• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.7
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• pp.559-562
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• 2009

Due to the enormous progress achieved in light emitting diodes (LEDs) LEDs have been become a good solution for lightings. In LED driver for lighting applications, it is required high input voltage to drive more LEDs. Therefore, high-voltage should be changed to low-voltage to supply power for drive IC. In this paper, LED drive IC using voltage clamp bias circuit, it use a hysteretic-buck converter topology was proposed and verified through experiments.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.04b
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• pp.85-87
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• 2009

Due to the enormous progress in light emitting diodes (LEDs), LEDs have been become a good solution for lightings. In LED driver for lighting applications, it is required a high input voltage to drive more LEDs. Therefore, a high-voltage should be changed to low-voltage to supply power for drive IC. In this paper, a LED drive IC with hysteretic-buck converter topology using a voltage clamp bias circuit was proposed and verified through simulations.

• Journal of the Optical Society of Korea
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• v.16 no.3
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• pp.292-298
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• 2012

The epitaxial layer structures for blue InGaN light emitting diodes have been optimized for high brightness applications with the output power levels exceeding 1000 $W/cm^2$ by using a self-consistent finite element method. The light-current-voltage relationship has been directly estimated from the multiband Hamiltonian for wurtzite crystals. To analyze the efficiency droop at high injection levels, the major nonradiative recombination processes and carrier spillover have also been taken into account. The wall-plug efficiency at high injection levels up to several thousand $A/cm^2$ has been successfully evaluated for various epilayer structures facilitating optimization of the epitaxial structures for desired output power levels.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1642-1645
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• 2007

The brightness of LED changes according to the current flowing through LEDs. The current mirror was used to drive LEDs effectively. The reference current of the current mirror was usually controlled by the resistor but the size of this resistor is very large and this resistor consumes too much power for high power LED backlight driving. The reference current of the current mirror LED driver was controlled by using flyback converter at small size with low power consumption in this paper. The concept of active current source was presented.

• Tribology and Lubricants
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• v.38 no.3
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• pp.93-100
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• 2022

Micro-light emitting diode (micro-LED) displays offer numerous advantages such as high brightness, fast response, and low power consumption. Hence, they are spotlighted as the next-generation display. However, defective LEDs may be created due to non-uniform contact loads or LED alignment errors. Therefore, a repair process involving the replacement of defective LEDs with favorable ones is necessitated. The general repair process involves the removal of defective micro-LEDs, interconnection material transfer, as well as new micro-LED transfer and bonding. However, micro-LEDs are difficult to repair since their size decreases to a few tens of micron in width and less than 10 ㎛ in thickness. The conventional nozzle-type dispenser for fluxes and the conventional vacuum chuck for LEDs are not applicable to the micro-LED repair process. In this study, transfer conditions are determined using a micro stamp for repairing micro-LEDs. Results show that the aging time should be set to within 60 min, based on measuring the aging time of the flux. Additionally, the micro-LEDs are subjected to a compression test, and the result shows that they should be transferred under 18.4 MPa. Finally, the I-V curves of micro-LEDs processed by the laser and hot plate reflows are measured to compare the electrical properties of the micro-LEDs based on the reflow methods. It was confirmed that the micro-LEDs processed by the laser reflow show similar electrical performance with that processed by the hot plate reflow. The results can provide guidance for the repair of micro-LEDs using micro stamps.

• Proceedings of the KIPE Conference
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• 2007.07a
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• pp.244-246
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• 2007

The LCD backlight technique using light-emitting diode(LED) has been studied in the recent backlight market. The white light is need for LCD backlight and it is generally implemented by combining the RGB-LEDs to obtain the high brightness. However, RGB-LEDs have different color characteristics for the current and temperature variations, which results in the color shift problem. The color shift characteristics of RGB-LEDs for the current and temperature variations are investigated in this paper. This result can be used to control the color of backlight system using RGB-LEDs.

• Korean Journal of Materials Research
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• v.23 no.3
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• pp.177-182
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• 2013

Nanosphere lithography is an inexpensive, simple, high-throughput nanofabrication process. NSL can be done in different ways, such as drop coating, spin coating or by means of tilted evaporation. Nitride-based light-emitting diodes (LEDs) are applied in different places, such as liquid crystal displays and traffic signals. The characteristics of gallium nitride (GaN)-based LEDs can be enhanced by fabricating nanopatterns on the top surface of the LEDs. In this work, we created differently sized (420, 320 and 140 nm) nanopatterns on the upper surfaces of GaN-based LEDs using a modified nanosphere lithography technique. This technique is quite different from conventional NSL. The characterization of the patterned GaN-based LEDs revealed a dependence on the size of the holes in the pattern created on the LED surface. The depths of the patterns were 80 nm as confirmed by AFM. Both the photoluminescence and electroluminescence intensities of the patterned LEDs were found to increase with an increase in the size of holes in the pattern. The light output power of the 420-nm hole-patterned LED was 1.16 times higher than that of a conventional LED. Moreover, the current-voltage characteristics were improved with the fabrication of differently sized patterns over the LED surface using the proposed nanosphere lithography method.

• International Journal of Internet, Broadcasting and Communication
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• v.7 no.2
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• pp.161-167
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• 2015

The performance of high power LEDs highly depends on the junction temperature. Operating at high junction temperature causes elevation of the overall thermal resistance which causes degradation of light intensity and lifetime. Thus, appropriate thermal management is critical for LED packaging. The main goal of this research is to improve thermal resistance by optimizing and comparing nano-pore silicon-based thermal substrate to insulated metal substrate and direct bonded copper thermal substrate. The thermal resistance of the packages are evaluated using computation fluid dynamic approach for 1 W single chip LED module.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2010.10a
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• pp.139-140
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• 2010

This paper presents an indoor prototype for wireless digital signal transmission using Visible Light Communications (VLC) in which high power Light Emitting Diode (LED) is used. Using low cost and off-the-shelf components, the transmitter module is constructed using an AVR Atmega128 microcontroller and commercial white beam LEDs. Modulating the light intensity of the LED enables digital signals to be transmitted across the optical link. The receiver module employs a high speed PIN photodetector for optical signal detection and a recovery circuit for optical-electro signal conversion. By sending digitalized data via VLC technology, many applications can be realized in the areas of consumer advertising, traffic safety information and disaster control.

• Transactions on Electrical and Electronic Materials
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• v.13 no.2
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• pp.73-77
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• 2012

Operation of liquid crystal displays (LCDs) can be improved by monolithic integration of the pixel transistors with light emitting diodes (LEDs) on a single substrate. Conventional LCDs make use of filters to control the backlighting which reduces the overall efficiency. These LCDs also utilize LEDs in series which impose failure and they require high voltage for operation with a power factor correction. The screen of small hand-held devices can operate from moderate brightness. Therefore, III-V nanowires that are grown along with transistors over Silicon substrates can be utilized. Control of nanowire LEDs with nanowire transistors will significantly lower the cost, increase the efficiency, improve the manufacturing yield and simplify the structure of the small displays that are used in portable devices. The steps to grow nanowires on Silicon substrates are described. The vertical n-type and p-type nanowire transistors with surrounding gate structures are characterized. While biased at 0.5 V, nanowire transistors with minimum radius or channel width have an OFF current which is less than 1pA, an ON current more than 1 ${\mu}A$, a total delay less than 10 ps and a transconductance gain of more than 10 ${\mu}A/V$. The low power and fast switching characteristics of the nanowire transistor make them an ideal choice for the realization of future displays of portable devices with long battery lifetime.