• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.27-34
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• 2017

Recently, a demand in sustainable green technologies is requiring the lead free bonding for high power module packaging due to the environmental pollution. The Transient-liquid phase (TLP) bonding can be a good alternative to a high Pb-bearing soldering. Basically, TLP bonding is known as the combination of soldering and diffusion bonding. Since the low melting temperature material is fully consumed after TLP bonding, the remelting temperature of joint layer becomes higher than the operating temperature of the power module. Also, TLP bonding is cost-effective process than metal nanopaste bonding such as Ag. In this paper, various TLP bonding techniques for power semiconductor were described.

• Journal of Power Electronics
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• v.16 no.6
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• pp.2119-2128
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• 2016

Due to detection and control errors, some high-frequency harmonics with voltage-source characteristics cause circulating currents in modular inverters. Moreover, the circulating currents are usually affected by the output filters (OF) of each module due to their filter and resonance properties. The interaction among the circulating currents in the modules increase the power loss and reduce system stability and control precision. Therefore, this paper reports the results of a study on the SPWM high-frequency harmonics circulating currents for a double-module VSI. In the paper, an analysis of the circulating-current circuits is briefly described. Next, a mathematic model of the single-module output voltage based on the carrier frequency of SPWM is built. On this basis, through mathematic modeling of high-frequency harmonic circulating currents, the formation mechanism and distribution characteristics of circular currents and their influences are studied in detail. Finally, the influences of the OF on the circulating currents are studied by mainly taking an LC-type filter as an example. A theoretical analysis and experimental results demonstrate some important characteristics. First, the carrier phase shifting of the SPWM for each module is the major cause of the SPWM harmonic circulating currents, and the circulating currents are in an odd distribution around n-times the carrier frequency $n{\omega}_s$, where n = 1, 2, 3, ${\ldots}$. Second, the harmonic circular currents do not flow into the parallel system. Third, the OF can effectively suppress the non-circulating part of the high-frequency harmonic currents but is ineffective for the circulation part, and actually reduces system stability.

• Journal of Satellite, Information and Communications
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• v.5 no.2
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• pp.82-86
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• 2010

In this paper, a power amplifier module for WCDMA base-station applications is designed and implemented using GaN field-effect transistors (FETs), which uses an envelope tracking bias system. The designed module consists of an high gain MMIC amplifier, a driver amplifier, a power amplifier, and bias circuits for envelope tracking applications. Especially, a FET bias sequencing circuit and two isolators are integrated for stable RF operations. All circuits are assembled within a single housing, so its dimension is just $17.8{\times}9.8{\times}2.0\;cm3$. Measured results show that the developed power amplifier module has good envelope tracking capability: the power-added efficiency of 35% at the output power range from 30dBm to 40dBm over a wide range of drain bias.

• 한국태양에너지학회:학술대회논문집
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• 2008.11a
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• pp.36-41
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• 2008

In this paper, we study The Effects of PV Cell's Electrical Characteristics for PV Module Application. Photovoltaic module consists of serially connected solar cell which has low open circuit voltage and high short circuit current characteristics. The whole current flow of PV module is restricted by lowest current of one solar cell. For the experiment, we make PV module composing the solar cells that have short circuit current difference of 0%, 1%, 3% and Random. The PV module exposed about 35days, its the maximum power drop ratio was 4.282% minimum and 6.657% maximum. And PV module of low current characteristics has electrical stress from other modules. The solar cell temperature of PV module was higher compared to PV cell. To prevent early degradation, it is need to have attention to PV cell selection.

• Journal of IKEEE
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• v.17 no.4
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• pp.393-397
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• 2013

This paper introduces the T/RX combined compact active channel module which is a key unit of the active phased array antenna(APAA) system. This module is mainly compoased of two parts for TX and RX fabricated on both sides of the active module for size reduction. The TX-part is primarily composed of a 3-stage amplifier, a microstrip phase shifter, a thermal compensation and a power detection circuit. The RX-part is composed of LNAs a microstrip phase shifter and BPFs for TX power rejection. Using the proposed design structure we can realized a compact active channel module having high performance.

• Journal of electromagnetic engineering and science
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• v.16 no.4
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• pp.225-228
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• 2016

KRISS-V, a V-band millimeter-wave source module for a primary RF power standard and calibration system developed by the Korea Research Institute of Standards and Science is here presented. The output power of KRISS-V is several times higher than that of commercial amplifier/multiplier chains and is highly stable (the standard deviations of output power are less than 0.01% in the worst case). The spectral purity of KRISS-V is high enough to consider it a single-tone signal generator. We also added programmable attenuation capability to KRISS-V for remote power control. Moreover, the in-house source module is cost-effective and adaptable to various measurement schemes. The structure of the model as well as detailed component information are introduced so that it can be reproduced.

• Proceedings of the KIPE Conference
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• 2002.07a
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• pp.158-162
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• 2002

This paper presents a novel 3-phase IGBT module called the SPM (Smart Power Module). This is a new design developed to provide a very compact, low cost, high performance and reliable motor drive system. Several distinct design concepts were used to achieve the highly integrated functionality in a new cost-effective small package. An overall description to the SPM is given and actual application issues such as electrical characteristics, circuit configurations, thermal performance and power ratings are discussed

• The Transactions of the Korean Institute of Power Electronics
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• v.24 no.5
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• pp.356-364
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• 2019

In this study, major problems, such as licensing problems due to civil complaints, deterioration of facility period, and damage of modules, are exposed to many problems in domestic businesses. Particularly, the photovoltaic (PV) modules applied to early PV systems have been repaired and replaced over the past two decades, and a new module-based aging detection method is needed to expand the maintenance market and stabilize and repair power supplies. PV modules in a PV system use a string that is configured in series to generate high voltage. However, even if only one module of the solar modules connected in series ages, the power generation efficiency of the aged string is reduced. Therefore, we propose a topology that can measure the instantaneous PV characteristic curve to determine the aging module in the solar string and the aging judgment algorithm using the measured PV characteristic curve.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.12
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• pp.1142-1149
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• 2003

The strength and characteristics of the soldering interface of the power semiconductor chip in a power module has been firstly surveyed by the peel strength measurement method. A power module is combined with several power chips which generally has 30∼400$\textrm{mm}^2$ chip area to allow several tens or bigger amps in current rating, so that the traditional methods for interface characterization like shear test could not be applied to high power module. In this study power diode modules were fabricated by using lead-tin solder with 10${\times}$10$\textrm{mm}^2$ or 7${\times}$7$\textrm{mm}^2$ soldering interface. The peel strengths of soldered interfaces were measured and then the microscopic investigation on the fractured surfaces were followed. The peel test indicated that the crack propagated either through the bulk of the soft lead-tin solder which has 55-60 kgf/cm peel strength or along the interface between the solder and the plated nickel layer which has much lower 22 kgf/cm strength. This study showed that the peel test would be a useful method to quantify the solderability as well as to recognize which is the worst interface or the softest material in a power module with a large soldering area.

• Proceedings of the KIPE Conference
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• 1998.07a
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• pp.323-327
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• 1998

Under high power IGBTs Switching, a large overvoltage is induced across the IGBT module due to the stray inductance in the circuit. This paper proposes a new gate drive circuit for high power IGBTs which can actively suppress the overvoltage across the driven IGBT at turn-off while preserving the most simple and reliable power circuit. The turn-off driving scheme has adaptive feature to the amplitude of collector current, so that the overvoltage can be limited much effectively at the fault collector current. Experimental results under various normal and fault conditions prove the effectiveness of the proposed.