• Proceedings of the Materials Research Society of Korea Conference
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• 2007.05a
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• pp.38.1-38.1
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• 2007

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1939-1943
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• 2008

Deformation of a mold is measured and analyzed in alignment and curing processes of UV-Imprint Lithography. We are focused on mold deformation caused by a UV resin, which is laminated between a mold and a target glass-panel. The UV resin is viscous in case of liquid state, and the resin will be solidified when being exposed by the ultra-violet light. The viscosity of the resin causes shear force on the mold during the alignment process. Moreover, the shrinkage during phase change from liquid to solid may cause residual stress on the mold. The experiments for measuring temperature and strain are made during alignment and curing process. Strain-gages and thermocouples are used for measuring the strain and variation of temperature on several points of the mold, respectively. The deformation of mold is also simulated and analyzed. The simulation results are compared with the experiments. Finally, sources of alignment errors in large area UV-nanoimprint lithography are discussed.

• Journal of the Korean Vacuum Society
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• v.19 no.2
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• pp.96-104
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• 2010

We suggest here a cost-effective replica fabrication method for transparent and hard molds for imprinting lithography such as NIL and S-FIL. The process starts with the use of a replica hard mold from a master, using a polymer copy as a carrier. The polymer copy as a carrier was treated by soluble process for forming anti-adhesion layer. Duplicated hard molds can eliminate direct contact between a hard master and a patterned polymer on a substrate and the generated contamination of a master during the imprinting process. The replica hard mold exhibits the glass-like properties introduced here, such as transparency and hardness, make it appropriate for nanoimprint lithography and step-and-flash imprint lithography.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.337-342
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• 2007

In this study, molecular dynamics simulation of nano imprint lithography in which patterned stamp is pressed onto amorphous polyethylene(PE) surface are performed to study the behaviour of polymer. Force fields including bond, angle, torsion, and Lennard Jones potential are used to describe the inter-molecular and intra-molecular force of PE molecules and stamp, substrate. Periodic boundary condition is used in horizontal direction and canonical NVT ensemble is used to control the system temperature. As the simulation results, the behaviour of polymer is investigated during the imprinting process. The mechanism of polymer deformation is studied by means of inspecting the surface shape, volume, density, atom distribution. Deformation of the polymer resist was found for various of the stamp geometry and the alignment state of the polymer molecules.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.1-5
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• 2015

Recently, data throughput of smart electric devices increases dramatically. There is a great interest in a new technology which exceeds the limit of electrical transmission method. Optical PCB can supplement the weakness of electrical signal processing, the research for optical PCB is very active. In this paper, we propose the thermal imprint lithography process to fabrication optical layer of optical PCB and experiment to optimize the process conditions. We confirm process time, pressure, process temperature, demolding temperature and fabricate optical interconnection structure which has $45^{\circ}$ tilted mirror surface for confirm the interconnection efficiency.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1539-1543
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• 2006

We have developed self-aligned imprint lithography (SAIL) technology, an innovative method for roll-to-roll (R2R) fabrication of electronic devices on flexible plastic substrates. In this paper, we present the first R2R-produced ${\alpha}$-Si TFTs built on a polyimide substrate using the SAIL process, and prove the feasibility of this technology to enable R2R fabrication of flexible display active matrix (AM) backplanes with high precision and throughput.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1065-1068
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• 2003

The nano imprint process is one of the next generation lithography has been mentioned as one of major nanoreplication techniques because it is simple process, low cost, high replication fidelity and relatively high throughput. This process requires a surface contact between a template with patterns and a wafer on a stage. After contact, the vertical moving the template to the wafer causes some directional motions of the stage. Thus the stage must move according to the motions of the template to avoid the damage of the transferred patterns on the wafer. This study is to develop the wafer stage with a passive compliance to overcome the damage. This stage is designed with the concept like that it has a monolithic, symmetry and planar 6-DOF mechanism.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.11
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• pp.100-106
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• 2008

We have studied the characteristic changes of optical device using imprint lithography. An imprinted structure is inherently involved in residual stress due to the temperature and the pressure cycle during fabrication process. A structure with residual stress undergoes stress relaxation, which leads io dimensional change. Therefore, annealing processes was performed to reduce the residual stress of imprinted polymer channel. Reduction of residual stress was confirmed through dimensional change, birefringence, and the mechanical properties. We have fabricated an optical device, and it saw the optical intensity changes within 0.1% for 1 month.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.196-198
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• 2003

Classical lithography in semiconductor employs stepper technologies. Limits of this technology are clearly seen at structures below 100nm. Nano-imprinting lithography is a new method for generating patterns in submicron range at reasonable cost. In order to manufacture nano-imprinting lithography(NIL) equipment, several NIL manufacturers have been developing key technologies for realization of nano-imprinting process, recently. In this paper, we've been describe state-of-the-art and technology trends for nano-imprinting lithography equipments.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.330-333
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• 2005

The fabrication of mold fur nano imprint lithography (NIL) is experimentally reported using the scanning probe lithography (SPL) technique, instead of the conventional I-beam lithography technique. The nanometer scale patterning structure is fabricated by the localized generation of oxide patterning on the silicon (100) wafer surface with a thin oxide layer, The fabrication method is based on the contact mode of scanning probe microscope (SPM) in air, The precision cleaning process is also performed to reach the low roughness value of $R_{rms}=0.084 nm$, which is important to increase the reproducibility of patterning. The height and width of the oxide dot are generated to be 15.667 nm and 209.5 nm, respectively, by applying 17 V during 350 ms.