light emitting diode (LED) with a highly transparent Pt ohmic contact as a current spreading layer. The value of light transmittance of a Pt thin film with a thickness of 8 m on p-GaN was measured to be 85% at 450nm. The peak wavelength and the full-width at half-maximum (FWHM) of the emission spectrum of the LED at 20 mA were 453 m and 23 m, respectively. Pt-contacted LEDs show good electrical properties and high light-output efficiency compared to Ni/Au-contacted ones. These results suggest that a Pt thin film can be used as an effective current spreading layer with high light-transparency.

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Highly transparent Pt ohmic contact to InGaN / GaN blue light - emitting diodes

  • Huh, Chul;Kim, Hyun-Soo;Kim, Sang-Woo;Lee, Ji-Myon;Kim, Dong-Joon;Kim, Hyun-Min;Park, Seong-Ju
    • Journal of Korean Vacuum Science & Technology
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    • v.4 no.3
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    • pp.78-80
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    • 2000
  • We reprot on the fabrication and characterization of InGaN/GaN multiple quantum well light-emitting diode (LED) with a highly transparent Pt ohmic contact as a current spreading layer. The value of light transmittance of a Pt thin film with a thickness of 8 nm on-GaN was measured to be 85% at 450 nm. The peak wavelength and the full-width at half-maximum (FWHM) of the emission spectrum of the LED at 20 mA were 453 nm and 23 nm, respectively. Pt-contacted LEDs show good electrical properties and high light-output efficiency compared to Ni/Au-contacted ones. These results suggest that a Pt thin film can be used as an effective current spreading layer with high light-transparency.

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Fabrication and Characterization of InGaN/GaN LED structures grown on selectively wet-etched porous GaN template layer

  • Beck, Seol;Cho, Yong-Hoon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.124-124
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    • 2010
  • Much interest has been focused on InGaN-based materials and their quantum structures due to their optoelectronics applications such as light emitting diode (LED) and photovoltaic devices, because of its high thermal conductivity, high optical efficiency, and direct wide band gap, in spite of their high density of threading dislocations. Build-in internal field-induced quantum-confined Stark effect in InGaN/GaN quantum well LED structures results in a spatial separation of electrons and holes, which leads to a reduction of radiative recombination rate. Therefore, many growth techniques have been developed by utilizing lateral over-growth mode or by inserting additional layers such as patterned layer and superlattices for reducing threading dislocations and internal fields. In this work, we investigated various characteristics of InGaN multiple quantum wells (MQWs) LED structures grown on selectively wet-etched porous (SWEP) GaN template layer and compared with those grown on non-porous GaN template layer over c-plane sapphire substrates. From the surface morphology measured by atomic force microscope, high resolution X-ray diffraction analysis, low temperature photoluminescence (PL) and PL excitation measurements, good structural and optical properties were observed on both LED structures. However, InGaN MQWs LED structures grown on SWEP GaN template layer show relatively low In composition, thin well width, and blue shift of PL spectra on MQW emission. These results were explained by rough surface of template layer, reduction of residual compressive stress, and less piezoelectric field on MQWs by utilizing SWEP GaN template layer. Better electrical properties were also observed for InGaN MQWs on SWEP GaN template layer, specially at reverse operating condition for I-V measurements.

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Improved light extraction efficiency of vertical AlGaInP-based LEDs by n-AlGaInP surface roughening (n-표면 거칠기가 형성된 AlGaInP 수직형 적색 발광다이오드의 광추출효율 증가)

  • Seo, Jae-Won;Oh, Hwa-Sub;Song, Hyun-Don;Park, Kyung-Wook;Ryu, Seong-Wook;Park, Yung-Ho;Park, Hae-Sung;Kwak, Joon-Seop
    • Journal of the Korean Vacuum Society
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    • v.17 no.4
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    • pp.353-358
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    • 2008
  • In order to increase extraction efficiency of AlGaInP-based vertical RED LEDs, chemical wet etching technique was produced by using a roughened surface with triangle-like morphology. A commonly used $H_3PO_4$-based solution was applied for chemical wet etching. The light extraction of AlGaInP LED was related to the n-side roughed surface morphology. The morphology of roughed surface is analyzed by the atomic force microscope (AFM). As a result, the roughed surface AlGaInP LED has a root-mean-square (RMS) roughness of 44 nm. The brightness shows 41% increase after roughening n-side surface, as compared to the ordinary flat surface LED.

The Effect of MOCVD Growth Parameters on the Photolumenescence Intensity of InN/GaN Multi-layers (MOCVD 성장조건이 InN/GaN 다층박막의 발광세기에 미치는 영향)

  • Kim, Hyeon-Su;Lee, Jeong-Ju;Jeong, Sun-Yeong;Lee, Jeong-Yong;Lin, J.Y.;Jiang, H.X.
    • Korean Journal of Materials Research
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    • v.12 no.3
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    • pp.190-194
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    • 2002
  • InN/GaN multi-layers were grown by metalorganic chemical vapor deposition(MOCVD) in order to get the appropriate structure for an high power blue-green light emitting diode(LED), and effects of growth conditions (growth temperature, pressure, and $trimethylindium(TMIn)-NH_3-N_2\; flow\; rare)$ on the integrated photoluminescence (PL) intensity and PL peak energy in InN/GaN multi-layers were investigated. The optimized growth conditions with the highest integrated PL intensity for InN/GaN multi-layers were obtained: the growth temperature at $780^{\circ}C$, the growth pressure at 325 Torr, the TMIn flow rate with 150 $m\ell$/min, the $NH_3$flow rate with 3.2 ι/min, and $N_2$ flow rate with 2 ι/min.

A Study of Properties of GaN and LED Grown using In-situ SiN Mask (In-situ SiN 박막을 이용하여 성장한 GaN 박막 및 LED 소자 특성 연구)

  • Kim, Deok-Kyu;Yoo, In-Sung;Park, Choon-Bae
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.18 no.10
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    • pp.945-949
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    • 2005
  • We have grown GaN layers with in-situ SiN mask by metal organic chemical vapor deposition (MOCVD) and study the physical properties of the GaN layer. We have also fabricate PN junction light emitting diode (LED) to investigate the effect of the SiN mask on its optical property By inserting a SiN mask, (102) the full width at half maximum (FWHM) decreased from 480 arcsec to 409 arcsec and threading dislocation (TD) density decreased from $3.21{\times}10^9\;cm^{-2}$ to $9.7{\times}10^8\;cm^{-2}$. The output power of the LED with a SiN mask increased from 198 mcd to 392 mcd at 20 mA. We have thus shown that the SiN mask improved significantly the physical and optical properties of the GaN layer.

Enhanced cathode luminescence in $In_xGa_{1-x}N/In_yGa_{1-y}N$ green light emitting diode structure using two-dimensional photonic crystal (2차원 광자 결정을 이용한 $In_xGa_{1-x}N/In_yGa_{1-y}N$ 녹색 발광 다이오드의 음극선 발광 효율 증대)

  • Choi, E.S.;Nguyen, H.P.T.;Doan, H.M.;Kim, S.;Lim, H.;Lee, J.J.
    • Proceedings of the KIEE Conference
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    • 2007.11a
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    • pp.132-133
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    • 2007
  • $In_xGa_{1-x}N/In_yGa_{1-y}N$ 다중 양자우물 녹색 발광 다이오드에 2차원 광자 결정을 이용하여 음극선 발광의 향상을 관찰 하였다. 정사각형 배열의 2차원 광자 결정의 주기와 격자 상수는 200/500 nm 이고 전자빔 리소그래피로 광자결정 패턴을 제작한 후, 플라즈마 건식 식각법으로 패턴을 구현하였다. 식각 시간의 차이를 둔 구현된 패턴의 홀 깊이는, 각각 ${\sim}69nm,\;{\sim}99nm,\;{\sim}173nm$ 이었다. 전계 방사 주사 현미경 측정 결과, 형성된 홀은 끝이 잘린 역전된 원뿔 모양으로 식각 되었다. 식각 된 홀의 깊이에 따라 광자 결정이 있는 부분이 없는 부분보다 최대 ${\sim}30$배 많은 광자가 검출 됨을 확인하였다.

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Properties of Defective Regions Observed by Photoluminescence Imaging for GaN-Based Light-Emitting Diode Epi-Wafers

  • Kim, Jongseok;Kim, HyungTae;Kim, Seungtaek;Jeong, Hoon;Cho, In-Sung;Noh, Min Soo;Jung, Hyundon;Jin, Kyung Chan
    • Journal of the Optical Society of Korea
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    • v.19 no.6
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    • pp.687-694
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    • 2015
  • A photoluminescence (PL) imaging method using a vision camera was employed to inspect InGaN/GaN quantum-well light-emitting diode (LED) epi-wafers. The PL image revealed dark spot defective regions (DSDRs) as well as a spatial map of integrated PL intensity of the epi-wafer. The Shockley-Read-Hall (SRH) nonradiative recombination coefficient increased with the size of the DSDRs. The high nonradiative recombination rates of the DSDRs resulted in degradation of the optical properties of the LED chips fabricated at the defective regions. Abnormal current-voltage characteristics with large forward leakages were also observed for LED chips with DSDRs, which could be due to parallel resistances bypassing the junction and/or tunneling through defects in the active region. It was found that the SRH nonradiative recombination process was dominant in the voltage range where the forward leakage by tunneling was observed. The results indicated that the DSDRs observed by PL imaging of LED epi-wafers were high density SRH nonradiative recombination centers which could affect the optical and electrical properties of the LED chips, and PL imaging can be an inspection method for evaluation of the epi-wafers and estimation of properties of the LED chips before fabrication.

Numerical Modeling for GaN Deposition by MOCVD: Effects of the Gas Inlet

  • Yang, Wonkyun;Joo, Junghoon
    • Applied Science and Convergence Technology
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    • v.23 no.3
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    • pp.139-144
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    • 2014
  • GaN deposition equipment and processes for the fabrication of white LEDs (Light Emitting Diode) using MOCVD (Metal Organic Chemical Vapor Deposition) were numerically modeled to analyze the effects of a reactive gas introduction strategy. The source gases, TMGa and $NH_3$, were injected from a shower head at the top of the chamber; the carrier gases, $H_2$ or $N_2$, were introduced using two types of injection structures: vertical and horizontal. Wafers sat on the holder at a radial distance between 100 mm and 150 mm. The non-uniformity of the deposition rates for vertical and horizontal injection were 4.3% and 3.1%, respectively. In the case of using $H_2$ as a carrier gas instead of $N_2$, the uniform deposition zone was increased by 20%.

Study on Leaching Behavior for Recovery of Ga Metal from LED Scraps (LED 공정스크랩으로부터 Ga 회수를 위한 침출 거동 연구)

  • Park, Kyung-Soo;Swain, Basudev;Kang, Lee Seung;Lee, Chan Gi;Uhm, Sunghyun;Hong, Hyun Seon;Shim, Jong-Gil;Park, Jeung-Jin
    • Applied Chemistry for Engineering
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    • v.25 no.4
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    • pp.414-417
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    • 2014
  • LED scraps consisting of highly crystalline GaN and their leaching behavior are comprehensively investigated for hydro-metallurgical recovery of rare metals. Highly stable GaN renders the leaching of the LED scraps extremely difficult in ordinary acidic and basic media. More favorable state can be obtained by way of high temperature solid-gas reaction of GaN-$Na_2CO_3$ powder mixture, ball-milled thoroughly at room temperature and subsequently oxidized under ambient air environment at $1000-1200^{\circ}C$ in a horizontal tube furnace, where GaN was effectively oxidized into gallium oxides. Stoichiometry analysis reveals that GaN is completely transformed into gallium oxides with Ga contents of ~73 wt%. Accordingly, the oxidized powder can be suitably leached to ~96% efficiency in a boiling 4 M HCl solution, experimentally confirming the feasibility of Ga recycling system development.