• ETRI Journal
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• v.38 no.1
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• pp.1-8
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• 2016

A large incoherent crosstalk (IC) caused by amplified spontaneous emission (ASE) noise power from Tx-disabled optical network units and a differential path loss has been shown to degrade upstream transmission performance in time-division multiplexing passive optical networks. This paper considers the IC-induced power penalty of an upstream signal both in an XG-PON and in a TWDM-PON. We investigate the degradation of the extinction ratio and relative intensity noise through a simulation and experiments. For the XG-PON case, we observe a 9.6 dB difference in the level of ASE noise power from Tx-disabled ONUs (hereafter known simply as ASE noise) between our result and the ITU-T XG-PON PMD recommendation. We propose an optical filtering method to mitigate an IC-induced power penalty. In the TWDM-PON case, the IC-induced power penalty is naturally negligible because the ASE noise is filtered by a wavelength multiplexer at the optical line terminal. The results provide design guidelines for the level of ASE noise in both XG-PONs and TWDM-PONs.

• Journal of Welding and Joining
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• v.7 no.1
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• pp.42-50
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• 1989

The application of fracture mechanics is being increased gradually to assess the safety of welded structures containing crack. Fatigue crack propagation behavior and elastic-plastic fracture toughness J$_{IC}$ of home made flux cored wire(1.22mm) CO$_{2}$ weldments was discussed. Especially fatigue crack propagation test was carried out by .DELTA.K control instead of load control and elastic-plastic fracture toughness J$_{IC}$ was obtained by ASTM-R curve method on C.T.specimen in transverse direction of weldments. The results obtained are as follows; (1) Weld metal presented an almost complete similarity to base metal on fatigue crack propagation rate in transverse direction. (2) Weld metal was more than base metal on J$_{IC}$ value in transverse direction. (3) F.C.W. CO$_{2}$ weldments had an excellent characteristic of fatigue crack propagation rate and J$_{IC}$ in less than 50kg/mm$^{2}$ steel grade, this would result from that weld metal had good static strength.trength.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.11 no.12
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• pp.2199-2204
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• 2007

The objective of this study is to get an implication through the application of Technology Acceptance Model (TAM) focused on Mobile Banking Service based on IC Chip. Thus firstly, this study reviewed the related literatures and materials. After this, this parer analyzed this TAM model with covariance structural method to search the factors influencing technology acceptance of Mobile banking service. In conclusion, the proposed model showed that 'innovation factor' influenced 'perceived usefulness' and 'user's acquaintance' influenced 'perceived ease of use'. And this 'perceived usefulness' influenced 'perceived ease of use' and this 'perceived ease of use' influence 'attitude toward use'.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.4
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• pp.269-274
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• 2004

Current delivery system, in which the analog current produced by a unique DAC circuit is stored into a current-memory circuit and delivered in a time-divided sequence, shows variation of output current as low as 4% in a current source data-driver IC for AM-OLED driven by a current-programmed method without any fuse repairing after fabrication. This driver IC has 54 outputs and can sink constant current as low as 3 ${\mu}A$ with 6-bit analog levels. Such a low current level without variation can hardly be obtained by an ordinary MOS transistor because the current level is in the sub-threshold region and changes exponentially with threshold voltage variation. Thus we adopted a current mirror circuit composed of bipolar transistors to supply well-controlled current within a nano-ampere range.

• Journal of the Korean Applied Science and Technology
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• v.27 no.1
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• pp.14-19
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• 2010

In this study, the anti-oxidative effects and components of sprout serum were investigated. In the buds, high levels of zinc, iron and manganese were analyzed in addition to copper, magnesium, and potassium. The free radical (1,1-diphenyl-2-picrylhydrazyl, DPPH) scavenging activity of sprout serum was evaluated with $IC_{50}$. $IC_{50}$ of sprout serum was $58.0\;mgmL^{-1}$, and that of vitamin C was $3.7\;mgmL^{-1}$. In the test of superoxide scavenging activity of sprout serum, the activity was dependent on the concentration of serum. In this case, the $IC_{50}$ was 2.0 wt%. Cell viability was detected by using the MTT method. Cultured human fibroblast was treated with 15 mM $H_2O_2$ and cell viability was 70% in case of control. However, the effect of treating 0.5% of sprout serum was similar to that of 0.0001% of vitamin C.

• Journal of Applied Reliability
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• v.16 no.4
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• pp.347-355
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• 2016

Purpose: With the advance of miniaturization of electronic products, stacked packages of high density semiconductors are commonly used. Potential failure modes and mechanisms of stacked packages are identified. Methods: Failure modes and mechanisms of thin chip stacked packages are determined through the categorization and failure analysis: delamination, non-wet, crack, ESD, EMI and the process related damages. Results: Those failure modes are not easy to find and require excessive amount time and effort for analysis and subsequent improvement. Conclusion: In this study, a method of estimating the failure rate based on the strength measurement is suggested.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1289-1294
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• 2008

Electrostatic discharge(ESD) phenomenon is a serious reliability concern. It causes approximately most of all field failures of IC. To quality the ESD immunity of IC product, there are some test methods and standards developed. ESD events have been classified into 3 models, which are HBM, MM and CDM. All the test methods are designed to evaluate the ESD immunity of IC products. This study provides an overview among ESD test methods on ICs and an efficient ESD stress method. We have estimated on all pin combination about the positive and negative ESD stress. We make out the weakest stress mode. This mode called a worst-case mode. We proposed that positive supply voltage pin and I/O pin combination is efficient because it is a worst-case mode.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.9
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• pp.1627-1631
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• 1992

It often occurs in J-R testing that some initial crack extension (.DELTA.a) data points have anomalous negative values. The reason for the apparent negative crack growth is due to the analysis method. The phenomenon as a possible source of error in determining $J_{IC}$ or J-R curve from partial unloading compliance experiments may be eliminated by the compliance correction equation or the offset technique. In this study, the correction methods are suggested and examined by the measurement of the actual crack length and $J_{JC}$ analysis.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.28 no.11
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• pp.916-919
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• 2017

This paper examines electromagnetic leakage path of small shield cans employed in mobile devices such as smart-phones by using numerical simulation and analyzes near-field coupling due to each of the leakage electric and magnetic fields by using IC-stripline method. From the results, it is confirmed that the leakage from the apertures or slots on the top of shield can is dominated by magnetic field, whereas the leakage from the seam on the side of shield can is mostly caused by electric field.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2004.05a
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• pp.419-423
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• 2004

This paper shows a new concept of digital power meter based on the optical sensing technique. The digital power meter with isolate IC so called Photocoupler is designed and implemented. The system composed of power and analong interface circuits, micro-controller and LCD display circuits. The most errors in power meter happen on measurement and calculation process for load voltages and currents. The suggested method on this paper is to use no noise sensor and PIC microprocessor. The results of simple test for power meter prototype are showed a nearly similar date to commercial product.