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Electronics and Telecommunications Research Institute (한국전자통신연구원)
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High-Performance Metal-Substrate Power Module for Electrical Applications

  • Kim, Jongdae (ICT Materials & Components Research Laboratory, ETRI) ;
  • Oh, Jimin (ICT Materials & Components Research Laboratory, ETRI) ;
  • Yang, Yilsuk (ICT Materials & Components Research Laboratory, ETRI)
  • Received : 2016.04.22
  • Accepted : 2016.05.30
  • Published : 2016.08.01
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Abstract

This paper demonstrates the performance of a metal-substrate power module with multiple fabricated chips for a high current electrical application, and evaluates the proposed module using a 1.5-kW sinusoidal brushless direct current (BLDC) motor. Specifically, the power module has a hybrid structure employing a single-layer heat-sink extensible metal board (Al board). A fabricated motor driver IC and trench gate DMOSFET (TDMOSFET) are implemented on the Al board, and the proper heat-sink size was designed under the operating conditions. The fabricated motor driver IC mainly operates as a speed controller under various load conditions, and as a multi-phase gate driver using an N-ch silicon MOSFET high-side drive scheme. A fabricated power TDMOSFET is also included in the fabricated power module for three-phase inverter operation. Using this proposed module, a BLDC motor is operated and evaluated under various pulse load tests, and our module is compared with a commercial MOSFET module in terms of the system efficiency and input current.

Keywords

References

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