• Title/Summary/Keyword: I-pin

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An I/O Interface Circuit Using CTR Code to Reduce Number of I/O Pins (CTR 코드를 사용한 I/O 핀 수를 감소 시킬 수 있는 인터페이스 회로)

  • Kim, Jun-Bae;Kwon, Oh-Kyong
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.36D no.1
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    • pp.47-56
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    • 1999
  • As the density of logic gates of VLSI chips has rapidly increased, more number of I/O pins has been required. This results in bigger package size and higher packager cost. The package cost is higher than the cost of bare chips for high I/O count VLSI chips. As the density of logic gates increases, the reduction method of the number of I/O pins for a given complexity of logic gates is required. In this paper, we propose the novel I/O interface circuit using CTR (Constant-Transition-Rate) code to reduce 50% of the number of I/O pins. The rising and falling edges of the symbol pulse of CTR codes contain 2-bit digital data, respectively. Since each symbol of the proposed CTR codes contains 4-bit digital data, the symbol rate can be reduced by the factor of 2 compared with the conventional I/O interface circuit. Also, the simultaneous switching noise(SSN) can be reduced because the transition rate is constant and the transition point of the symbols is widely distributed. The channel encoder is implemented only logic circuits and the circuit of the channel decoder is designed using the over-sampling method. The proper operation of the designed I/O interface circuit was verified using. HSPICE simulation with 0.6 m CMOS SPICE parameters. The simulation results indicate that the data transmission rate of the proposed circuit using 0.6 m CMOS technology is more than 200 Mbps/pin. We implemented the proposed circuit using Altera's FPGA and confimed the operation with the data transfer rate of 22.5 Mbps/pin.

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Stress mode proposal for an efficient ESD test (효율적인 ESD(ElectroStatic Discharge) test를 위한 Stress mode 제안)

  • Gang, Ji-Ung;Chang, Seog-Weon;Kwack, Kae-Dal
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.1289-1294
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    • 2008
  • Electrostatic discharge(ESD) phenomenon is a serious reliability concern. It causes approximately most of all field failures of IC. To quality the ESD immunity of IC product, there are some test methods and standards developed. ESD events have been classified into 3 models, which are HBM, MM and CDM. All the test methods are designed to evaluate the ESD immunity of IC products. This study provides an overview among ESD test methods on ICs and an efficient ESD stress method. We have estimated on all pin combination about the positive and negative ESD stress. We make out the weakest stress mode. This mode called a worst-case mode. We proposed that positive supply voltage pin and I/O pin combination is efficient because it is a worst-case mode.

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A 6 Gbps/pin Low-Power Half-Duplex Active Cross-Coupled LVDS Transceiver with Switched Termination

  • Kim, Su-A;Kong, Bai-Sun;Lee, Chil-Gee;Kim, Chang-Hyun;Jun, Young-Hyun
    • ETRI Journal
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    • v.30 no.4
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    • pp.612-614
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    • 2008
  • A novel linear switched termination active cross-coupled low-voltage differential signaling (LVDS) transceiver operating at 1.5 GHz clock frequency is presented. On the transmitter side, an active cross-coupled linear output driver and a switched termination scheme are applied to achieve high speed with low current. On the receiver side, a shared pre-amplifier scheme is employed to reduce power consumption. The proposed LVDS transceiver implemented in an 80 nm CMOS process is successfully demonstrated to provide a data rate of 6 Gbps/pin, an output data window of 147 ps peak-to-peak, and a data swing of 196 mV. The power consumption is measured to be 4.2 mW/pin at 1.2 V.

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A STUDY OF THE CRAZING OF TOOTH STRUCTURE ASSOCIATED WITH PLACEMENT OF PINS (Pin장착시(裝着時)에 치질귀열(齒質龜裂)에 미치는 영향(影響)에 관(關)한 연구(硏究))

  • Na, Young-Min;Choi, Ho-Young;Min, Byung-Soon;Park, Sang-Jin
    • Restorative Dentistry and Endodontics
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    • v.11 no.1
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    • pp.33-41
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    • 1985
  • The purpose of this study was to determine the extent of tooth structure crazing when pinhole were drilled in dentin at various distances from the dentionenamel junction, and when pins were inserted by hand wrench and Auto-klutch handpiece. Sixty freshly extracted teeth were embedded in blocks of cold-curing acrylic resin to a level 1mm apical to the cementoenamel junction, the crown of the teeth were removed to a level 1.5mm coronal to the cementoenamel junction. After being sectioned, the cut surface of the teeth were smoothed, and they were divided into 4 groups. Group I : 4 pinholes were drilled with self-threading Minim spiral drill and pins were inserted with hand wrench in fifteen teeth. Group II : 4 pinholes were drilled with self-threading Minim spiral drill and pins were inserted with Auto-klutch handpiece in fifteen teeth. Group III : 4 pinholes were drilled with self-threading Regular spiral drill and pins were inserted with hand wrench in fifteen teeth. Group IV : 4 pinholes were drilled with self-threading Regular spiral drill and pins were inserted with Auto-klutch handpiece in fifteen teeth. The cut surface were then examined microscopically for the presence or absence of craze line. The results were as follows: 1. The self-threading Minim pin groups (Group I & II) produced less craze lines than did the self-threading Regular pin groups (Group III & IV). 2. In the self-threading Minim pin groups, there was more craze lines with hand wrench (Group I) than with Auto-klutch handpiece (Group 11). 3. In the self-threading Regular pin groups, there was more craze lines with hand wrench (Group III) than with Auto-klutch handpiece (Group IV). 4. Placement of the pinhole at 0.0mm from the dentionenamel junction produced more craze lines than placed at 0.5mm, 1.0mm (p<0.05), however there was no statistically significant between the 0.5mm and 1.0mm distance.

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The Internal Finishing Characteristics of Non-ferromagnetic Pipe Polished by Magnetic Abrasive Machining(III) (자기연마법에 의한 비자성 파이브 내면의 연마특성(III))

  • Park, W. K.;Rho, T. W.;Seo, Y. I.;Choi, H.;lee, J. C.;Cheong, S. H.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1997.10a
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    • pp.915-918
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    • 1997
  • An internal finishing process by the application of magnetic abrasive machining has been developed as a new technology to obtain a fine inner surface of pipe. In this paper, an abrasive circulation system was designed and manufactured. As a result, it was found that a fine inner surface abrasive of pipe was available by the use of this machining methods. The basic machining characteristics of pin-type magnetic tools were analyzed experimentally. In addition, the experimental results show that we can realize that pin-type magnetic tools have more machining efficiency than iron particles as magnetic tools.

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A Case of Esophageal Foreign Body Complicated by Pneumothorax (기흉을 초래한 식도이물)

  • 박상열;최진택;김광현;박찬일
    • Proceedings of the KOR-BRONCHOESO Conference
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    • 1982.05a
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    • pp.7.2-7
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    • 1982
  • Foreign body in the esophagus is not uncommom in the otolaryngological field, but esophageal perforation followed by pneumothrax due to esophageal foreign body is very rare. Authors recently experienced such a case developed in 1 year old male baby. This baby had been treated at local clinic for 2 weeks prior to admission under the impression of U.R.I.. Thereafter foreign body in the esophagus (fine wire pin) with left pneumothorax was detected by chest X-ray and the body was transfered to our hospital. Closed chest tube was inserted on left and under the general anesthesia, foreign body was removed by esophagoscopy. He was discharged on 16th postoperative day uneventfully.

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Preparation of Thermal Bonding Fabric by using-low-melting-point Bicomponent Filament Yarn - Head tie - (저융점 복합사를 이용한 열융착 직물의 제조(I) - 헤드타이를 중심으로 -)

  • Ji, Myeong-Kyo;Lee, Shin-Hee
    • Fashion & Textile Research Journal
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    • v.11 no.3
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    • pp.474-480
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    • 2009
  • The purpose of this study is to prepare the hardness of polyester(PET) fabric by thermal bonding with low melting component of bicomponent fiber and to describe the change of physical properties of thermal bonded PET fabrics. The PET fabrics were prepared with regular PET fiber as warp and bicomponent fiber as weft. The bicomponent fiber of sheath-core type were composed with a regular PET core and low melting PET sheath. The thermal bonding of PET fabric was carried out in pin tenter from 120 to $195^{\circ}C$ temperature range for 60 seconds. In this study, we investigated the physical properties and melting behavior of PET fiber and the effect of the temperature of the pin tenter on the thermal bonding, mechanical properties. Melting peak of warp showed the thermal behavior of general PET fiber. However, melting peak of weft fiber(bicomponent fiber) showed the double melting peak. The thermal bonding of the PET fabric formed at about temperature of lower melting peak. The optimum thermal bonding conditions for PET fabrics was applied at $190{\sim}195^{\circ}C$ for 60seconds by pin tenter. On the other hand, the tensile strength of the PET fabric decreased with an increasing temperature of thermal bonding.

Behaviour and design of structural steel pins

  • Bridge, R.Q.;Sukkar, T.;Hayward, I.G.;van Ommen, M.
    • Steel and Composite Structures
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    • v.1 no.1
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    • pp.97-110
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    • 2001
  • Architectural steel structures with visible tension and compression members are becoming more prevalent as a popular form of construction that reflects the nature of the resistance to the applied loads. These members require the use of structural steel pins at their ends to ensure either axial tension or axial compression in the members. Structural pins have been used as a means of connection for centuries and it would appear that their behaviour is relatively well understood. However, the rules for the design of pins vary quite considerably from code to code and this has caused some confusion amongst consulting structural engineers operating internationally. To provide some insight into this problem, a comprehensive testing program has been carried to examine the influence of parameters such as pin diameter, material properties of the pin, thickness of the loading plates, material properties of the loading plates and the distance of the pin to the edge of the loading plates. The modes of failure have been carefully examined. Based on this study, modifications to current design procedures are proposed that properly take into account the different possible modes of failure.

Evaluation of the reutilization of used nuclear fuel in a PWR core without reprocessing

  • Zafar, Zafar Iqbal;Park, Yun Seo;Kim, Myung Hyun
    • Nuclear Engineering and Technology
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    • v.51 no.2
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    • pp.345-355
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    • 2019
  • Use of the reconstructed fuel assemblies from partially burnt nuclear fuel pins is analyzed. This reutilization option is a potential candidate technique to make better use of the nuclear resources. Standard two step method is used to calculate node i.e. fuel assembly average burnup and then pin by pin ${\eta}$ values are reconstructed to ascertain the residual reactivity in the used fuel pins. Fuel pins with ${\eta}$ > 1:0 are used to reconstruct to-be-reused fuel assemblies. These reconstructed fuel assemblies are burnt during the cycle 3, 4, 5 and 6 of a 1000 MW PWR core by replacing fresh, once burnt and twice burnt fuel assemblies of the reference core configurations. It is concluded that using reconstructed fuel assemblies for the fresh fuel affect dearly on the cycle length (>50 EFPD) when more than 16 fresh fuel assemblies are replaced. However, this loss is less than 20 days if the number of fresh fuel assemblies is less than eight. For the case of replacing twice burned fuel, cycle length could be increased slightly (10 days or so) provided burnt fuel pins from other reactors were also available. Reactor safety parameters, like axial off set (< ${\pm}10%$), Doppler temperature coefficient (<0), moderator temperature coefficient at HFP (<0) are always satisfied. Though, 2D and 3D pin peaking factors are satisfied (<1:55) and (<2:52) respectively, for the cases using eight or less reconstructed fuel assemblies only.