• 한국태양에너지학회:학술대회논문집
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• 2008.11a
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• pp.220-225
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• 2008

Cylindrical stainless-steel/sodium heat pipe for a high-temperature solar thermal application was manufactured and tested for transient and steady-state operations. Two layers of stainless-steel screen mesh wick was inserted as a capillary structure. The outer diameter of the heat pipe was 12.7 mm and the total length was 250 mm. The effective heat transport length, the thermal load, and the operating temperature were varied as thermal transport conditions of the heat pipe. The thermal load was supplied by an electric furnace up to 1kW and the cooling was performed by forced convection of air The effective thermal conductivity and the thermal resistance were investigated as a function of heat flux, heat transport length, and vapor temperature. Typical range of the total effective thermal conductivity was as low as 43,500 W/m K for heat flux of 176.4 kW/$m^2$ and of operating temperature of 1000 K.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.201-201
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• 2012

Using materials with high thermal conductivity is a matter of great concern in the field of thermal management. In this study, we present our experimental results on an important physical property of carbon nanotube (CNT) films, two-dimensional thermal conductivity obtained by using an optical method based on Raman spectroscopy. We prepared four kinds of CNT films to investigate the effect of CNT type on heat spreading performance of films. This first comparative study using the optical method shows that the arc-discharge single-walled carbon nanotubes yield the best heat spreading film. And we observed thermal conductivity values of CNT films with various transmittances and found that the Raman method works as long as the sample is a transparent film. This study provides useful information on characterization of thermal conduction in transparent CNT films and could be an important step toward high-performance carbon-based heat spreading films.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.922-923
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• 2006

Thermal management is one of the critical aspects in the design of highly integrated microelectronic devices. The reliability of electronic components is limited not only to operating temperature but also by the thermal stresses caused during the operation. The need for higher power densities calls for use of advanced heat spreader materials. A copper diamond composite has been developed with high thermal conductivity $(\lambda)$ and tailorable coefficient of thermal expansion (CTE). Copper diamond composites are processed via gas pressure assisted infiltration with different copper alloys. Emphasis has been placed on the addition of trace elements in deisgning the copper alloys to facilitate a compromise between thermal conductivity and mechanical adhesion. The interfaces between the alloy and the diamond are related to the thermal properties of these copper composites.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.12
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• pp.2202-2207
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• 2007

The present article investigates experimentally and theoretically thermal and optical characteristics of thin film structures through measurement of thermal conductivity of Pyrex 7740 and reflectance in silicon thin film. The $3{\omega}$ method is used to measure thermal conductivity of very thin film with high accuracy and the optical characteristics in thin films are studied to examine the influence of incidence angle of light on reflectance by using the CTM(Characteristics Transmission Method) and the 633 nm He-Ne laser reflectance measurement system. It is found that the estimated reflectance of silicon show good agreement with experimental data. In particular, the present study solves the EPRT(Equation of Phonon Radiative Transport) which is based on Boltzmann transport equation for predicting thermal conductivity of nanoscale film structures. From the results, the measured thermal conductivity is in good agreement with the previous published data. Moreover, thermal conductivities are estimated for different film thickness. It indicates that as film thickness decreases, thermal conductivity decreases substantially due to internal scattering.

• Proceedings of the Korea Concrete Institute Conference
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• 1997.04a
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• pp.676-681
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• 1997

The purpose of this study is to evaluate the thermal Conductivity and Foolr Impact Sound of Polyurethane Concretes. The Polyurethane Concretes are prepared with various resin content, Fine and Coarse aggregates content, and its thickness, and tested for the Thermal Conductivity and Impact Sound. From the test results. the sound insulation grade of polyurethane concretes by the floor impact sound test on high frequency band is L-60, and its effect is considerable Polyurethane concretes have high degree of solidity compared with other heat shield materials, and its thermal conductivity is 0.05kcal/$mh^{\cire}C$. And it is suitable for sound proof floor materials.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.28 no.8 s.227
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• pp.968-975
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• 2004

Nanofluids have anomalously high thermal conductivities at very low fraction, strongly temperature-dependent and size-dependent conductivities, and three-fold higher critical heat flux than that of base fluids. Traditional conductivity theories such as the Maxwell or other macroscale approaches cannot explain why nanofluids have these intriguing features. So in this paper, we devise a theoretical model that accounts for the fundamental role of dynamic nanoparticles in nanofluids. The proposed model not only captures the concentration and temperature-dependent conductivity, but also predicts strongly size-dependent conductivity. Furthermore, we physically explain the new phenomena for nanofluids. In addition, based on a proposed model, the effects of various parameters such as the ratio of thermal conductivity of nanofluids to that of a base fluid, volume fraction, nanoparticle size, and temperature on the thermal conductivities of nanofluids are investigated.

• Transactions on Electrical and Electronic Materials
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• v.5 no.4
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• pp.129-132
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• 2004

The electrothermal characteristics of a high voltage LIGBT(Lateral Insulated Gate Bipolar Transistor) using thin silicon on insulator (SOI) and silicon on sapphire (SOS) such as thermal conductivity and sink is analyzed by MEDICI. The device simulations demonstrate that the thermal conductivity of the buried oxide is an important parameter for modeling of the thermal behavior of SOI devices. In this paper we simulated the thermal conductivity and temperature distribution of a SOI LIGBT with an insulator layer of SiO$_2$ and $Al_2$O$_3$ at before and after latch-up and verified that the SOI LIGBT with the $Al_2$O$_3$ insulator had good thermal conductivity and reliability.

• Journal of the Korea Furniture Society
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• v.22 no.2
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• pp.118-125
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• 2011

These days global warming is the most important problem and the most important factor is high emission of carbon dioxide. The 23% of carbon dioxide emission for building construction must be reduced. Thermal conductivity is the most basic factor that can decrease the energy consumption especially insulation. Therefore, an accurate and continuous thermal conductivity measurement can be a way to save energy. In this paper, there are methods about how to investigate thermal conductivity measurements and comparing two methods which are the Heat Flow Meter 436 and TCi.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.8
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• pp.711-717
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• 2000

Effect of alloying element additions to Ag on thermal conductivity electrical conductivity and mechanical properties of sheath materials for BSCCO tapes has been characterized. The thermal conductivity at low temperature range(10~300K) of Ag alloys were evaluated by both direct and indirect measurement techniques and compared with each other. It was observed that thermal conductivity decreased with increasing the content of alloying elements such as Au, Pd and Mg. Thermal conductivity of pure Ag at 30 K was measured to be 994.0 W/m.K on the other hand the corresponding values of A $g_{0.9995}$/M $g_{0.0005}$, A $g_{0.974}$/A $u_{0.025}$/M $g_{0.001}$, A $g_{0.973}$/Au.0.025//M $g_{0.002}$, and A $g_{0.92}$/P $d_{0.06}$/M $g_{0.02}$ were 342.6, 62.1, 59.2, 28.9 W/m.K respectively indicating 3 to 30 times lower than that of pure Ag. In addition alloying element additions to Ag improved mechanical strength while reduced elongation probably due to the strengthening mechanisms by the presence of additive atoms.s.