• The Journal of Asian Finance, Economics and Business
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• v.8 no.1
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• pp.135-144
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• 2021

This study investigates the impact of gender diversity on the board of directors on corporate intellectual capital (IC) disclosure in Indonesia. For the study purpose, the sample was divided into two sections, i.e., companies with large capitalizations and companies with small capitalizations. A paired T-test was used to observe significant changes in the disclosure level between period and type of firm. Using linear regression analysis, the influence of gender diversity and other variables on IC disclosure was examined. The findings show that IC disclosure varies for large and small companies. The level of IC disclosure in large companies was stronger than in small companies. The results of the multivariate analysis showed that the profitability, leverage, ownership, and type of business of the company significantly affect IC disclosure. For companies with large capitalization, the presence of women directors on corporate boards or gender diversity on corporate boards does not impact IC disclosure. This is because the Indonesia Stock Exchange (IDX) does not insist on IC disclosure. However, for small companies, the existence of gender diversity has a significant effect on IC disclosure. The findings of this study suggest that policymakers and standard makers must consider the inclusion of IC disclosure on the annual report as mandatory.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.35-41
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• 2011

Recently, board level solder joint reliability performance of IC packages during drop impact becomes a great concern to semiconductor and electronic product manufacturers. The handheld electronic products are prone to being dropped during their useful service life because of their size and weight. The IC packages are susceptible to solder joint failures, induced by a combination of printed circuit board (PCB) bending and mechanical shock during impact. The board level drop testing is an effective method to characterize the solder joint reliability performance of miniature handheld products. In this paper, applying the JEDEC (JESD22-B111) standard present a finite element modeling of the FBGA. The simulation results revealed that maximum stress was located at the outermost solder ball in the PCB or IC package side, which consisted well with the location of crack initiation observed in the failure analysis after drop reliability tests.

• The monthly packaging world
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• s.164
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• pp.84-93
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• 2006

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1236-1239
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• 2009

Each LCD TFT panel requires a power supply IC on the panel board. The IC provides the power rails for the timing controller, source and gated driver IC and others. The industry trend moves towards higher integrated devices. The challenge for the panel manufacturer is the development and implementation of such an IC in cooperation with the semiconductor supplier. If not done carefully the solution will not reduce the overall solution cost or can't provide the expected performance and reliability. This paper discusses the key considerations to successfully develop and integrate a highly integrated LCD bias IC into the system.

• Proceedings of the Korea Contents Association Conference
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• 2006.11a
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• pp.512-515
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• 2006

This paper proposes the solution of compatibility problem between heterogeneous by converting automatically CAD data into proper data for the PCB board production process by using IC item information. This paper has a purpose of maximizing work efficiency with NC Programming automation and contributing to maximize productivity by NC program conversion of different Mounters and Mounter Data & Line Balance optimization.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.3
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• pp.1-7
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• 1999

A single RF transceiver evaluation board have been developed for the purpose of application to the 900MHz band transceiver contained RF-IC chip And environment test was evaluated. The RF-IC chipset includes LNA(Low Noise Amplifier), down-conversion mixer, AGC(Automatic Gain Controller), switched capacitor filter and down sampling mixer. The RF evaluation board for the testing of chipset contained various external matching circuits, filters such as RF/IF SAW(Surface Acoustic Wave) filter and duplexer and power supply circuits. With the range of 2.7~3.3V the operated chip revealed moderate power consumption of 42mA. The chip was well operated at the receiving frequency of 925~960MHz. Measurement result is similar to general RF receiving specification of the 900MHz digital mobile phone.

• Proceedings of the KIEE Conference
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• 2001.11c
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• pp.209-211
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• 2001

The core in developing the transformer-operated 3 phase solid state meter is to design a single chip IC, that incorporates all the necessary features required for development of the 3 phase solid state meter. Using this technology, the solid state meter can be mass produced at lower cost and higher quality. This report deals with the performance of the prototype FPGA board, which is the final step before actual IC fabrication in fabrication LAB. All the features of FPGA board, shown in this report will be included in the final ASIC IC product.

• ETRI Journal
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• v.38 no.4
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• pp.645-653
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• 2016

This paper demonstrates the performance of a metal-substrate power module with multiple fabricated chips for a high current electrical application, and evaluates the proposed module using a 1.5-kW sinusoidal brushless direct current (BLDC) motor. Specifically, the power module has a hybrid structure employing a single-layer heat-sink extensible metal board (Al board). A fabricated motor driver IC and trench gate DMOSFET (TDMOSFET) are implemented on the Al board, and the proper heat-sink size was designed under the operating conditions. The fabricated motor driver IC mainly operates as a speed controller under various load conditions, and as a multi-phase gate driver using an N-ch silicon MOSFET high-side drive scheme. A fabricated power TDMOSFET is also included in the fabricated power module for three-phase inverter operation. Using this proposed module, a BLDC motor is operated and evaluated under various pulse load tests, and our module is compared with a commercial MOSFET module in terms of the system efficiency and input current.

• Journal of IKEEE
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• v.25 no.2
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• pp.315-321
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• 2021

In this paper, we have developed the multiple channel measurement system for IC Socket Test. The one can test the current-voltage measurements for pitting the several device specification, which analyze the thin current from several ㎂ to 5A with very low resistor mΩ. The increasement of the IC socket channel with lead pitch under 0.25 mm be need to perform several functions, concurrently. The system to perform these functions be designed to integrate several SMU(source measure unit) on board. So, we can reduce the 2 minutes test time per channel point to 40 sec, with daisy chain test method. Using by graphic interface, I-V curve mode and data logging technologies, we can implement the test flow methods and can make economies the time and cost.

• Proceedings of the Korean Society of Computer Information Conference
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• 2020.07a
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• pp.327-328
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• 2020

본 논문에서는 저전력 저비용 임베디드 환경에서 PCB 검사 기법을 제안한다. 특히, IC 미삽에 대한 검출 알고리즘을 제안하고 실험한다. 고사양의 컴퓨팅 시스템에서는 CNN과 같은 딥러닝 뉴럴 네트워크를 사용하여 특별한 알고리즘을 고려하지 않아도 대규모의 데이터를 입력함으로써 모델을 완성하고 이를 통해 PCB 검사를 수행할 수 있다. 그러나 데이터의 양이 충분하지 않거나 충분한 전력과 비용을 투입하지 못하는 임베디드 환경에서는 각 부품에 따른 컴퓨터 비전 알고리즘이 필요하다. IC의 경우 타부품에 비하여 형태가 직사각으로 정형화 되있으며 색상도 균일한 특징을 가지고 있기에 미삽에 대한 검출이 가능하다. 베어보드(Bare Board)의 색상과 IC 부품의 색상이 확연히 다를 경우에는 RGB 픽셀을 카운트 하는 히스토그램 카운팅 알고리즘만으로 검출이 가능하다. 베어보드의 색삭과 IC의 색상이 유사할 경우에는 베어보드의 핀 혹은 홀의 형태를 감지하여 검출이 가능하다. 본 논문에서는 베어보드의 색상와 IC의 색상이 같을 경우에 다를 경우를 나누어 미삽 검사를 수행하고 그 정확도를 확인한다.