• Journal of the Semiconductor & Display Technology
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• v.11 no.1
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• pp.13-19
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• 2012

Thermal performance of an impinging cooling module for 150 W class high power LEDs have been investigated numerically and experimentally. Parametric studies were performed to compare the effect of several design parameters such as nozzle number, nozzle spacing, coolant flow rate, and impinging distance. The experiments were also carried out in order to validate the numerical results and the comparison between the experimental and numerical results showed good agreement. It is found that the overall thermal resistance of impinging cooling module strongly depends on the nozzle number, nozzle spacing, flow rate, and impinging distance. This results showed the optimized operating condition when number of nozzles is 25, nozzles spacing is 4mm, flow rate is 2.70 lpm, distance between nozzles and impinging surface is 2 mm.

• Proceedings of the KIEE Conference
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• 2005.10b
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• pp.508-510
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• 2005

In this paper, we have studied for the current control method with high accuracy for the high power LED driver that is necessary to the lighting system using LEDs. The control performance of LED driver can be improved with the adjustment of current control boundary by introducing D/A converters for setting high-offset and low-offset. And microprocessor (ATmega128) and D/A converter with 8 bits resolution are used in the proposed driver so that LED's illumination can be remotely controlled by serial communication on the spot or by key input. In the results of performance tests, we confirmed that the proposed control method is superior to the conventional control method using op-amps.

• Transactions on Electrical and Electronic Materials
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• v.11 no.5
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• pp.238-241
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• 2010

The purpose of this study is to solve the problems of radio frequency bandwidth frequency depletion, confusion possibilities, and security that are in current wireless communications systems, and to confirm the possibility of applying those solutions for the next generation network. To solve the problems of the current wireless communications system, a visible light communications system for power line communication (PLC) via 8-bit microcontroller is created and the capacity is analyzed. The exclusive PLC chip APLC-485MA, an 8-bit ATmega16 microcontroller, high brightness 5pi light emitting diodes (LEDs), and the LLS08-A1 visible light-receiving sensor were used for the transmitter and receiver. The performance was analyzed using a designed program and an oscilloscope. The voltage change was measured as a function of distance from 10-50 cm. Blue LEDs showed the best performance among the measured LED types, with 0.47 V of voltage loss, but for a distance over 50 cm, precise data was not easy to obtain due to the weak light. To overcome these types of problems, specific values such as the changing conditions and efficiency value relevant to the light emitting parts and the visible light-receiving sensor should be calculated, and continuous study and improvements should also be realized for better communication conditions.

• The Transactions of the Korean Institute of Power Electronics
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• v.15 no.2
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• pp.111-118
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• 2010

Recently, LCD TV using LED backlight has a great attention due to its low power consumption, slim construction, mercury free, wide color gamut and fast response. For the uniform brightness of the LCD panel, multi channel LEDs and DC/DC converter for each LED are required in conventional system. Therefore energy conversion efficiency is poor, the system size bulky and the cost of production high. To overcome these above mentioned drawbacks, a new current-balancing multi-channel LED driver is proposed in this paper. It can not only drive multi-channel LEDs with one DC/DC converter but also provide all LEDs with constant balanced current. To confirm the validity of the proposed driver, its operation and performance are verified on a prototype for 46" LCD TV.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.1
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• pp.329-332
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• 2012

LEDs are using widely in a field of illumination, LCD LED backlight, mobile signals because they have several merits, such as low power consumption, long lifetime, high brightness, fast response, environment friendly. To achieve high performance LEDs, one needs to enhance output power, reduce operation voltage, and improve device reliability. In this paper, we have proposed that the optimum design and specialized process could improve the performance of LED chip. It was showed an output power of 7cd and input supplied voltage of 3.2V by the insertion technique of current blocking layer. In this paper, GaN-based LED chip which is built on the sapphire epi-wafer by selective MOCVD were designed and developed. After that, their performances were measured. It showed the output power of 7cd more than conventional GaN-based chip. It will be used the lighting source of a medical equipment and LCD LED TV with GaN-based LED chip.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.11a
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• pp.274-277
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• 1996

This paper describes the realization of the full-color to the degree of nearest white light by compounding high brightness Red, Green and Blue LEDs with appropriate proportional index. Once these three colors; red, green and blue are mixed, they are genearlly additive mixing and produce white light color contrasted to negative mixing. The luminous efficiency is defined as the product of the efficiency(lm/w), which indicates the degree of perceptual response by the human eye to unit energy(W) of light emitted by an active display devises and as the conversion efficiency of the device from electric power consumed to optical energy produced. We will deduce the each number of LEDs theoretically and design several shapes of LED displays for the full-color. Finally theoretical predictions will be compared with the measured data with different type of display designs.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.25 no.6
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• pp.9-17
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• 2011

The high-power LED (Light Emitting Diode) which is recently gaining popularity as a digital light source has such advantages as low power consumption, long life, fast switching speed, and high efficiency. Thus, many efforts are being made to use the high-power LEDs for general lighting. This paper proposes LED driving circuit uses a DC/DC converter that can recover energy to compensate for the current variations caused by changes in LED equivalent resistance following a temperature change instead of serial resistance. The maximum input voltage of this DC/DC converter has low voltage variations by temperature change when the rated current is formed. In order to return current to the input side, we need a high boosting at low power. Thus, to improve the low efficiency of power converter, the power converter can be configured in such a way to gather the powers of low-capacity DC/DC converters and return the total power. Experiments showed that the proposed system improved efficiency compared to the conventional LED drive using the existing DC/DC converter.

• Journal of Power Electronics
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• v.15 no.2
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• pp.319-326
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• 2015

In this paper, a cost-effective single switch multi-channel LED (light emitting diode) driver is proposed. While conventional LED drivers require as many non-isolated DC/DC converters as the number of LED channels, the proposed LED driver needs only one power switch and several balancing capacitors instead of expensive non-isolated DC/DC converters. Therefore, the proposed driver features a simpler structure, with a lower cost and a higher efficiency. Because its power switch can be turned off under the zero current switching condition, it has very desirable advantages such as improved electromagnetic interference characteristics and high efficiency. Moreover, it uses only a small number of DC blocking capacitors with no additional active devices for the current balancing of multi-channel LEDs. As a result, the proposed driver exhibits high reliability and is cost effective. To confirm the validity of the proposed driver, a theoretical analysis is performed, and design considerations and experimental results obtained from a prototype that is applicable to a 46" LED-TV are presented.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.244.1-244.1
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• 2013

The p-type GaN which act as a hole injection layer in GaN-based LEDs has fundamental problems. The first one arises from the difficulty in growing a highly doped p-GaN (with a carrier concentration exceeding ~1018 $cm^{-3}$). And the second one is the absence of appropriate metals or conducting oxides having a work function that is larger than that of p-type GaN (7.5 eV). Moreover, the LED efficiency is decreases gradually as the injection current increases (the so-called 'efficiency droop' phenomenon). The efficiency droop phenomenon in InGaN quantum wells (QWs) has been a large obstacle that has hindered high-efficiency operation at high current density. In this study, we introduce the new approaches to improve the light-output power of LEDs by using graphene oxide sheets. Graphene oxide has many functional groups such as the oxygen epoxide, the hydroxyl, and the carboxyl groups. Due to nature of such functional groups, graphene oxide possess a lot of hole carriers. If graphene oxide combine with LED top surface, graphene oxide may supply hole carriers to p-type GaN layer which has relatively low free carrier concentration less than electron concentration in n-type GaN layer. To prove the enhancement factor of graphene oxide coated LEDs, we have investigated electrical and optical properties by using ultra-violet photo-excited spectroscopy, confocal scanning electroluminescence microscopy.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.4
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• pp.355-360
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• 2014

Recently, the use of LED is increasing. This paper presents the new package process of thermal compression bonding using metal layered LED chip for the high power LED device. Effective thermal dissipation, which is required in the high power LED device, is achieved by eutectic/flip chip bonding method using metal bond layer on a LED chip. In this study, the process condition for the LED eutectic die bonder system is proposed by using the analysis program, and some experimental results are compared with those obtained using a DST (Die Shear Tester) to illustrate the reliability of the proposed process condition. The cause of bonding failures in the proposed process is also investigated experimentally.