• Laser Solutions
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• v.11 no.2
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• pp.33-38
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• 2008

Laser micromachining has increasingly been adopted in various advanced industries where the high-precision machining of large-area, high-density and multi-layered components is in a strong demand. To effectively meet the requirements, the laser micromachining process must be carefully monitored. In order to facilitate the development of a new laser micromachining process and/or a new system, we have fabricated a UV laser micromachining platform that is equipped with optical modules for monitoring the process online. They include a laser power stabilizing module, a module for laser-induced breakdown spectroscopy, and an auto-focusing module.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2004.05a
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• pp.154-158
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• 2004

Power inductor is usually used in the field of the power circuit of a cellular phone, TFT LCD module etc.. This paper presents the development process of Power Inductor Full Automation Winding/Welding System for TFT LCD. This process, the process algorithm, high precision welding current control, design of welding head, high speed, high precision feeding mechanism, and user interface process control program technologies are included.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.27 no.5C
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• pp.522-529
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• 2002

MMIC circuits in whole receiver system was fabricated based on GaAs pHEMT technology. And a V-band downconverter module was fabricated by integrating these circuits. The downconverter module consists of a LO drive power amplifier which generates 24dBm output power, a low noise amplifier(LNA) which shows 20 dB small signal gain, an active parallel feedback oscillator which generates 1.6 dBm output power, and a cascode mixer which shows over 6dB conversion gain. The good conversion gain performance of our mixer made no need to attach any IF amplifier which grows conversion gain. Measured results of the complete downconverter show a conversion gain of over 20 dB between 57.5 GHz and 61.7GHz without IF amplifier.

• The Transactions of the Korean Institute of Electrical Engineers D
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• v.51 no.5
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• pp.175-181
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• 2002

In this paper, fault tolerant digital governor is designed to realize ceaseless controlling and to improve the reliability of control system. Designed digital governor huts duplex I/O module and triplex CPU module and also 2 out of 3 voting algorithm and self diagnostic ability. The Processor module of the system(SIDG-3000) is developed based on 32 Bit industrial microprocessor, which guaranteed high quality of the module and SRAM for data also SRAM for command are separated. The process module also includes inter process communication function and power back up function (SRAM for back-up). System reliability is estimated by using the model of Markov process. It is shown that the reliability of triplex system in mission time can be dramatically improved compared with a single control system Designed digital governor system is applied after modelling of the steam turbine generator system of Buk-Cheju Thermal Power Plant. Simulation is carried out to prove the effectiveness of the designed digital governor system

• Proceedings of the KIEE Conference
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• 2003.11c
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• pp.844-847
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• 2003

Display devices are becoming increasingly important as an interface between humans and machines in the growing information society. In display devices, PDP (Plasma Display Panel) has many advantages in that it has wide screen, wide viewing angle and is light weight, thin. In PDP driving method, if the brightness of input image is high, applying the fixed sustain pulse to the PDP panel will raise the PDP power consumption and may damages the PDP panel. To overcome these problems, the Plasma AI driving method was introduced by the Matshushita co. in Japan. The Plasma AI driving module calculates the peak value and average value of 1 frame image and adjusts the gradation and sustain pulses for 1 frame sustain. In this paper, the proposed PDP driving module is based on the Plasma AI driving module. The proposed driving module calculates peak value and average value, and the brightness distribution of 1 frame image. Using brightness distribution, the proposed driving module divides 1 frame input image into 15 image patterns. For each image pattern, minimum sustain pulses and sub-frames are used for the brightness of 1 frame image and the sustain weight for 64, 128, 192 gradation is proposed. Therefore, the sustain power consumption can be reduced.

• Current Photovoltaic Research
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• v.7 no.3
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• pp.65-70
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• 2019

As a demand of higher power photovoltaic modules, shingled, multi-busbar, half-cell, and bifacial techniques are developed. Multi-busbar module has advantage for large amount of light havesting. And, half-cell is high power module for reducing resistive losses and higher shade tolerance. Recently, researches on multi-busbar is focused on reliability according to adhesion and intermetallic compound between Sn-Pb solder and Ag electrode. And half-cell module is researched to comparing with full-sized cell module for structure difference. In this study, we investigated the factors affecting to efficiency and adhesion of multi-wires half-cell module according to wire thickness, solder thickness, and flux. The results of solar simulator and peel test was that peel strength and efficiency of soldered cell is not related. But samples with flux including high solid material showed high efficiency. The results of FE-SEM and EDX line scan on cross-section between wire and Ag electrode for different flux showed thickness of solder joint between wire and Ag electrode is increasing through solid material increasing. Flux including high solid material would affect to solder behavior on Ag electrode. Higher solid material occurred lower growth of IMC layer because solder permeate to sider of wire ribbon than Ag electrode. And it increased fill factor for high efficiency. In soldering process, amount of solid material in flux and solder thickness are the factor related with characteristic of soldered photovoltaic cell.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.13-21
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• 2014

Technology for high power devices has made impressive progress in increasing the current density of power semiconductor, system module, and design optimization, which realize high power systems with heterogeneous functional integration. Depending on the performance development of high power semiconductor, packaging technology of high power device is urgently required for efficiency improvement of the device. Power device packaging must provide superior thermal management due to high operating temperature of power modules. Here we, therefore, review critical challenges of typical power electronics packaging today including core assembly processes, component materials, and reliability evaluation regulations.

• Journal of Power Electronics
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• v.13 no.2
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• pp.296-303
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• 2013

This paper proposes a high efficiency three-phase cascaded phase shifted H-bridge multi-level inverter without DC/DC converters for grid-tied multi string photovoltaic (PV) applications. The cascaded H-bridge topology is suitable for PV applications since each PV module can act as a separate DC source for each cascaded H-bridge module. The proposed phase shifted H-bridge multi-level topology offers advantages such as operation at a lower switching frequency and a lower current ripple when compared to conventional two level topologies. It is also shown that low ripple sinusoidal current waveforms are generated with a unity power factor. The control algorithm permits the independent control of each DC link voltage with a maximum power point for each string of PV modules. The use of the controller area network (CAN) communication protocol for H-bridge multi-level inverters, along with localized PWM generation and PV voltage regulation are implemented. It is also shown that the expansion and modularization capabilities of the H-bridge modules are improved since the individual inverter modules operate more independently. The proposed topology is implemented for a three phase 240kW multi-level PV power conditioning system (PCS) which has 40kW H-bridge modules. The experimental results show that the proposed topology has good performance.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.5
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• pp.334-339
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• 2012

A study on electrical and electronic equipment will occur in the atmosphere, which is essential to cut the power to prevent the waste of power by power measurement technology development and to develop the technology to do this operation is the main core of standby power to detect and block it and return the configured for software and hardware, while the actual construction to ensure stability through field testing and debugging of problems improved accordingly, as well as ease of installation and so it could be done while the test. In addition, in terms of basic hardware switching of standby power when blocking, reducing stress and ensure stable operation and circuit design, power off and back to ensure stable operation even when a protection circuit is applied.

• Journal of Drive and Control
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• v.12 no.4
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• pp.83-86
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• 2015