• 한국기계가공학회지
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• 제7권4호
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• pp.142-148
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• 2008

This study aims to find the optimal cutting conditions, which are obtained by grinding condition, and the grinding characteristics and condition of constant velocity joint were investigated with respect to wheel velocity, depth of cut, feed speed. Grinding machine has been widely used in manufacturing optical reflects of metal. Such as steel are easy to be machined because of their proper material. As a result I obtained the data of grinding conditions makes good surface roughness and the optimal condition of grinding and get the mesh condition. The purpose of this study is to find the optimum grinding wheel characteristics for cutting constant velocity joint.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2002년도 춘계학술대회 논문집
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• pp.660-665
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• 2002

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of grinding wheel in the in-feed machining method. In this study, grinding experiments by the rotary surface grinding machine with straight type wheels ware conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding n/c equipment with an ELID wit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2 - 6 nm in Ra.

• Journal of Biosystems Engineering
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• 제22권4호
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• pp.439-450
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• 1997

Most of Korean feed mill has a pregrind system which was suitable for the processing of less number of ingredients and finished products, and good for the mash type feed product. But industries has been changed in production volume and cost, and also from mash to further processed products such as pelleted and extruded. Therefore, Korea feed industries now should change the process, especially the grinding system from the current pregrind to other grind system, but this change will cost a lot of investment and also loosing current grinding system, and should have production shut down during the construction period. To solve these problems, combined grinding system based on a new model mill has been developed. The combined grind system is combination of pregrind and postgrind system, which has the advantages of those two grind systems, and also which can allow to utilize existing pregrind system continuously without any production interruption due to new postgrind system construction. This newly developed model has been applied to the feed mill expansion project of `B`feed company in 1994, and it was very successful application and showed excellent results as we intended. The new model mill, combined grind system applied can save fixed asset investment because old pregrind system can be used as is, and also can reduce production cost and improve product quality. And the possibility of critical production shut down can be much lowered. Within this new grinding model development, multi-screen combination system has been developed for the better grinding texture quality and safer operation. This new model mill with combined grind system will be applied by most feed manufacturing plant and may enhance their production competitiveness, and the further study and development should be continued.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.20-23
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• 2002

In silicon wafer manufacturing process, the grinding process has been adopted to improve the quality of wafer such as flatness, roughness and so on. This paper describes the effect of grinding process on the surface quality of wafer. The experiments are carried out by high precision in fred grinder with air bearing spindle. The relationship between the inclination of chuck table and the flatness of wafer is investigated, and the effect of grinding conditions including wheel speed, table speed, and feed rate on damage depth and roughness of wafer is also investigated. The experimental results show that there is close relationship between the inclination of the chuck table and the flatness of wafer, and the grinding conditions within this paper little affect the flatness of wafer and relatively high affect the damage depth of wafer.

• 대한산업공학회지
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• 제26권4호
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• pp.376-383
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• 2000

A flexible disk grinding process model has been implemented with varying disk orientation with respect to workpiece surface along with variable feed rate. Before implementing arbitrary disk orientation and translation, disk angle and feed rate variation have been implemented. The disk angle was changed with constant angular velocity only in the entrance stage. The effect of the variable feed rate was added to the geometric schematic. The feed rate was changed either from the entrance stage or from the between edges stage and process performance was evaluated. Effect of changing both angle end feed rate has been also analyzed. Disk trend showing actual disk deflection has also been visualized.

• 한국생산제조학회지
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• 제23권1호
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• pp.69-74
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• 2014

An OrthoMTA compacter is made by machining a Ni-Ti alloy wire using tapered helix creep-feed grinding machines. This aim of this study is to find the optimal dressing conditions to sharpen the corner of a cubic boron nitride (CBN) wheel. On the basis of the results of various experiments, it is verified that the most important factors in dressing are the dressing depth and feeding method, whereas the feed rate has less importance for producing a smaller corner R value. The study also finds the optimum dressing depth to reduce the dressing time, a feeding speed and method to stabilize the machining, and the mesh grade for the CBN wheel to make the groove of the compacter deeper.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.1082-1086
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• 2004

In silicon wafer manufacturing process, the grinding process has been adopted to improve the flatness of wafer. The grinding of wafer is usually used by the infeed grinding machine. The infeed grinding machine has been depended on imports. Therefore, it is necessary to develop the infeed grinding machine because the demand of the infeed grinding machine is increasing more and more. This paper describes the technologies of infeed grinding machine and intend to introduce the studies in the development of the intelligent grinding system for grinding of wafer. The air bearing spindle for the infeed grinding machine was developed by domestic technologies and the grinding part design of the intelligent grinding system for wafer grinding was completed.

• 산업식품공학
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• 제13권4호
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• pp.269-274
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• 2009

습식분쇄의 최적조건을 얻고자 부형제 종류, 농도, 습식 분쇄시 rotor speed, bead size, feed rate, 분쇄회수를 달리하여 분쇄한 결과, 부형제로는 gum arabic을 사용하여 5%의 농도로 첨가할 때 가장 좋은 분쇄효과를 나타내었다. Rotor speed를 달리하여 습식분쇄한 결과, rotor speed가 증가할수록 좋은 결과를 나타내어 4,000 rpm에서 가장 우수한 것으로 나타났다. 원료와 직접 부딪혀 분쇄를 하게 되는 bead는 0.4 mm의 크기를 사용하였을 때 가장 작은 사이즈로 분쇄되는 것으로 나타났다. 분쇄가 이루어지는 chamber내에 원료를 공급하는 비율에 따른 결과에서는 40 L/h 의 속도로 공급했을 때 가장 작은 입도분포를 보였다. 분쇄회수에 따른 영향은 횟수에 따라서는 8회 이상으로 분쇄하였을때 0.6 $\mu$m이하의 입도분포가 90% 이상으로 나타나 10회를 분쇄하였을때 가장 좋은 효과를 나타내었다. 연속운전과 비연속운전의 비교에서는 연속운전이 더 효율적이었으며 부형제 종류에 따른 영향은 gum arabic을 첨가하여 분쇄하였을때 가장 우수한 결과를 나타내었다. 따라서 적절한 농도와 종류의 부형제 사용과 rotor speed, bead size, feed rate, 용매와의 혼합비의 최적공정을 수립한 습식 분쇄기술로 초미세액상칼슘의 제조가 가능하였고, 습식분쇄기술을 식품가공기술로 활용할 수 있는 가능성을 확보하였다.

• 한국기계가공학회지
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• 제9권4호
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• pp.8-13
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• 2010

The constant velocity internal grinding is a popular process for studying axle machine design and process in automobile industry. In this study, The program which gives the data of wheel size and truing diameter of ball groove is developed. As a result I obtained the data of grinding conditions makes good surface roughness get a grinding conditions. The grinding characteristics and conditions of constant velocity joint were investigated with respect to grinding feed, cutting depth, grinding time. At machine failure, the results were suddenly increased and the detailed surfaces were extremely obtained. Grinding condition was big more affected by grinding depth, grinding speed and grinding time.

• 한국기계가공학회지
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• 제10권6호
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• pp.46-49
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• 2011

The grinding is a popular process for studying constant velocity joint and process in automobile industry. In this study, The study gives the data of wheel type and grinding of inner race is developed. As a result I obtained the data of grinding conditions makes good surface roughness get a grinding conditions. The grinding characteristics and conditions of inner race were investigated with respect to grinding feed, cutting depth, grinding time. The results were suddenly increased and the detailed surfaces were extremely obtained. Grinding condition was big more affected by grinding time, grinding speed and grinding depth.