• 대한기계학회논문집B
• /
• 제27권8호
• /
• pp.1165-1173
• /
• 2003

The effects of (1) phonon dispersion on thermal conductivity model and (2) differentiation of group velocity and phase velocity are examined for germanium. The results show drastic change of thermal conductivity regardless of the same relaxation time model. Also the contribution of transverse acoustic (TA) phonon and longitudinal acoustic (LA) phonon on the thermal conductivity at high temperatures is reassessed by considering more rigorous dispersion model. Holland model, which is commonly used for modeling thermal conductivity, underestimates the scattering rate for TA phonon at high frequency. This leads the conclusion that TA is dominant heat transfer mode at high temperatures. But according to the rigorous consideration of phonon dispersion, the reduction of thermal conductivity is much larger than the estimation of Holland model, thus the TA at high frequency is expected to be no more dominant heat transfer mode. Another heat transfer mechanism may exist at high temperatures. Two possible explanations we the roles of (1) Umklapp scattering of LA phonon at high frequency and (2) optical phonon.

• 한국세라믹학회지
• /
• 제49권4호
• /
• pp.380-384
• /
• 2012

This paper deals with the recent developments of high thermal conductivity silicon nitride ceramics. First, the factors that reduce the thermal conductivity of silicon nitride are clarified and the potential approaches to realize high thermal conductivity are described. Then, the recent achievements on the silicon nitride fabricated through the reaction bonding and post sintering technique are presented. Because of a smaller amount of impurity oxygen, the obtained thermal conductivity is substantially higher, compared to that of the conventional gas-pressure sintered silicon nitride, while the microstructures and bending strengths are similar to each other between these two samples. Moreover, further improvement of the thermal conductivity is possible by increasing ${\beta}/{\alpha}$ phase ratio of the nitrided sample, resulting in a very high thermal conductivity of 177 W/($m{\cdot}K$) as well as a high fracture toughness of 11.2 $MPa{\cdot}m^{1/2}$.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2003년도 춘계학술대회
• /
• pp.1627-1632
• /
• 2003

The effect of (1) phonon dispersion in thermal conductivity model and (2) the differentiation of group velocity and phase velocity for Ge is examined. The results show drastic change of thermal conductivity regardless of using same relaxation time model. Also the contribution of transverse acoustic (TA) phonon and longitudinal acoustic (LA) phonon is changed by considering more rigorous dispersion model. Holland model underestimates the scattering rate for high frequency TA, so misleading conclusion, i.e. TA is dominant heat transfer mode at high temperature. But the actual reduction of thermal conductivity is much larger than the estimation by Holland model and high frequency TA is no more dominant heat transfer mode. Another heat transfer mechanism may exist for high temperature. Two possible explanations are (1) high frequency LA by Umklapp scattering and (2) optical phonon.

• 방사성폐기물학회지
• /
• 제19권3호
• /
• pp.331-338
• /
• 2021

Extensive studies have been conducted on thermal conductivity of bentonite buffer materials, as it affects the safety performance of barriers engineered to contain high-level radioactive waste. Bentonite is composed of several minerals, and studies have shown that the difference in the thermal conductivity of bentonites is due to the variation in their mineral composition. However, the specific reasons contributing to the difference, especially with regard to the thermal conductivity of bentonites with similar mineral composition, have not been elucidated. Therefore, in this study, bentonites with significantly different thermal conductivities, but of similar mineral compositions, are investigated. Most bentonites contain more than 60% of montmorillonite. Therefore, it is believed that the exchangeable cations of montmorillonite could affect the thermal conductivity of bentonites. The effect of bentonite type was comparatively analyzed and was verified through the effective medium model for thermal conductivity. Our results show that Ca-type bentonites have a higher thermal conductivity than Na-type bentonites.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2005년도 창립60주년 기념 추계 학술대회
• /
• pp.27.1-27.1
• /
• 2005

• Structural Engineering and Mechanics
• /
• 제53권4호
• /
• pp.645-659
• /
• 2015

This research investigates the thermoelastic transient behavior of a thermally loaded slab made of a thermal diode-like material which has two directional thermal conductivity values (low and high). Finite difference analysis is used to obtain the elastic response of the slab based on the temperature solutions. It is found that the rate of heat transfer through the thickness of the slab decreases with reducing the ratio between the low and high thermal conductivity values (R). In addition, reducing R makes the slab less responsive to the thermal load when heated from the direction associated with the low thermal conductivity value.

• 한국초전도ㆍ저온공학회논문지
• /
• 제13권2호
• /
• pp.29-32
• /
• 2011

The thermal properties of insulation material are essential to develop a high-temperature superconducting (HTS) power cable to be operated at around liquid nitrogen temperature. Unlike metallic materials, nonmetallic materials have a high thermal resistance; therefore special attention needs to be paid to estimate heat flow correctly. Thus, we have developed a precise instrument for measuring the thermal conductivity of insulating materials over a temperature range from 40 K to near room temperature using a cryocooler. Firstly, the measurement of thermal conductivity for Teflon is carried out for accuracy confirmation. For a supplied heat flux, the temperature difference between warm and cold side is measured in steady state, from which the thermal conductivity of Teflon is calculated and compared with published result of NIST. In addition, the apparent thermal conductivity of Polypropylene laminated paper (PPLP) is presented and its temperature dependency is discussed.

• 센서학회지
• /
• 제23권4호
• /
• pp.234-237
• /
• 2014

In this paper, a copper foil-thick grapheme (thin graphite sheet)-copper foil structure is reported to achieve mechanically strong and high thermal conductive layer suitable for heat spreading components. Since graphene provides much higher thermal conductivity than copper, thick graphene embedded copper layer can achieve higher effective thermal conductivity which is proportional to graphene/copper thickness ratio. Since copper is nonreactive with carbon material which is graphene, chromium is used as adhesion layer to achieve copper-thick graphene-copper bonding for graphene embedded copper layer. Both sides of thick graphene were coated with chromium as an adhesion layer followed by copper by sputtering. The copper foil was bonded to sputtered copper layer on thick graphene. Angstrom's method was used to measure the thermal conductivity of fabricated copper-thick graphene-copper structure. The thermal conductivity of the copper-thick graphene-copper structures is measured as $686W/m{\cdot}K$ which is 1.6 times higher than thermal conductivity of pure copper.

• 한국정밀공학회지
• /
• 제30권9호
• /
• pp.943-950
• /
• 2013

This paper describes the thermal contact resistance and its effect on the performance of thermal interface material. An ASTM D 5470 based apparatus is used to measure the thermal interface resistance. Bulk thermal conductivity of different interface material is measured and compared with manufacturers' data. Also, the effect of grease void in the contact surface is investigated using the same apparatus. The flat type thermal interface tester is proposed and compared with conventional one to consider the effect of lateral heat flow. The results show that bulk thermal conductivity alone is not the basis to select the interface material because high bulk thermal conductivity interface material can have high thermal contact resistance, and that the center voiding affects the thermal interface resistance seriously. On the aspect of heat flow direction, thermal impedance of the lateral heat flow shows higher than that of the longitudinal heat flow by sixteen percent.

• Journal of Electrochemical Science and Technology
• /
• 제11권2호
• /
• pp.132-139
• /
• 2020

Solid oxide fuel cells (SOFCs) are among one of the promising technologies for efficient and clean energy. SOFCs offer several advantages over other types of fuel cells under relatively high temperatures (600℃ to 800℃). However, the thermal behavior of SOFC stacks at high operating temperatures is a serious issue in SOFC development because it can be associated with detrimental thermal stresses on the life span of the stacks. The thermal behavior of SOFC stacks can be influenced by operating or material properties. Therefore, this work aims to investigate the effects of the thermal conductivity of each component (anode, cathode, and electrolyte) on the thermal behavior of samarium-doped ceria-based SOFCs at intermediate temperatures. Computational fluid dynamics is used to simulate SOFC operation at 600℃. The temperature distributions and gradients of a single cell at 0.7 V under different thermal conductivity values are analyzed and discussed to determine their relationship. Simulations reveal that the influence of thermal conductivity is more remarkable for the anode and electrolyte than for the cathode. Increasing the thermal conductivity of the anode by 50% results in a 23% drop in the maximum thermal gradients. The results for the electrolyte are subtle, with a ~67% reduction in thermal conductivity that only results in an 8% reduction in the maximum temperature gradient. The effect of thermal conductivity on temperature gradient is important because it can be used to predict thermal stress generation.