• 한국전기전자재료학회논문지
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• 제11권12호
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• pp.1070-1078
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• 1998

A density of phonon is increased by application of electric field. At this time the phonon which has higher energy than around is called hot phonon is disappeared after 7 picosecond by scattering with electron and loss energy. Since the lifetime of phonon is very short, the effects of hot phonon can be neglected in the low speed semiconductor device, but it must be considered in high speed devices. DC and AC electric fields are applied to bulk GaAs, and the density of phonon is obtained and analyzed for its effects on electron velocity and electron distribution using Monte Carlo simulation method. Under high electric filed the density of hot phonon increased and energy of hot phonon is decreased by scattering with electron on the other hand the energy of electron is increased. Therefore electron move from central valley of conduntion band to satellite vallies and the valocity of electron decrease since the mass of electron in satellite vally is heavier than central vally. In millimeter wave frequencies, the effects of hot phonon increased at higher frequencies.

• 대한기계학회논문집B
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• 제33권10호
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• pp.820-826
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• 2009

The anisotropic phonon conductions with varying Joule heating rate of the silicon film in Silicon-on-Insulator devices are examined using the electron-phonon interaction model. It is found that the phonon heat transfer rate at each boundary of Si-layer has a strong dependence on the heating power rate. And the phonon flow decreases when the temperature gradient has a sharp change within extremely short length scales such as phonon mean free path. Thus the heat generated in the hot spot region is removed primarily by heat conduction through Si-layer at the higher Joule heating level and the phonon nonlocality is mainly attributed to lower group velocity phonons as remarkably dissimilar to the case of electrons in laser heated plasmas. To validate these observations the modified phonon nonlocal model considering complete phonon dispersion relations is introduced as a correct form of the conventional theory. We also reveal that the relation between the phonon heat deposition time from the hot spot region and the relaxation time in Si-layer can be used to estimate the intrinsic thermal resistance in the parallel heat flow direction as Joule heating level varies.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2005년도 춘계학술발표대회 및 제8회 신소재 심포지엄 논문개요집
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• pp.35-35
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• 2005

• 한국정보전자통신기술학회논문지
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• 제11권2호
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• pp.189-194
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• 2018

현재 대부분의 집적회로는 bulk CMOS 기술을 사용해서 제작되고 있으나 전력 소모를 낮추고 die 크기를 줄이기에는 한계점에 도달해있다. 이러한 어려움을 획기적으로 극복할 수 있는 초저전력 기술로서 SOI CMOS 기술이 최근에 크게 각광을 받고 있다. 본 논문에서는 100 nm Thin SOI 기판 위에 제작된 n-채널 MOSFET 소자들의 열전자 효과들의 온도 의존성에 관한 연구 결과들이 논의되었다. 소자들이 LDD 구조를 갖고 있음에도 불구하고 열전자 효과들이 예상보다 더 심각한 것으로 나타났는데, 이는 채널과 기판 접지 사이의 직렬 저항이 크기 때문인 것으로 믿어졌다. 온도가 높을수록 채널에서의 phonon scattering의 증가와 함께 열전자 효과는 감소하였는데, 이는 phonon scattering의 증가는 결과적으로 열전자의 생성을 감소시켰기 때문인 것으로 판단된다.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 1999년도 추계종합학술대회
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• pp.552-554
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• 1999

포논산란과 임팩트이온화 모델은 풀밴드 모델과 페르미 황금법칙을 이용한 고에너지 영역에서 hot carrier 전송을 해석하기 위해서 제시되어 왔다. 본 연구에서는 77K와 300k에서 실제에너지 밴드 구조를 이용한 Si의 임팩트이온화 과정에 대해서 온도 의존성을 조사했다. 풀밴드 모델은 local form factors을 이용한 의사포텐셜방법에서 얻어지고, 산란율 계산에 이용된다. 정확한 임팩트이온화율 계산은 파동벡터와 주파수에 의존하는 유전함수를 필요로 한다. 포논 산란율은 상태밀도에 선형적으로 의존하기 때문에 포논산란율과 상태밀도의 비에 대한 선형함수 유도에 의해서 구해진다 임팩트이온화율 $P_{ii}$ 는 first principle's theory로부터 계산되어지고, 수정된 Keldysh 공식에 의해서 최적화되었다.

• Journal of Ceramic Processing Research
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• 제20권6호
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• pp.582-588
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• 2019

FeVSb1-xTex (0.02 ≤ x ≤ 0.10) half-Heusler alloys were fabricated by mechanical alloying process and subsequent vacuum hot pressing. Near single half-Heusler phases are formed in vacuum hot pressed samples but a second phase of FeSb2 couldn't be avoided. After doping, the lattice thermal conductivity in the system was shown to decrease with increasing Te concentration and with increasing temperature. The lowest thermal conductivity was achieved for FeVSb0.94Te0.06 sample at about 657 K. This considerable reduction of thermal conductivities is attributed to the increased phonon scattering enhanced by defect structure, which is formed by doping of Te at Sb site. The phonon scattering might also increase at grain boundaries due to the formation of fine grain structure. The Seebeck coefficient increased considerably as well, consequently optimizing the thermoelectric figure of merit to a peak value of ~0.24 for FeVSb0.94Te0.06. Thermoelectric properties of various Te concentrations were investigated in the temperature range of around 300~973 K.

• 대한전자공학회논문지SD
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• 제41권11호
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• pp.7-13
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• 2004

두께가 약 3 nm 인 게이트 산화막을 갖는 P 및 NMOSFET를 제조하여 높은 압력 (5 atm.)의 중수소 및 수소 분위기에서 후속 열처리를 각각 행하여 중수소 효과(동위원소 효과)를 관찰하였다. 소자에 대한 스트레스는 -2.5V ≤ V/sub g/ ≤-4.0V 범위에서 100℃의 온도를 유지하며 진행되었다. 낮은 스트레스 전압에서는 실리콘 계면에 존재하는 정공에 의하여 게이트 산화막의 열화가 진행되었다. 그러나 스트레스 전압을 증가시킴으로써 높은 에너지를 갖는 전자에 의한 계면 결함 생성이 열화의 직접적인 원인이 됨을 알 수 있었다. 본 실험조건에서는 실리콘 계면에서 phonon 산란이 많이 발생하여 impact ionization에 의한 "hot" 정공의 생성은 무시할 수 있었다. 중수소 열처리를 행함으로써 수소 열처리에 비해 소자의 파라미터 변화가 적었으며, 게이트 산화막의 누설전류도 억제됨이 확인되었다. 이러한 결과로부터 impact ionization이 발생되지 않을 정도의 낮은 스트레스 전압동안 발생하는 게이트 산화막내 결함 생성은 수소 결합과 직접적인 관계가 있음을 확인하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1996년도 춘계학술대회 논문집
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• pp.51-54
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• 1996

This paper reports the studies of the inversion layer mobility in p-channel Si MOSFET's under hot-carrier degradated condition. The validity of relationship of hot carrier degradations between the surface effective mobility and field effect mobility and are examined. The effective mobility(${\mu}$$\_$eff/) is derived from the channel conductances, while the field-effect mobility(${\mu}$$\_$FE/) is obtained from the transconductance. The characteristics of mobility curves can be divided into the 3 parts of curves. It was reported that the mobility degradation is due to phonon scattering, coulombic scattering and surface roughness. We are measured the mobility slope in curves with DC-stress [V$\_$g/=-3.1v]. It was found that the mobility(${\mu}$$\_$eff/ and ${\mu}$$\_$FE/) of p-MOSFET's was increased by increasing stress time and decreasing channel length. Because of the increasing stress time and increasing V$\_$g/ is changed oxide reliability and increased vertical field.

• 대한전자공학회논문지
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• 제27권4호
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• pp.534-540
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• 1990

In this paper the characteristics of submicron gate GaAs MESFET's have been studied using a particle model which takes into account the hot-electron transport phenomena, i.e., the velocity overshoot. \ulcornervalley(<000> direction), L valley (<111>direction), X valley (<100>direction) as the GaAs conduction energy band and optical phonon, acoustic phonon, equivalent intervalley, nonequivalent intervalley scattering as the scattering models, have been considered in this simulation. And the GaAs material and the device simulation have been done by determination of the free flight time, scattering mechanism and scattering angle according to Monte-Carlo algorithm which makes use of a particle model. As a result of the particle simulation, firstly the electron distribution, the potential energy distribution and the situation of electron displacement in 0.6 \ulcorner gate length device have been obtained. Secondly, the cutoff frequency, obtained by this method, is k47GHz which is in good agreement with the calculated result of theory. And the current-voltage characteristics curve which takes account of the buffer layer effect has been obtained. Lastly it has been verified that parasitic current at the buffer layer can be analyzed using channel depth modulation.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1989년도 추계학술대회 논문집 학회본부
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• pp.131-135
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• 1989

Hot electron simulation of silicon using Monte Carlo method was carried out to investigate impact ionization characteristics near the drain of MOSFET's at 77 and 300K. We successfully characterized drift velocity and impact ionization at 77 and 300K employing a simplified energy band structure and phonon scattering mechanisms. Woods' soft energy threshold model was introduced to the Monte Carlo simulation of impact ionization, and good agreement with reported experimental results was resulted by employing threshold energy of 1.7 eV. It is suggested that the choice of the critical angle between specular reflection and diffusive scattering of surface roughness scattering may be important in determining the impact ionization charateristics of Monte Carlo simulation near the drain of MOSFET's.