• 항공우주시스템공학회지
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• 제14권4호
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• pp.32-39
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• 2020

A technological review and analysis were performed on thermal cracking of aviation hydrocarbon fuels that circulate as coolants in regenerative cooling systems of hypersonic flights. Liquid hydrocarbons decompose into low-carbon-number hydrocarbons when they absorb a considerable amount of energy at extremely high temperatures, and these thermal cracking behaviors are represented by heat sink capacity, conversion ratio, reaction products, and coking propensity. These parameters are closely interrelated, and thus, they must be considered for optimum performance in terms of the overall heat absorption in the regenerative cooling system and supersonic combustion in the scramjet engine.

• 전기학회논문지
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• 제66권11호
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• pp.1600-1604
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• 2017

Mo-Cu alloys have been widely used for heat sink materials, vacuum technology, automobile and many other applications due to their excellent physical and electronic properties. Especially, Mo-Cu composites with 5~20 wt% copper are widely used for the heavy duty service contacts due to their excellent properties like low coefficient of thermal expansion, wear resistance, high temperature strength and prominent electrical and thermal conductivity. In most of the applications, high dense Mo-Cu materials with homogeneous microstructure are required for high performance, which has led in turn to attempts to prepare ultra-fine and well-dispersed Mo-Cu powders in different ways, such as spray drying and reduction process, electroless plating technique, mechanical alloying process and gelatification-reduction process. However, most of these methods were accomplished at high temperature (typically degree), resulting in undesirable growth of large Cu phases; furthermore, these methods usually require complicated experimental facilities and procedure. In this study, Mo-Cu alloying were prepared by planetary ball milling (PBM) and spark plasma sintering (SPS) and the effect of Cu with contents of 5~20 wt% on the microstructure and properties of Mo-Cu alloy has been investigated.

• 마이크로전자및패키징학회지
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• 제22권3호
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• pp.67-72
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• 2015

히트 싱크용 소재에 응용할 목적으로 단층금속과 2층금속 클래드메탈에 대해 열전도 특성에 대한 연구를 하였다. 단층시편으로는 스테인리스강과 알루미늄을 선택하였으며, 2층 금속으로는 스테인리스강과 알루미늄을 압연해서 제조한 클래드메탈을 사용하였다. 열전도도는 섬광법으로 측정한 열확산계수와 비열 및 밀도를 사용해 얻었다. 실험을 통해 얻은 측정값을 참고문헌에 보고된 자료를 사용해 얻은 계산값과 비교하였다. 단층시편의 경우, 실험을 통해 얻는 열확산계수와 열전도도는 계산값보다 작았다. 스테인리스강의 경우, 측정한 열전도도는 계산값에 비해 6% 정도 작았으며, 알루미늄의 경우 18% 정도 작았다. 반면, 2층 금속인 스테인리스강과 알루미늄의 클래드메탈은 측정한 열전도도가 계산값에 비해 55% 정도 낮게 나타났다. 섬광법으로 측정한 열전도도가 계산값보다 55% 정도 낮게 나타난 이유는 스테인리스강과 알루미늄의 사이에 존재하는 계면의 영향 때문이다. 스테인리스강과 알루미늄의 사이에 존재하는 계면은 열전도 특성을 지배하는 전자와 탄성파의 이동을 어렵게 하기 때문이다. 우수한 방열특성을 갖는 다층구조 방열모듈을 개발하기 위해서는 열전도 특성에 결정적으로 영향을 주는 계면 특성의 조절이 중요하다.

• 비파괴검사학회지
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• 제33권4호
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• pp.336-341
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• 2013

본 논문에서는 저온-진공 흑체시스템의 설계 및 구성과 함께 흑체시스템의 수학 모델을 이용한 열해석 평가 방법과 그 결과를 제시하였으며 적외선 카메라를 이용한 흑체시스템의 평가 방안 및 결과를 명시하였다. 개발된 흑체시스템은 기존의 시스템에 비해 상대적으로 규모가 소형이며 273 K이하의 저온에서 수증기가 응결될 수 있는 현상을 방지하기 위하여 흑체시스템 내부를 진공 ($2.67{\times}10^{-2}$ Pa) 상태로 유지되도록 제작되었다. 또한 흑체시스템 내부의 열손실로 인한 성능 저하를 막기 위하여 radiator가 설치되는 부위에는 heat sink, heat shield 및 cold shield를 설계하였다. 흑체시스템의 수학 모델에 대한 열 해석을 위해서 변형된 스테판-볼츠만의 정리를 이용하여 radiator의 성능을 검증하였고 실제 흑체시스템에서 방사되는 적외선 신호에 대해서는 적외선 카메라를 이용하여 신호전달함수 및 온도분해능을 측정, 분석하였다. 제안된 설계와 해석 및 실험 결과에 근거하여, 개발된 저온-진공 흑체시스템은 적용온도범위인 268~333 K 구간에서 적외선 측정장치의 캘리브레이션을 위한 기준장치로서 성능이 안정적이고 적용이 적합한 것으로 확인되었다.

• Nuclear Engineering and Technology
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• 제49권1호
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• pp.103-112
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• 2017

Application of the supercritical condition in reactor core cooling needs to be properly justified based on the extreme level of parameters involved. Therefore, a numerical study is presented to compare the thermalhydraulic performance of supercritical and single-phase natural circulation loops under low-to-intermediate power levels. Carbon dioxide and water are selected as respective working fluids, operating under an identical set of conditions. Accordingly, a three-dimensional computational model was developed, and solved with an appropriate turbulence model and equations of state. Large asymmetry in velocity and temperature profiles was observed in a single cross section due to local buoyancy effect, which is more prominent for supercritical fluids. Mass flow rate in a supercritical loop increases with power until a maximum is reached, which subsequently corresponds to a rapid deterioration in heat transfer coefficient. That can be identified as the limit of operation for such loops to avoid a high temperature, and therefore, the use of a supercritical loop is suggested only until the appearance of such maxima. Flow-induced heat transfer deterioration can be delayed by increasing system pressure or lowering sink temperature. Bulk temperature level throughout the loop with water as working fluid is higher than supercritical carbon dioxide. This is until the heat transfer deterioration, and hence the use of a single-phase loop is prescribed beyond that limit.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 3rd Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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• pp.121-145
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• 2001

Chip Size Packages (CSP) are now widely used in high speed DRAM. The major driving farce of CSP development is its superior electrical performance than that of conventional package. However, the power dissipation of high speed DRAM like DDR or RAMBUS DRAM chip reaches up to near 2W. This fact makes the thermal management methods in DRAM package be more carefully considered. In this study, the thermal performances of 3 type CSPs named $\mu-BGA$^{TM}$$ $UltraCSP^{TM}$ and OmegaCSP$^{TM}$ were measured under the JEDEC specifications and their thermal characteristics were of a simulation model utilizing CFD and FEM code. The results show that there is a good agreement between the simulation and measurement within Max. 10% of $\circledM_{ja}$. And they show the wafer level CSPs have a superior thermal performance than that of $\mu-BGA.$ Especially the analysis results show that the thermal performance of wafer level CSPs are excellent fur modulo level in real operational mode without any heat sink.

• 한국산학기술학회논문지
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• 제10권7호
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• pp.1459-1464
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• 2009

최근들어 고전력 및 고성능 전자제품 시장이 확대됨에 따라 대용량 알루미늄 히트싱크의 수요가 급증하고 있다. 이를 위해 고효율의 브레이징 히트싱크가 선호되고 있지만, 기존의 대기 연속로에서는 불충분한 가열과 모재금속의 서로 다른 두께 때문에 생산이 사실상 불가능하다. 따라서, 본 연구에서는 브레이징 히트싱크 개발을 위하여 새로운 인덱스 배치로 및 브레이징 공정을 최적화하였다. 또한, 개발된 브레이징 히트싱크에 대하여 용착효율 및 인장응력 실험도 수행하였다. 끝으로 브레이징 히트싱크와 실리콘 히트싱크의 열저항에 대한 실험을 통하여 수치해석 결과와 비교 검증하였다.

• Transactions on Electrical and Electronic Materials
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• 제15권4호
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• pp.201-206
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• 2014

LED lighting,considered to be a new growth industry, has attracted a great deal of attention due to its higher illumination and longer life time than existing light sources. In this study, high-efficiency and long-life LED fog lamps for automobiles were developed, which can substitute the existing 27 W halogen fog lamps for a used car market. For this purpose, the number of LED modules, the body, heat sink, and the output of the fog lamp were first optimized through a numerical analysis. Then, a 10 W-class LED fog lamp was prototyped based on the optimized numerical model, and the performance of the fog lamp was successfully verified through the experiments.

• 한국정밀공학회지
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• 제24권12호
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• pp.95-103
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• 2007

This paper presents a liquid cooling concept for heat rejection of high power electronic devices existing in notebook computers etc. The design, fabrication, and performance of the planar ECF pump and farced-liquid cooling system are summarized. The electro-conjugate fluid (ECF) is a kind of dielectric and functional fluids, which generates jet flows (ECF-jets) by applying static electric field through a pair of rod-like electrodes. The ECF-jet directly acts on the working fluid, so the proposed planar ECF pump needs no moving part, produces no vibration and noise. The planar ECF pump, consists of a pump housing and electrode substrate, achieves maximum flow rate and output pressure of $5.5\;cm^3/s$ and 7.2 kPa, respectively, at an applied voltage of 2.0 kV. The farced-liquid cooling system, constructed with the planar ECF pump, liquid-cooled heat sink and thermal test chip, removes input power up to 80 W keeping the chip surface temperature below $70\;^{\circ}C$. The experimental results demonstrate that the feasibility of forced-liquid cooling system using ECF is confirmed as an advanced cooling solution on the next-generation high power electronic devices.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제52권12호
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• pp.559-561
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• 2003

We report a new excimer laser annealing method which successfully results in a single grain boundary formation in the channel of polycrystalline silicon thin film transistor. The proposed method is based on lateral grain growth and employs aluminum patterns which act as selective beam mask and lateral heat sink. The maximum grain size obtained by the proposed method is about 1.6${\mu}{\textrm}{m}$ in the length. The grainboundaries should be arranged parallel with the direction of current flow for the best device performance, so we propose a new device fabrication method and a new poly-Si TFT structure. Poly-Si TFT fabricated by the proposed method exhibits considerably improved electrical characteristics, such as high field effect mobility exceeding 240 $cm^2$/Vsec.