• Nuclear Engineering and Technology
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• 제43권6호
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• pp.557-566
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• 2011

A cold spray coating (CSC) of copper was studied for its application to a high-level radioactive waste (HLW) disposal canister. Several copper coatings of 10 mm thick were fabricated using two kinds of copper powders with different oxygen contents, and SS 304 and nodular cast iron were used as their base metal substrates. The fabricated CSC coppers showed a high tensile strength but were brittle in comparison with conventional non-coating copper, hereinafter defined to as "commercial copper". The corrosion behavior of CSC coppers was evaluated by comparison with commercial coppers, such as extruded and forged coppers. The polarization test results showed that the corrosion potential of the CSC coppers was closely related to its purity; low-purity (i.e., high oxygen content) copper exhibited a lower corrosion potential, and high-purity copper exhibited a relatively high corrosion potential. The corrosion rate converted from the measured corrosion current was not, however, dependent on its purity: CSC copper showed a little higher rate than that of commercial copper. Immersion tests in aqueous HCl solution showed that CSC coppers were more susceptible to corrosion, i.e., they had a higher corrosion rate. However, the difference was not significant between commercial copper and high-purity CSC copper. The decrease of corrosion was observed in a humid air test presumably due to the formation of a protective passive film. In conclusion, the results of this study indicate that CSC application of copper could be a useful option for fabricating a copper HLW disposal canister.

• 천문학회보
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• 제36권2호
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• pp.153.2-153.2
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• 2011

The IGRINS (Immersion GRating INfrared Spectrometer) is a high resolution wide-band infrared spectrograph developed by Korea Astronomy and Space Science Institute (KASI) and the University of Texas at Austin (UT). Immersion grating is a key component of IGRINS, which disperses the input ray by using a Silicon material with a lithography technology. Opto-mechanical mount for the immersion grating is important to keep the high spectral resolution and the optical alignment in a cold temperature of $130{\pm}0.06K$. The optical performance of immersion grating can maintain within the de-center tolerance of ${\pm}0.05mm$ and the tip-tilt tolerance of ${\pm}1.5arcmin$. The mount mechanism utilizes the flexure and the kinematic support design to satisfy the requirement and the operation condition. When the IGRINS system is cooled down to a cold temperature, three flexures compensate the thermal contraction stress due to the different material between the immersion grating and the mounting part(Aluminum 6061). They also support the immersion grating by an appropriate preload. Thermal stability is controlled by a copper strap with proper dimensions and a heater. Generally structural and thermal analysis was performed to confirm the mount mechanism. This talk presents the opto-mechanical mount design of the immersion grating of IGRINS.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2017년도 춘계학술대회 논문집
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• pp.97-97
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• 2017

This study investigated the corrosion protection by electrodeposited copper layer on AZ31 Mg alloy with and without additional silver layer by immersion test, salt spray test, OCP transient and potentiodynamic polarization experiment. The single electrodeposited Cu layer on AZ31 Mg alloy showed a nodular structure with many imperfections of crevices between the nodules, which resulted in the fast initiation of pitting corrosion within first few hours of immersion. Double-layer coating of Cu and outer Ag layer slightly increased the initiation time for pitting corrosion. Triple-layer coatings of Cu/Ag/Cu exhibited the most efficient corrosion protection of AZ31 Mg alloy, compared to the single- and double-layer coatings. Surface morphology of the outer Cu layer in the triple-layer was changed from the nodular structure to fine particle structure with no crevices due to the presence of an additional Ag layer. Thus, the improved corrosion resistance of AZ31 Mg alloy by electrodeposited Cu/Ag or Cu/Ag/Cu layers is readily ascribed to the decreased number of imperfections in the electrodeposited layers due to the additional silver layer. It is concluded that the additional silver layer provides many nucleation sites for the second Cu plating, resulting in the formation of finer and denser structure than the first Cu electrodeposit.

• Environmental Engineering Research
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• 제23권2호
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• pp.164-174
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• 2018

Corrosion of copper alloys (copper, bronze and brass) in soil was evaluated at ambient temperature using various methods such as electrochemical impedance spectroscopy (EIS), polarization curves and Scanning Electron Microscopy (SEM) coupled with Energy Dispersive Spectroscopy microanalysis measurements. Three equivalent circuits were separately used to interpret the obtained impedance spectra. The EIS measurements indicated that the polarization resistance of all electrodes increases with increasing the immersion time. SEM showed a presence of three layers of corrosion products with various composition and morphology covering each electrode. In addition, it was found that at 20% of moisture content the $R_p$ values and the current density of all electrodes in the studied soil give the following order: copper > bronze > brass. Good consistency between the data obtained from EIS and PP measurements was observed.

• Corrosion Science and Technology
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• 제10권4호
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• pp.125-130
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• 2011

This study was performed to improve the corrosion resistance and the stability of passive film on copper tube by potentiostatic polarization method in synthetic tap water. Formation of passive film was carried out by anodic potentiostatic polarization at various passivation potentials and passivation times in 0.1 M NaOH solution. Stability of passive film and corrosion resistance was evaluated by self-activation time, ${\tau}_0$ from passive state to active state on open-circuit state in 0.1 M NaOH solution. Addition of polyphosphate in NaOH solution prolonged the self-activation time and improved the corrosion resistance, and the addition of 5 ppm polyphosphate was most effective. It was also observed that better corrosion resistance was obtained by potentiostatic polarization at 1.0 V (vs. SCE) than at any other passivation potentials. Passivated copper tube showed perfect corrosion resistance for the immersion test in synthetic tap water showing that the anodic potentiostatic polarization treatment in 0.1 M NaOH with 5 ppm polyphosphate solution would be effective in improving the corrosion resistance and preventing the blue water problem.

• 한국표면공학회지
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• 제50권3호
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• pp.170-176
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• 2017

EPIG (Electroless Pd/immersion Au) process was studied to replace ENIG (electroless Ni/immersion Au) and ENEPIG (electroless Ni/electroless Pd/immersion Au) processes for bump surface treatment used in high reliable flip chip packages. The palladium and gold layers formed by EPIG process were uniform with thickness of 125 nm and 34.5 nm, respectively. EPAG (Electroless Pd/autocatalytic Au) also produced even layers of palladium and gold with the thickness of 115 nm and 100 nm. TEM results exhibited that the gold layer in EPIG surface had crystalline structure while the palladium layer was amorphous one. After annealing at 250 nm, XPS analysis indicated that the palladium layer with thickness more than 22~33 nm could act as a diffusion barrier of copper interconnects. As a result of comparing the chip shear strength obtained from ENIG and EPIG surfaces, it was confirmed that the bonding strength was similar each other as 12.337 kg and 12.330 kg, respectively.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2017년도 춘계학술대회 논문집
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• pp.120.2-120.2
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• 2017

본 연구에서는 고신뢰성 인쇄회로기판이나 플립칩 패키지에 적용되는 범프 표면처리에서 널리 사용되는, ENIG나 ENEPIG 대체를 위한 electroless Pd/immersion Au(EPIG)에 대하여 연구하였다. Transmission electron microscopy(TEM) 분석 결과 형성된 Au layer는 crystalline, Pd layer는 amorphous 임을 확인하였으며, 열처리 후 X-Ray photoelectron spectroscopy(XPS)를 통하여 EPIG층이 하부 copper의 확산방지막으로서 효과가 있음을 알 수 있었다. 또한, 비정질 Pd layer가 확산을 방지하기 위하여는 일정수준 이상의 두께가 필요하며, 그 두께는 35~65nm 수준임을 알 수 있었다.

• Tribology and Lubricants
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• 제39권6호
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• pp.256-261
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• 2023

This study is conducted to evaluate the durability of superhydrophobic surfaces, with a focus on two aspects: contact angle measurement and self-cleaning-performance analysis. Superhydrophobic copper and aluminum surfaces are fabricated using the immersion method and subjected to a rolling wear test, in which a 2 kg weight is placed on a rolling tester, under loaded conditions. To evaluate their durability, the contact angles of the specimens are measured for each cycle. In addition, the surface deformation of the specimens before and after the test is analyzed through SEM imaging and EDS mapping. The degradation of the self-cleaning performance is evaluated before and after the wear test. The results show that superhydrophobic aluminum is approximately 4.5 times more durable than superhydrophobic copper; the copper and aluminum specimens could endure 21,000 and 4,300 cycles of wear, respectively. The results of the self-cleaning test demonstrate that superhydrophobic aluminum is superior to superhydrophobic copper. After the wear test, the self-cleaning rates of the copper and aluminum specimens decrease to 72.7% and 83.4%, respectively. The relatively minor decrease in the self-cleaning rate of the aluminum specimen, despite the large number of wear cycles, confirms that the superhydrophobic aluminum specimen is more durable than its copper counterpart. This study is expected to aid in evaluating the durability of superhydrophobic surfaces in the future owing to the advantage of performing wear tests on superhydrophobic surfaces without damaging the surface coating.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2014년도 추계학술대회 논문집
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• pp.130-131
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• 2014

자동용접용 솔리드와이어를 위한 치환동도금층 밀착력 향상을 위해 착화제로 Alanine을 사용하였다. 테이프 시험결과 Alanine 첨가에 따라 밀착력이 현저히 증가하였다. 또한 도금층내에 혼입되는 H와 Fe 분석결과 Alanine을 첨가하지 않았을 때 도금층 전체 영역에서 H와 Fe의 검출강도가 높게 나타났으나, Alanine 10g/l추가시 도금층내에서 미량 검출되었다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2001년도 추계학술발표회 초록집
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• pp.3-3
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• 2001

Two companies plating baths were selected for plating on phenol and epoxy resin boards as well as on flexible p polyimide boards. After plating, deposited i&IIk&.ness al1d physical properties, as well as solder wettabilities by aging with $150^{\circ}C$ heating and 100% humidity were compared. After plating and aged with two different tin baths, deposited thickness and physical properties were not so great differences, but solder wettabilities were superior used polymer catalyst than the other. Furthermore depend upon the compactness and fineness of metallic sturctures of the base copper, the amounts of the plated copper were big differel1lces. These differences seems to be inherited from the kind and amount of additives. as well as current densities, which are influences upon structures of Copper layers. Generally the tin thickness are hetween 0.5 to $1.0\mu\textrm{m}$ and thicker the solder wettabilities are the better, and also me compact structures of deposits showed gooo soidierabiiities. In this study, with our own deveiotaedl plating equipment could get more than $0.5\mu\textrm{m}$ of till thickness and piating speed was $0.1\mu\textrm{m}$ per minutes.